BGA Programmable Logic Devices (PLD) 2,054

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EP1K30FI484-2

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

9.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 171 I/O

6

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

37.5 MHz

23 mm

171

EPM2210F256A3

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

1700

CMOS

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

No

e0

Yes

EPM7256ABC100-10

Altera

EE PLD

Commercial

Ball

100

BGA

Square

Plastic/Epoxy

10 ns

Yes

256

CMOS

2.5/3.3,3.3 V

Grid Array

BGA100,10X10

Programmable Logic Devices

Yes

1.5 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B100

No

e0

220 °C (428 °F)

Yes

EP20K400CF672C7N

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.48 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B672

3.5 mm

27 mm

No

e1

40 s

245 °C (473 °F)

27 mm

488

EP20K400BI672-3

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs, 502 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

502

EPM1270F100C3ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e0

0

EP20K100EFC672-2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

160 MHz

220 °C (428 °F)

27 mm

246

EP20K400BC652-2X

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

3.1 ns

16640

Yes

2.625 V

CMOS

496

2.5

2.5,2.5/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 502 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

20 s

496

220 °C (428 °F)

45 mm

502

EPM1270F100I5ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e0

0

EPM7384AEFC256-12

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

384

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPF10K10AFI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 150 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

150

EPF10K50EFC672-2

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

10 ns

2880

Yes

2.7 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

254 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

254

220 °C (428 °F)

27 mm

254

EPM7128BBC100-4

Altera

EE PLD

Ball

100

BGA

Square

Plastic/Epoxy

4 ns

Yes

128

CMOS

1.8/3.3,2.5 V

Grid Array

BGA100,10X10

Programmable Logic Devices

Yes

1.5 mm

Tin Lead

Bottom

S-PBGA-B100

No

e0

220 °C (428 °F)

Yes

EPF10K50EFI256-2N

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

2880 Logic Elements

e1

140 MHz

17 mm

191

EPF10K100EBI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EP20K200BI672-3

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs, 382 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

382

EPF10K50VFI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 291 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

291

EPF10K130EFI672-2

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

12 ns

6656

Yes

2.7 V

CMOS

413

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

413 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

413

220 °C (428 °F)

27 mm

413

EP20K600CF33C8

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

1.78 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 588 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

220 °C (428 °F)

33 mm

588

EP20K200CFC672-9

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

376 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

376

EPM1270GF256C3

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

6.2 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

212

EP20K400FI672-1

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

16640

Yes

2.625 V

CMOS

496

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 502 I/O

4

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

496

220 °C (428 °F)

27 mm

502

EPF10K200SBI600-1X

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

9 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF8820ABC225-A-4

Altera

Loadable PLD

Commercial

Ball

225

BGA

Square

Plastic/Epoxy

1.9 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 152 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B225

2.3 mm

27 mm

No

Can also operate at 5 V supply

e1

27 mm

152

EP20K1500EBC652-2

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.13 ns

51840

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

5A

3.5 mm

45 mm

No

e0

160 MHz

20 s

480

220 °C (428 °F)

45 mm

488

EP20K100EFC400-1

Altera

Loadable PLD

Other

Ball

400

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B400

3

No

e0

220 °C (428 °F)

EP20K1000CF33C9N

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

2.02 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 708 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

40 s

245 °C (473 °F)

33 mm

708

EPF10K130EFC672-3X

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

413 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

413

EPM1270F256A3

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

6.2 ns

Yes

980

CMOS

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

No

e0

Yes

EPM570F256I5

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

8.7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

0 Dedicated Inputs, 160 I/O

0

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e0

20 s

220 °C (428 °F)

17 mm

Yes

160

EPM570GM256I5N

Altera

Flash PLD

Ball

256

BGA

Rectangular

Plastic/Epoxy

8.7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

0 Dedicated Inputs, 160 I/O

0

Tin Silver Copper

Bottom

R-PBGA-B256

3

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

Yes

160

EP20K100EFI484-1

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

4 Dedicated Inputs, 246 I/O

4

Tin Lead

Bottom

S-PBGA-B484

3

No

e0

220 °C (428 °F)

246

EPM570F256A4N

Altera

Flash PLD

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

17 mm

Yes

160

EPM570M256C3N

Altera

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

5.4 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EP20K400FI672-3

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

16640

Yes

2.625 V

CMOS

496

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 502 I/O

4

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

496

220 °C (428 °F)

27 mm

502

EPF10K30EFI672-2

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

9.5 ns

1728

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

220 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

220

220 °C (428 °F)

27 mm

220

EPM2210GM100I3N

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 0 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B100

No

e1

0

EPM7128ABI100-6

Altera

EE PLD

Industrial

Ball

100

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

85 °C (185 °F)

0 Dedicated Inputs, 84 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

No

128 Macrocells

e1

166.7 MHz

84

EPM240GF100C4

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

6.1 ns

Yes

192

CMOS

1.8,1.8/3 V

Grid Array

BGA100,10X10,40

Programmable Logic Devices

Yes

1 mm

Bottom

S-PBGA-B100

No

Yes

EPF10K200SBI600-1

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

9 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPM2210GF324I4N

Altera

Flash PLD

Ball

324

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 272 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

19 mm

Yes

272

EPF10K30EFI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

8 ns

1728

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

220 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

220

220 °C (428 °F)

23 mm

220

EP20K600EFC33-2N

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

2.25 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 588 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

40 s

245 °C (473 °F)

33 mm

588

EPF6024AFC256-1N

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 219 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

172 MHz

17 mm

219

EPM2210GF100I5ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

0

EPF10K100EFC484-2XN

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

338 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

40 s

260 °C (500 °F)

23 mm

338

EPM1270F256I4

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

980

CMOS

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPF10K10AFC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.8 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 150 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

1.86 mm

23 mm

No

e1

23 mm

150

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.