BGA Programmable Logic Devices (PLD) 2,054

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM7064BFC256-3

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

3.5 ns

Yes

2.625 V

64

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 68 I/O

4

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

277.8 MHz

220 °C (428 °F)

17 mm

Yes

68

EPM2210GF324C4N

Altera

Flash PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 272 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

19 mm

Yes

272

EPM3512AFI256-10N

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 208 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e1

30 s

260 °C (500 °F)

17 mm

Yes

208

EP20K200BI484-1

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs, 382 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

382

EPF10K50EFI672-2

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

10 ns

2880

Yes

2.7 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

254 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

254

220 °C (428 °F)

27 mm

254

EP20K100EFC324-1

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

1.73 ns

4160

Yes

1.89 V

CMOS

238

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e0

160 MHz

20 s

238

220 °C (428 °F)

19 mm

246

EPF10K100ABI484-3

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.8 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

85 °C (185 °F)

4 Dedicated Inputs, 369 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

369

EPM570GF100I4ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 76 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

76

EPF10K30EBI484-2

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

85 °C (185 °F)

4 Dedicated Inputs, 220 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

220

EPF10K50SFI672-3

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

12.5 ns

2880

Yes

2.7 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

254 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

254

220 °C (428 °F)

27 mm

254

EP20K100EFC672-3

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

160 MHz

220 °C (428 °F)

27 mm

246

EPF10K50SFC484-2X

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

2.625 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

254 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

20 s

254

220 °C (428 °F)

23 mm

254

EP20K400EBC672-2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

No

e0

488

EP1K30FC484-2

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

9.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Registered

2.375 V

1 mm

70 °C (158 °F)

6 Dedicated Inputs, 171 I/O

6

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

37.5 MHz

23 mm

171

EP20K200FI672-2

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 382 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

220 °C (428 °F)

27 mm

382

EP2A40F672C7

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.55 ns

38400

Yes

1.575 V

CMOS

480

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.425 V

1 mm

85 °C (185 °F)

492 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

480

220 °C (428 °F)

27 mm

492

EP20K600EBC652-1

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.57 ns

24320

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

160 MHz

20 s

480

220 °C (428 °F)

45 mm

488

EPM7512AEFC256-10N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e1

87 MHz

30 s

260 °C (500 °F)

17 mm

Yes

212

EPF10K100EFI256-2N

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPF10K200EBI672-1

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

0.4 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

470

EPF10K200SFC672-1

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.3 ns

9984

Yes

2.625 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

470

220 °C (428 °F)

27 mm

470

EPF10K100EFI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

9 ns

4992

Yes

2.7 V

CMOS

338

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

338 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

338

220 °C (428 °F)

23 mm

338

EPM1270F100C4ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e0

0

EP2A25F672C7

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.69 ns

24320

Yes

1.575 V

CMOS

480

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.425 V

1 mm

85 °C (185 °F)

492 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

20 s

480

220 °C (428 °F)

27 mm

492

EPM7256AEFC256-5

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

172.4 MHz

20 s

220 °C (428 °F)

17 mm

Yes

164

EPM570GF100C5ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 76 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

76

EP1K10FC484-1

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Registered

2.375 V

1 mm

70 °C (158 °F)

6 Dedicated Inputs, 130 I/O

6

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

90 MHz

23 mm

130

EPM1270GM256I4N

Altera

Flash PLD

Ball

256

BGA

Rectangular

Plastic/Epoxy

8.1 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

0 Dedicated Inputs, 212 I/O

0

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

212

EPXA4F672I2

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 426 I/O

0

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

220 °C (428 °F)

27 mm

426

EP20K400EFC672-1X

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.57 ns

16640

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

480

220 °C (428 °F)

27 mm

488

EP1K10FC484-2

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

9.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Registered

2.375 V

1 mm

70 °C (158 °F)

6 Dedicated Inputs, 130 I/O

6

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

37.5 MHz

23 mm

130

EPF10K100ABI484-2

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

85 °C (185 °F)

4 Dedicated Inputs, 369 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

369

EPF10K30AFC484-2

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.7 ns

1728

Yes

3.6 V

CMOS

246

3.3

2.5/3.3,3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

1728 Logic Elements; 216 Labs

e0

80 MHz

20 s

246

220 °C (428 °F)

23 mm

246

EPF10K30EFC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

176

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

176 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

176

220 °C (428 °F)

17 mm

176

EPM7256ABC100-12

Altera

EE PLD

Commercial

Ball

100

BGA

Square

Plastic/Epoxy

12 ns

Yes

256

CMOS

2.5/3.3,3.3 V

Grid Array

BGA100,10X10

Programmable Logic Devices

Yes

1.5 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B100

No

e0

220 °C (428 °F)

Yes

EP20K600EFC672-2X

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.25 ns

24320

Yes

1.89 V

CMOS

500

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

500

220 °C (428 °F)

27 mm

508

EPF10K100ABC484-1

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.6 ns

4992

Yes

3.6 V

CMOS

369

3.3

2.5/3.3,3.3 V

Grid Array

BGA484,22X22,50

Field Programmable Gate Arrays

Mixed

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 369 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

No

e0

369

220 °C (428 °F)

369

EP20K60EFC324-1XN

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

1.72 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 196 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e1

160 MHz

245 °C (473 °F)

19 mm

196

EPM1270F256I4N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

2.625 V

980

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

0 Dedicated Inputs, 212 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

17 mm

Yes

212

EPM1270M256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

8.1 ns

Yes

2.625 V

980

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

Yes

212

EPF10K30EBI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 176 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

176

EPM240GM100A5N

Altera

Flash PLD

Automotive

Ball

100

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.89 V

192

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA100,11X11,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 80 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e1

Yes

80

EPM3256AFI256-10N

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 161 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e1

17 mm

161

EPF6016BC256-2N

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

5.25 V

5

Grid Array

Macrocell

4.75 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 204 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

Can Also Be Used 16000 Logic Gates

e1

153 MHz

27 mm

204

EPM240GM100C4N

Altera

Flash PLD

Other

Ball

100

BGA

Square

Plastic/Epoxy

6.1 ns

Yes

1.89 V

192

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA100,11X11,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 80 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e1

Yes

80

EP20K200FI484-1

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

376

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 382 I/O

4

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

376

220 °C (428 °F)

23 mm

382

EPM2210F100C4ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e0

0

EPF10K50SFC484-1X

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.3 ns

2880

Yes

2.625 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

254 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

254

220 °C (428 °F)

23 mm

254

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.