LBGA Programmable Logic Devices (PLD) 623

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EP20K60EFI144-2X

Altera

Loadable PLD

Ball

144

LBGA

Square

Plastic/Epoxy

2.41 ns

2560

Yes

1.89 V

CMOS

85

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA144,12X12,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 93 I/O

4

Tin Lead

Bottom

S-PBGA-B144

3

1.7 mm

13 mm

No

e0

85

220 °C (428 °F)

13 mm

93

EPM7256AEFC100-10

Altera

EE PLD

Commercial

Ball

100

LBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

95.2 MHz

20 s

235 °C (455 °F)

11 mm

Yes

84

EP20K200BC356-3

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

3.6 ns

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 277 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

271

220 °C (428 °F)

35 mm

277

EPM7256BFI100-7

Altera

EE PLD

Ball

100

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.625 V

256

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 84 I/O

4

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

126.6 MHz

220 °C (428 °F)

11 mm

Yes

84

EP20K200EBC652

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array, Low Profile

Macrocell

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

376

EPM7064BFC100-7N

Altera

EE PLD

Commercial

Ball

100

LBGA

Square

Plastic/Epoxy

3.5 ns

Yes

2.625 V

64

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 68 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

1.7 mm

11 mm

No

e1

303 MHz

11 mm

Yes

68

EP20K400BC652-1XV

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

2.5 ns

16640

Yes

2.625 V

CMOS

496

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

502 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

1.63 mm

45 mm

No

e0

20 s

496

220 °C (428 °F)

45 mm

502

EP20K200EBI356-1

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

263

2.5

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 271 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

263

220 °C (428 °F)

35 mm

271

EPF10K130EBI356-3X

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EPM7512BBI256-7

Altera

EE PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

1.7 mm

27 mm

No

e0

119 MHz

220 °C (428 °F)

27 mm

Yes

212

EP20K200EBC356ES

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

271

EP20K200BI356-1X

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 277 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

271

220 °C (428 °F)

35 mm

277

EPM7256BFI100-10

Altera

EE PLD

Ball

100

LBGA

Square

Plastic/Epoxy

10 ns

Yes

2.625 V

256

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 84 I/O

4

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

95.2 MHz

220 °C (428 °F)

11 mm

Yes

84

EP20K100BC356-1X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.5 ns

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

246

220 °C (428 °F)

35 mm

252

EP20K1000CB652I-9

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

38400

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

4 Dedicated Inputs, 488 I/O

4

Tin Lead

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e0

480

220 °C (428 °F)

45 mm

488

EPF10K50VBC356-4

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

2880

Yes

3.6 V

CMOS

274

3.3

3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EP20K100EFC144-2XN

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

2.02 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

1.7 mm

13 mm

No

e1

160 MHz

13 mm

93

EPF10K100EBI356-3X

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EP20K200BI356-2X

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 277 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

271

220 °C (428 °F)

35 mm

277

EPF10K100EBC356-3X

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EPM7512BBC256-10

Altera

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

5.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

2.375 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.7 mm

27 mm

No

e0

163.9 MHz

220 °C (428 °F)

27 mm

Yes

212

EPF10K50SBC356-3X

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

220 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

220

EP20K200EBC356-2XN

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.97 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

271

EPF10K130EBI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

16 ns

6656

Yes

2.7 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e0

274

220 °C (428 °F)

35 mm

274

EP20K200CBC652-9

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

376 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

376

EPM7064AEFC100-7

Altera

EE PLD

Commercial

Ball

100

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 68 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

135.1 MHz

20 s

235 °C (455 °F)

11 mm

Yes

68

EPF10K130EBI356-2

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

6656

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EP20K400CB652I-8

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

4 Dedicated Inputs, 488 I/O

4

Tin Lead

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e0

220 °C (428 °F)

45 mm

488

EP20K200CB356C7N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.48 ns

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.7 mm

35 mm

No

e1

35 mm

271

EPF10K130EBC356-3X

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EP20K200EBC356-3N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.33 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

271

EP20K60EBC356-3X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

3.56 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 196 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

160 MHz

220 °C (428 °F)

35 mm

196

EP20K1500CBI652-7

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

1.4 ns

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

488 I/O

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

488

EPF10K30ABI356-2

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

13 ns

Yes

3.6 V

CMOS

3.3

Grid Array, Low Profile

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

246

EPF10K50VBC356-1N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

3.6 V

CMOS

274

3.3

3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e1

30 s

274

260 °C (500 °F)

35 mm

274

EPF10K50VBI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

2880

Yes

3.6 V

CMOS

310

3.3

3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 274 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

310

220 °C (428 °F)

35 mm

274

EP20K60EFC144-3

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

3.56 ns

2560

Yes

1.89 V

CMOS

85

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA144,12X12,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.7 mm

13 mm

No

e0

160 MHz

20 s

85

235 °C (455 °F)

13 mm

93

EP20K200CB652C-9

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

220 °C (428 °F)

45 mm

376

EPF10K100ABI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.8 ns

4992

Yes

3.6 V

CMOS

274

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 274 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EP20K60EFC144-2N

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

2.41 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

1.7 mm

13 mm

No

e1

160 MHz

13 mm

93

EP20K60EBC356-1N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.72 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 196 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

160 MHz

35 mm

196

EPM7256BFC100-10

Altera

EE PLD

Ball

100

LBGA

Square

Plastic/Epoxy

10 ns

Yes

2.625 V

256

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 84 I/O

4

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

95.2 MHz

220 °C (428 °F)

11 mm

Yes

84

EPF10K30BI356-4

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

21.1 ns

1728

Yes

5.5 V

CMOS

246

5

3.3/5,5 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

4.75 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

1728 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

62.89 MHz

246

220 °C (428 °F)

35 mm

246

EP20K400EBI652-1

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

16640

Yes

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.27 mm

4 Dedicated Inputs, 488 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

480

220 °C (428 °F)

45 mm

488

EPM7128AEFC100-5

Altera

EE PLD

Commercial

Ball

100

LBGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

128

CMOS

84

PAL-TYPE

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

192.3 MHz

20 s

84

235 °C (455 °F)

11 mm

Yes

84

EP20K100EBC356-3X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.2 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

220 °C (428 °F)

35 mm

246

EPM7128AFI100-12

Altera

EE PLD

Industrial

Ball

100

LBGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 84 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

72.5 MHz

220 °C (428 °F)

11 mm

Yes

84

EP20K30EFC144-2N

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

2.69 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

1.7 mm

13 mm

No

e1

160 MHz

13 mm

93

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.