LBGA Programmable Logic Devices (PLD) 623

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EP20K1500CB652I-8

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

4 Dedicated Inputs, 488 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

220 °C (428 °F)

45 mm

488

EP20K200CBC652-7

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

1.6 ns

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

376 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

376

EP20K200BC356-2

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

3 ns

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 277 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

271

220 °C (428 °F)

35 mm

277

EPF10K50SBC356-2X

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

2.625 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

220 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

220

220 °C (428 °F)

35 mm

220

EP20K200CBI356-9

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

271 I/O

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

271

EP20K200CBC356-9

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

271 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

271

EP20K1000EBC652XES

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

488

EPF10K100ABC356-1

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

4992

Yes

3.6 V

CMOS

274

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EPF10K100EBC356-3N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EP20K160EBC356-3N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.29 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

160 MHz

35 mm

271

EP20K60EFC144-3N

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

3.56 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

1.7 mm

13 mm

No

e1

160 MHz

13 mm

93

EPF6016AFC100-1N

Altera

Loadable PLD

Other

Ball

100

LBGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array, Low Profile

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 81 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

1.7 mm

11 mm

No

e1

172 MHz

11 mm

81

EP20K200CBC652-7X

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

1.6 ns

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

376 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

376

EP20K200CBC356-7X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.6 ns

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

271 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

271

EP20K200EBC356-2X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

263

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

263

220 °C (428 °F)

35 mm

271

EP20K160EBC356-1

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.55 ns

6400

Yes

1.89 V

CMOS

263

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

160 MHz

20 s

263

220 °C (428 °F)

35 mm

271

EP20K60EBC356-1

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.72 ns

2560

Yes

1.89 V

CMOS

188

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 196 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

160 MHz

20 s

188

220 °C (428 °F)

35 mm

196

EP20K200CBI356-7

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

1.6 ns

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

271 I/O

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

271

EP20K100BC356-1V

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.5 ns

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

100 MHz

246

220 °C (428 °F)

35 mm

252

EPF10K130EBC356-3

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

6656

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EPM7256BFI100-5

Altera

EE PLD

Ball

100

LBGA

Square

Plastic/Epoxy

5 ns

Yes

2.625 V

256

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 84 I/O

4

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

188.7 MHz

220 °C (428 °F)

11 mm

Yes

84

EPM7064BFC100-3

Altera

EE PLD

Commercial

Ball

100

LBGA

Square

Plastic/Epoxy

3.5 ns

Yes

2.625 V

64

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 68 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

303 MHz

20 s

235 °C (455 °F)

11 mm

Yes

68

EPF10K50SBC356-3N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

220 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

220

EP20K1500CB652C9

Altera

Loadable PLD

Commercial

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

70 °C (158 °F)

488 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

220 °C (428 °F)

45 mm

488

EP20K100EFC144-3N

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

2.2 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

1.7 mm

13 mm

No

e1

160 MHz

13 mm

93

EP20K100EBC356-1XN

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.73 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

246

5M1270ZF324C4

Altera

Flash PLD

Other

Ball

324

LBGA

Square

Plastic/Epoxy

9.1 ns

Yes

1.89 V

980

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

271 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

1.55 mm

19 mm

No

e0

247.5 MHz

19 mm

Yes

271

EPF10K50SBI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

12.5 ns

2880

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

220 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e0

220

220 °C (428 °F)

35 mm

220

EPM570GF100A5N

Altera

Flash PLD

Automotive

Ball

100

LBGA

Square

Plastic/Epoxy

8.7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 76 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

1.7 mm

11 mm

No

It can also operate at 3.3 V

e1

11 mm

Yes

76

EP20K200BC356-1V

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

0.3 ns

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 279 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

100 MHz

271

220 °C (428 °F)

35 mm

279

EP20K200BC356-1X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.5 ns

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 277 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

271

220 °C (428 °F)

35 mm

277

EP20K100BC356-2N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

3 ns

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e1

30 s

246

260 °C (500 °F)

35 mm

252

EP20K30EFI144-2XN

Altera

Loadable PLD

Ball

144

LBGA

Square

Plastic/Epoxy

2.69 ns

1200

Yes

1.89 V

CMOS

85

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA144,12X12,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 93 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B144

3

1.7 mm

13 mm

No

e1

30 s

85

260 °C (500 °F)

13 mm

93

EPF10K200SBI356-2

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

9984

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EPF10K30BI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

17.2 ns

Yes

5.5 V

CMOS

5

Grid Array, Low Profile

Registered

4.75 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

246

EPM7128BFI100-7

Altera

EE PLD

Industrial

Ball

100

LBGA

Square

Plastic/Epoxy

4 ns

Yes

2.625 V

128

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 84 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

243.9 MHz

220 °C (428 °F)

11 mm

Yes

84

EPF10K200SBC356-2N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EPM570GF100I4N

Altera

Flash PLD

Ball

100

LBGA

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 76 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B100

1.7 mm

11 mm

No

It can also operate at 3.3 V

e1

11 mm

Yes

76

EPF10K130EBC356-2X

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

6656

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

274

220 °C (428 °F)

35 mm

274

EPF10K30ABI356-1

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

11 ns

Yes

3.6 V

CMOS

3.3

Grid Array, Low Profile

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

246

EPM570F100C4N

Altera

Flash PLD

Other

Ball

100

LBGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 76 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

11 mm

Yes

76

EP20K100EBC356-2

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.02 ns

4160

Yes

1.89 V

CMOS

238

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

238

220 °C (428 °F)

35 mm

246

EP20K200EBC356-1X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.58 ns

8320

Yes

1.89 V

CMOS

263

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

263

220 °C (428 °F)

35 mm

271

EPM7128AFI100-6

Altera

EE PLD

Industrial

Ball

100

LBGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 84 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

144.9 MHz

220 °C (428 °F)

11 mm

Yes

84

5M1270ZF256I5

Altera

Flash PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

10 ns

Yes

1.89 V

980

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

100 °C (212 °F)

211 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e0

201.1 MHz

17 mm

Yes

211

EPM7064AEFC100-4

Altera

EE PLD

Commercial

Ball

100

LBGA

Square

Plastic/Epoxy

4.5 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 68 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

222.2 MHz

20 s

235 °C (455 °F)

11 mm

Yes

68

EPF10K50EBI356-2

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

10 ns

2880

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 220 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e0

220

220 °C (428 °F)

35 mm

220

EPM7064BFI100

Altera

EE PLD

Ball

100

LBGA

Square

Plastic/Epoxy

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 68 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B100

1.7 mm

11 mm

No

e1

11 mm

68

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.