84 Programmable Logic Devices (PLD) 597

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

XC9572-10PCG84I

Xilinx

Flash PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

72

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 69 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e3

66.7 MHz

30 s

245 °C (473 °F)

29.3116 mm

Yes

69

XC95108F-10PC84I

Xilinx

Flash PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 69 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

67 MHz

29.3116 mm

69

XC7272A-16PG84C

Xilinx

UV PLD

Commercial

Pin/Peg

84

WPGA

Square

Ceramic, Metal-Sealed Cofired

25 ns

No

5.25 V

72

CMOS

5

5 V

Grid Array, Window

PGA84M,11X11

Programmable Logic Devices

No

Macrocell

4.75 V

2.54 mm

70 °C (158 °F)

12 Dedicated Inputs, 42 I/O

12

0 °C (32 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

PAL Blocks interconnected by PIA; 72 Macrocells

55 MHz

27.94 mm

No

42

XC7272A-16WC84I

Xilinx

UV PLD

Industrial

J Bend

84

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

5.5 V

72

CMOS

5

5 V

Chip Carrier, Window

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 42 I/O

12

-40 °C (-40 °F)

Quad

S-CQCC-J84

1

4.826 mm

29.21 mm

No

PAL Blocks interconnected by PIA; 72 Macrocells

55 MHz

29.21 mm

No

42

XC7272-30PC84C

Xilinx

OT PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

48 ns

Yes

72

CMOS

5

5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

No

e0

30 s

225 °C (437 °F)

No

XC9572-7PC84

Xilinx

Flash PLD

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

5

Chip Carrier

Macrocell

1.27 mm

0 Dedicated Inputs, 69 I/O

0

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable

e0

29.3116 mm

69

XC7372-7PC84C

Xilinx

OT PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

18.5 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 37 I/O

12

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops

e0

95.2 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

37

XC95108-10PCG84I

Xilinx

Flash PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 69 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e3

30 s

245 °C (473 °F)

29.3116 mm

Yes

69

XC73108-10WC84C

Xilinx

UV PLD

Commercial

J Bend

84

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier, Window

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 37 I/O

12

0 °C (32 °F)

Quad

S-CQCC-J84

1

4.826 mm

29.21 mm

No

108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops

62.5 MHz

29.21 mm

No

37

XCR3064-10PC84C

Xilinx

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

CMOS

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

80 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

64

XC7272-25WC84C

Xilinx

UV PLD

Commercial

J Bend

84

QCCJ

Square

Ceramic

40 ns

Yes

72

CMOS

5

5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-XQCC-J84

No

No

XC95108F-10PCG84I

Xilinx

Flash PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 69 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e3

67 MHz

29.3116 mm

69

XC9572-10PCG84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e3

66.7 MHz

30 s

245 °C (473 °F)

29.3116 mm

Yes

69

XC7272A-16PG84I

Xilinx

UV PLD

Industrial

Pin/Peg

84

WPGA

Square

Ceramic, Metal-Sealed Cofired

25 ns

No

5.5 V

72

CMOS

5

5 V

Grid Array, Window

PGA84M,11X11

Programmable Logic Devices

No

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

12 Dedicated Inputs, 42 I/O

12

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

PAL Blocks interconnected by PIA; 72 Macrocells

55 MHz

27.94 mm

No

42

XC95108-7PC84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

30 s

225 °C (437 °F)

29.3116 mm

Yes

69

XC9572F-10PC84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

67 MHz

30 s

225 °C (437 °F)

29.3116 mm

Yes

69

XC7372-15PG84C

Xilinx

OT PLD

Commercial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

33 ns

No

5.25 V

72

CMOS

5

3.3/5,5 V

Grid Array

PGA84M,11X11

Programmable Logic Devices

No

Macrocell

4.75 V

2.54 mm

70 °C (158 °F)

12 Dedicated Inputs, 37 I/O

12

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops

52.6 MHz

27.94 mm

No

37

XC95108F-10PC84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

67 MHz

30 s

225 °C (437 °F)

29.3116 mm

Yes

69

XC9572F-15PC84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

56 MHz

30 s

225 °C (437 °F)

29.3116 mm

Yes

69

XC7272A-20WC84I

Xilinx

UV PLD

Industrial

J Bend

84

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

32 ns

Yes

5.5 V

72

CMOS

5

5 V

Chip Carrier, Window

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 42 I/O

12

-40 °C (-40 °F)

Quad

S-CQCC-J84

1

4.826 mm

29.21 mm

No

PAL Blocks interconnected by PIA; 72 Macrocells

50 MHz

29.21 mm

No

42

XC9572F-10PC84I

Xilinx

Flash PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 69 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

