BGA Programmable Logic Devices (PLD) 2,054

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K100EBC672-3

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

70 °C (158 °F)

4 Dedicated Inputs, 338 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

338

EPF8820ABC225-4

Altera

Loadable PLD

Commercial

Ball

225

BGA

Square

Plastic/Epoxy

672

Yes

5.25 V

CMOS

152

5

3.3/5,5 V

Grid Array

BGA225,15X15

Field Programmable Gate Arrays

Registered

4.75 V

1.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 152 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B225

3

2.3 mm

27 mm

No

672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

357 MHz

148

220 °C (428 °F)

27 mm

152

EP20K400FC672-2X

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

3.1 ns

16640

Yes

2.625 V

CMOS

496

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

502 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

496

220 °C (428 °F)

27 mm

502

EPM7128AFC256-12

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

72.5 MHz

220 °C (428 °F)

17 mm

Yes

100

EPF10K100EFC484-2X

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

338

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

338 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

338

220 °C (428 °F)

23 mm

338

EP20K400EBC652-1N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.57 ns

16640

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e1

30 s

480

245 °C (473 °F)

45 mm

488

EPF10K100AFC484-3N

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.8 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 369 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

4992 Logic Elements; 624 Labs

e1

80 MHz

40 s

260 °C (500 °F)

23 mm

369

EPF10K30EFI484-1X

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

8 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

220 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

220

EPF10K100EFI484-1X

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

9 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

338 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

338

EP20K400BI672-1

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs, 502 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

502

EPF10K50VFC484-2N

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

40 s

260 °C (500 °F)

23 mm

EPM7064BFC256-5

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

2.625 V

64

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 68 I/O

4

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

196.1 MHz

220 °C (428 °F)

17 mm

Yes

68

EPF10K200EFC672-1N

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.4 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

9984 Logic Elements

e1

140 MHz

27 mm

470

EP20K1000EFC672-1X

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.84 ns

38400

Yes

1.89 V

CMOS

500

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

500

220 °C (428 °F)

27 mm

508

EP20K200EFC784

Altera

Loadable PLD

Other

Ball

784

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B784

No

e1

EPF10K30EBI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

85 °C (185 °F)

4 Dedicated Inputs, 220 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

220

EPF10K100BBI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

Grid Array

Mixed

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPF10K50EFC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.8 ns

2880

Yes

2.7 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

254 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

2880 Logic Elements

e0

140 MHz

20 s

254

220 °C (428 °F)

23 mm

254

EP20K1000EFC672-3X

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.32 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

160 MHz

220 °C (428 °F)

27 mm

508

EPF10K50SFC256-2N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPF10K130EBI672-2

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

85 °C (185 °F)

4 Dedicated Inputs, 413 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

413

EP20K100FI400-2

Altera

Loadable PLD

Ball

400

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs

4

Tin Silver Copper

Bottom

S-PBGA-B400

3

No

e1

220 °C (428 °F)

EPXA4F672C2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 426 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

20 s

220 °C (428 °F)

27 mm

426

EP2A40F1020C9

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

2.05 ns

38400

Yes

1.575 V

CMOS

723

1.5

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

1.425 V

1 mm

85 °C (185 °F)

735 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

723

220 °C (428 °F)

33 mm

735

EPF10K200SBC600-3

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.8 ns

9984

Yes

2.625 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

20 s

470

220 °C (428 °F)

45 mm

470

EPF10K50VFI484-4

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

21.1 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 291 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

291

EPF10K200SBC600-2N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EP20K200FC672

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

220 °C (428 °F)

27 mm

382

EP20K300EBC652-3N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

3.06 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 408 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

160 MHz

45 mm

408

EP1K100FC256-1N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

4992

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

90 MHz

30 s

186

260 °C (500 °F)

17 mm

186

EPF10K30EFC484-3X

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

220 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

220

EP2A70B724C8N

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

2.49 ns

Yes

1.575 V

CMOS

1.5

Grid Array

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

536 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e1

35 mm

536

EPF10K70BI560-5

Altera

Loadable PLD

Industrial

Ball

560

BGA

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B560

No

3744 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

53.76 MHz

EPF10K200EBC672-1

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.4 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

470

EPF10K100ABC600-2N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 406 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e1

45 mm

406

EP20K200CF484C-9N

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

2 ns

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

245 °C (473 °F)

23 mm

376

EPF10K130EFC672-3N

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

413 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

413

EP20K1000EFC33-1X

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

1.84 ns

38400

Yes

1.89 V

CMOS

700

1.8

1.8,1.8/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 708 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

20 s

700

220 °C (428 °F)

33 mm

708

EPF10K50SFI256-1X

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

8 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPM1270GF256C5

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

212

EPF10K200EBC600-2

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

20 s

470

220 °C (428 °F)

45 mm

470

EPF10K50SFI484-2X

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

85 °C (185 °F)

254 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

254

EPM2210F256A3N

Altera

Flash PLD

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

1700

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 204 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

17 mm

Yes

204

EPF10K100EBI484-2

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

85 °C (185 °F)

4 Dedicated Inputs, 338 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

338

EPM7512BBI256-5

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

2.375 V

1.27 mm

0 Dedicated Inputs, 212 I/O

0

Tin Lead

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e0

163.9 MHz

220 °C (428 °F)

27 mm

Yes

212

EP1M350F780C5

Altera

Loadable PLD

Other

Ball

780

BGA

Square

Plastic/Epoxy

14400

Yes

1.89 V

CMOS

486

1.8

1.5/3.3,1.8 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

Mixed

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 486 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e0

486

220 °C (428 °F)

29 mm

486

EPF10K50EFC672-3

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

13.5 ns

2880

Yes

2.7 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

254 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

254

220 °C (428 °F)

27 mm

254

EPM7512BBI256-7N

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

512

CMOS

1.8/3.3,2.5 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

1.27 mm

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

Yes

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.