BGA Programmable Logic Devices (PLD) 2,054

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM7064BFI100-7N

Altera

EE PLD

Ball

100

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

64

CMOS

1.8/3.3,2.5 V

Grid Array

BGA100,10X10,40

Programmable Logic Devices

Yes

1 mm

Tin Silver Copper

Bottom

S-PBGA-B100

No

e1

Yes

EPF10K70BM560-4

Altera

Loadable PLD

Military

Ball

560

BGA

Square

Plastic/Epoxy

23.8 ns

Yes

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Tin Silver Copper

Bottom

S-PBGA-B560

No

3744 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

60.6 MHz

EPM7128AFI256-10

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

87 MHz

220 °C (428 °F)

17 mm

Yes

100

EP2A70F1508C9N

Altera

Loadable PLD

Other

Ball

1508

BGA

Square

Plastic/Epoxy

2.87 ns

Yes

1.575 V

CMOS

1.5

Grid Array

Macrocell

1.425 V

1 mm

85 °C (185 °F)

1060 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1508

3.5 mm

40 mm

No

e1

40 mm

1060

EPF10K200SFC484-3N

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.8 ns

9984

Yes

2.625 V

CMOS

369

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

369 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

40 s

369

260 °C (500 °F)

23 mm

369

EPF10K50EBI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPM570M100A4N

Altera

Flash PLD

Automotive

Ball

100

BGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA100,11X11,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 76 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e1

Yes

76

EP20K100EFC324-3N

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

2.2 ns

4160

Yes

1.89 V

CMOS

238

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e1

160 MHz

30 s

238

260 °C (500 °F)

19 mm

246

EPF10K100BFC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

11 ns

4992

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

4992 Logic Elements

e0

140 MHz

191

220 °C (428 °F)

17 mm

191

EP20K100EBC672-3

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

246

EP20K1000EFI784

Altera

Loadable PLD

Ball

784

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

4 Dedicated Inputs

4

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EPM1270GF256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

212

EP20K200EFI784-1

Altera

Loadable PLD

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs

4

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EPM570M100A3N

Altera

Flash PLD

Automotive

Ball

100

BGA

Square

Plastic/Epoxy

5.4 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA100,11X11,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 76 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e1

Yes

76

EPM7128ABC100-7

Altera

EE PLD

Commercial

Ball

100

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

No

128 Macrocells

e1

166.7 MHz

84

EP20K200EBC652-3N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.33 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

45 mm

376

EPF10K200SFI484-2X

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

12 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

369 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

369

EP1M120F484C7N

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array

Mixed

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 303 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

245 °C (473 °F)

23 mm

303

EPM240GM100I5ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 80 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

80

EPF10K30EFC484-1

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

220 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

220

220 °C (428 °F)

23 mm

220

EP20K1000EFC672

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

160 MHz

27 mm

508

EP20K200FC784-3

Altera

Loadable PLD

Other

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EPF10K130EFC672-1

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.3 ns

6656

Yes

2.625 V

CMOS

413

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

413 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

20 s

413

220 °C (428 °F)

27 mm

413

EPF10K50SFC484-2N

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

254 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

40 s

260 °C (500 °F)

23 mm

254

EPF10K130EBC672-3

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

70 °C (158 °F)

4 Dedicated Inputs, 413 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

413

EPF10K130EFI484-2N

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

85 °C (185 °F)

369 I/O

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

40 s

260 °C (500 °F)

23 mm

369

EP20K200EFC672-3X

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.33 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

160 MHz

220 °C (428 °F)

27 mm

376

EPF10K30AFC484-1

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.6 ns

1728

Yes

3.6 V

CMOS

246

3.3

2.5/3.3,3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

1728 Logic Elements; 216 Labs

e0

80 MHz

20 s

246

220 °C (428 °F)

23 mm

246

EPF10K30AFI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

11 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

246

EPM7512AEBI256-10

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

512 Macrocells

e0

163.9 MHz

20 s

220 °C (428 °F)

27 mm

Yes

212

EP20K600EFC672-1

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.57 ns

24320

Yes

1.89 V

CMOS

500

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

500

220 °C (428 °F)

27 mm

508

EP20K200FC484-2V

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

8320

Yes

2.625 V

CMOS

376

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

34 MHz

376

220 °C (428 °F)

23 mm

382

EPF10K100EFC256-2N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPF10K50EFI672-1

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

8.5 ns

2880

Yes

2.7 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

254 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

254

220 °C (428 °F)

27 mm

254

EPM1270F256C3

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

6.2 ns

Yes

2.625 V

980

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e0

20 s

220 °C (428 °F)

17 mm

Yes

212

EP20K400CF672I8N

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

1.78 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 488 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

27 mm

488

EP20K100FC324-2

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

3 ns

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array

BGA324(UNSPEC)

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e0

20 s

246

220 °C (428 °F)

19 mm

252

EP20K100BI672-1

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs, 252 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

252

EPM2210F100C3ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e0

0

EPF10K100BI560-4

Altera

Loadable PLD

Industrial

Ball

560

BGA

Square

Plastic/Epoxy

23.8 ns

Yes

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B560

No

4992 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

60.6 MHz

EPM570M256A3N

Altera

Flash PLD

Automotive

Ball

256

BGA

Rectangular

Plastic/Epoxy

5.4 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EP20K160EFC484-2XN

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

1.93 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 316 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

160 MHz

40 s

260 °C (500 °F)

23 mm

316

EPF8820BM225-2

Altera

Loadable PLD

Military

Ball

225

BGA

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

1.5 mm

125 °C (257 °F)

4 Dedicated Inputs, 148 I/O

4

-55 °C (-67 °F)

Tin Silver Copper

Bottom

S-PBGA-B225

2.3 mm

27 mm

No

820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e1

27 mm

148

EP20K200EFI484-3

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

8320

Yes

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1 mm

4 Dedicated Inputs, 376 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B484

3

No

e1

368

220 °C (428 °F)

376

EPM570GF100C3

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

5.4 ns

Yes

440

CMOS

1.8,1.8/3 V

Grid Array

BGA100,10X10,40

Programmable Logic Devices

Yes

1 mm

Bottom

S-PBGA-B100

No

Yes

EPF10K100EBI672-2

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

85 °C (185 °F)

4 Dedicated Inputs, 338 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

338

EPM2210GF324A3N

Altera

Flash PLD

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 272 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

19 mm

Yes

272

EPM3256AFC256-7N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 161 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e1

17 mm

Yes

161

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.