67 MHz

29.3116 mm

69

XC7272-30WC84C

Xilinx

UV PLD

Commercial

J Bend

84

QCCJ

Square

Ceramic

48 ns

Yes

72

CMOS

5

5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-XQCC-J84

No

No

XC95108F-20PC84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

50 MHz

30 s

225 °C (437 °F)

29.3116 mm

Yes

69

XC73108-12WC84C

Xilinx

UV PLD

Commercial

J Bend

84

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier, Window

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 37 I/O

12

0 °C (32 °F)

Quad

S-CQCC-J84

1

4.826 mm

29.21 mm

No

108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops

55.6 MHz

29.21 mm

No

37

XCR3128-12PC84I

Xilinx

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

3.63 V

128

CMOS

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

69 MHz

30 s

225 °C (437 °F)

29.3116 mm

Yes

64

XC7272A-20PC84C

Xilinx

OT PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

32 ns

Yes

5.25 V

72

CMOS

5

5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 42 I/O

12

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

PAL Blocks interconnected by PIA; 72 Macrocells

e0

50 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

42

XCR3064-15PC84I

Xilinx

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

64

CMOS

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

58 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

64

XC7272A-20PG84I

Xilinx

UV PLD

Industrial

Pin/Peg

84

WPGA

Square

Ceramic, Metal-Sealed Cofired

32 ns

No

5.5 V

72

CMOS

5

5 V

Grid Array, Window

PGA84M,11X11

Programmable Logic Devices

No

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

12 Dedicated Inputs, 42 I/O

12

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

PAL Blocks interconnected by PIA; 72 Macrocells

50 MHz

27.94 mm

No

42

XC7372-12WC84I

Xilinx

UV PLD

Industrial

J Bend

84

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

28 ns

Yes

5.5 V

72

CMOS

5

3.3/5,5 V

Chip Carrier, Window

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 37 I/O

12

-40 °C (-40 °F)

Quad

S-CQCC-J84

1

4.826 mm

29.21 mm

No

72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops

62.5 MHz

29.21 mm

No

37

XC9572-10PC84

Xilinx

Flash PLD

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

5

Chip Carrier

Macrocell

1.27 mm

0 Dedicated Inputs, 69 I/O

0

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable

e0

30 s

225 °C (437 °F)

29.3116 mm

69

XC7272A-16PC84I

Xilinx

OT PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.5 V

72

CMOS

5

5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 42 I/O

12

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

PAL Blocks interconnected by PIA; 72 Macrocells

e0

55 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

42

XC95108F-7PCG84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e3

83 MHz

30 s

245 °C (473 °F)

29.3116 mm

69

XC95108F-20PCG84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e3

50 MHz

30 s

245 °C (473 °F)

29.3116 mm

69

XCR5064-10PC84I

Xilinx

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

64

CMOS

5

5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

77 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

64

XC7272A-16PC84C

Xilinx

OT PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

72

CMOS

5

5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 42 I/O

12

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

PAL Blocks interconnected by PIA; 72 Macrocells

e0

55 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

42

XC73108-15PC84C

Xilinx

OT PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

36 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 37 I/O

12

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops

e0

45.5 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

37

XC95108-15PCG84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e3

30 s

245 °C (473 °F)

29.3116 mm

Yes

69

XC9572F-10PCG84I

Xilinx

Flash PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 69 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e3

67 MHz

29.3116 mm

69

XC73108-15PC84I

Xilinx

OT PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

36 ns

Yes

5.5 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 37 I/O

12

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops

e0

45.5 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

37

XC73108-12PC84I

Xilinx

OT PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

5.5 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 37 I/O

12

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops

e0

55.6 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

37

XC9572-10PCG84

Xilinx

Flash PLD

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

5

Chip Carrier

Macrocell

1.27 mm

0 Dedicated Inputs, 69 I/O

0

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable

e3

29.3116 mm

69

XC9572F-7PCG84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e3

83 MHz

30 s

245 °C (473 °F)

29.3116 mm

69

XC9572F-7PC84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

83 MHz

30 s

225 °C (437 °F)

29.3116 mm

Yes

69

XC7372-12PC84C

Xilinx

OT PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

28 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 37 I/O

12

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops

e0

62.5 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

37

XC7372-10WC84C

Xilinx

UV PLD

Commercial

J Bend

84

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

23 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Chip Carrier, Window

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 37 I/O

12

0 °C (32 °F)

Quad

S-CQCC-J84

1

4.826 mm

29.21 mm

No

72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops

71.4 MHz

29.21 mm

No

37

XCR3128-15PC84I

Xilinx

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.63 V

128

CMOS

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

59 MHz

30 s

225 °C (437 °F)

29.3116 mm

Yes

64

XCR5064-12PC84I

Xilinx

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

5.5 V

64

CMOS

5

5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

67 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

64

XC95108F-20PC84I

Xilinx

Flash PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 69 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

50 MHz

29.3116 mm

69

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.