BGA Programmable Logic Devices (PLD) 2,054

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP20K1500EBC652-2X	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.13 ns	51840	Yes	1.89 V		CMOS		480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	5A	3.5 mm	45 mm	No		e0	160 MHz	20 s	480	220 °C (428 °F)	45 mm		488
EP20K1000CB652C9N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.02 ns		Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1		40 s		245 °C (473 °F)	45 mm		488
EP20K100EFI324-1	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy		4160	Yes			CMOS		238	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell		1 mm		4 Dedicated Inputs, 246 I/O	4		Tin Lead	Bottom	S-PBGA-B324	3			No		e0			238	220 °C (428 °F)			246
EPF10K200SFI672-1X	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	9 ns		Yes	2.7 V		CMOS			2.5		Grid Array				Mixed	2.3 V	1 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		470
EPM1270GF256A4	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	8.1 ns		Yes		980	CMOS				1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	1			No		e0						Yes
EPM240M100I5ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 80 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							80
EP20K600EBC652-2X	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.25 ns	24320	Yes	1.89 V		CMOS		480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0	160 MHz	20 s	480	220 °C (428 °F)	45 mm		488
EPF10K30AFI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	17 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		246
EP20K100EFI784-1	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Lead	Bottom	S-PBGA-B784	3			No		e0				220 °C (428 °F)
EP20K200CF672I-9	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm		376
EPM2210GM100C4ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No		e0							0
EP20K1000EFC672-1	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.84 ns	38400	Yes	1.89 V		CMOS		500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	500	220 °C (428 °F)	27 mm		508
EP1M120FC484-7A	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V		CMOS			1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		303
EP1K100FC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS		186	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	37.5 MHz	20 s	186	220 °C (428 °F)	17 mm		186
EPM7256ABI256-12	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	256 Macrocells	e1	100 MHz				27 mm		164
EP20K200CF484I8	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	1.78 ns	8320	Yes	1.89 V		CMOS		368	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0			368	220 °C (428 °F)	23 mm		376
EPM7256BFC256	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5 ns		Yes			CMOS			2.5		Grid Array				Macrocell		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		164
EPF10K30ABI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	2 ns		Yes	3.6 V					3.3		Grid Array				Mixed	3 V		85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							246
EPF10K200EBC600-2N	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V		CMOS			2.5		Grid Array				Mixed	2.3 V	1.27 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm		470
EP20K200CFC672-7X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		376
EPM7064AEFC256-7	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	135.1 MHz			220 °C (428 °F)	17 mm	Yes	68
EP20K300EFC784	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EPM7192EGM883B-15	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	15 ns		Yes	2.625 V	192	CMOS	38535Q/M;38534H;883B		2.5	3.3/5,5 V	Grid Array	PGA160M,15X15	Programmable Logic Devices	No	Macrocell	2.375 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e0				220 °C (428 °F)	27 mm	No
EPF10K30AFC256-1N	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 191 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No	1728 Logic Elements; 216 Labs	e1	80 MHz				17 mm		191
EP1K30FC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS		171	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	171 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	37.5 MHz	20 s	171	220 °C (428 °F)	17 mm		171
EPM7512BFC256	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5 ns		Yes			CMOS			2.5		Grid Array				Macrocell		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		212
EPM570GF100I4	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy	7 ns		Yes		440	CMOS				1.8,1.8/3 V	Grid Array	BGA100,10X10,40	Programmable Logic Devices	Yes			1 mm						Bottom	S-PBGA-B100				No								Yes
EP20K200CFI484-8X	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm		376 I/O			Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		376
EPF10K200EFC672-1	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.4 ns	9984	Yes	2.7 V		CMOS		470	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No	9984 Logic Elements	e0	140 MHz	20 s	470	220 °C (428 °F)	27 mm		470
EPM7256AEBI256-5	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5.5 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1	172.4 MHz				27 mm		212
EP20K600EFC672-3N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.92 ns	24320	Yes	1.89 V		CMOS		500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	4	3.5 mm	27 mm	No		e1	160 MHz	30 s	500	245 °C (473 °F)	27 mm		508
EPM2210GF256C5	Altera	Flash PLD	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0		20 s		220 °C (428 °F)	17 mm	Yes	204
EP1K50FI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	8 ns	2880	Yes	2.625 V		CMOS		186	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 186 I/O	6	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	90 MHz		186	220 °C (428 °F)	17 mm		186
EPM1270M256C3N	Altera	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	6.2 ns		Yes	2.625 V	980	CMOS			2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	212
EPM240GM100I4N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy	6.1 ns		Yes	1.89 V	192	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm		0 Dedicated Inputs, 80 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1						Yes	80
EPF10K200EBI600-3	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	16 ns	9984	Yes	2.7 V		CMOS		470	2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm		470
EP20K100EBC484-2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							246
EP1K50FC256	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Registered	2.375 V	1 mm	70 °C (158 °F)	6 Dedicated Inputs, 186 I/O	6	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		186
EPM2210F100I3N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1							0
EPM1270M256A4N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	8.1 ns		Yes	2.625 V	980	CMOS			2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	212
EPF6024AFI256-2	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V		CMOS		219	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Macrocell	3 V	1 mm		4 Dedicated Inputs, 219 I/O	4		Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	153 MHz		219	220 °C (428 °F)	17 mm		219
EP20K100EBC324-1	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324				No		e1							246
EP20K100EFI196-1	Altera	Loadable PLD		Ball	196	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell				4 Dedicated Inputs, 143 I/O	4		Tin Lead	Bottom	S-PBGA-B196	3			No		e0				220 °C (428 °F)			143
EPF10K30AFC256-2N	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns	1728	Yes	3.6 V		CMOS		191	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 191 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	1728 Logic Elements; 216 Labs	e1	80 MHz	30 s	191	260 °C (500 °F)	17 mm		191
EP20K1000CF33C7N	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.49 ns		Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1		40 s		245 °C (473 °F)	33 mm		708
EPM1270M100C4N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1							0
EP20K400BC652-2	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	3.1 ns	16640	Yes	2.625 V		CMOS		496	2.5	2.5,2.5/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0		20 s	496	220 °C (428 °F)	45 mm		502
EP1K100FC256-2N	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS		186	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	37.5 MHz	30 s	186	260 °C (500 °F)	17 mm		186

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.