LBGA Programmable Logic Devices (PLD) 623

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC95216-15BGG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	15 ns		Yes	5.5 V		CMOS			5		Grid Array, Low Profile				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 166 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e1	55.6 MHz	30 s		260 °C (500 °F)	35 mm		166
XC2C384-10FT256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	384	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	83 MHz	30 s	212	225 °C (437 °F)	17 mm	Yes	212
XCR3256XL-10FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	105 MHz	30 s		225 °C (437 °F)	17 mm	Yes	164
XC95216-10BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	216	CMOS			5	3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 166 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	66.7 MHz	30 s		225 °C (437 °F)	35 mm	Yes	166
XC95216-10BGG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS			5		Grid Array, Low Profile				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 166 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e1	66.7 MHz	30 s		260 °C (500 °F)	35 mm		166
XCR3384XL-7FTG256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	384	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	135 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XC95288-20BGG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns		Yes	5.25 V		CMOS			5		Grid Array, Low Profile				Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	50 MHz	30 s		260 °C (500 °F)	35 mm		192
XC95288XL-6BGG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V		CMOS			3.3		Grid Array, Low Profile				Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	288 Macrocells	e1	151.5 MHz	30 s		260 °C (500 °F)	35 mm		192
XC95288XL-10BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS			3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	288 Macrocells	e0	100 MHz	30 s		225 °C (437 °F)	35 mm	Yes	192
XCR3256XL-7FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	154 MHz	30 s		225 °C (437 °F)	17 mm	Yes	164
XC95288-15BG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	288	CMOS			5	3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	288 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	55.6 MHz	30 s		225 °C (437 °F)	35 mm	Yes	192
XC95288-20BGG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns		Yes	5.5 V		CMOS			5		Grid Array, Low Profile				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	50 MHz	30 s		260 °C (500 °F)	35 mm		192
XC95288-15BGG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	15 ns		Yes	5.25 V		CMOS			5		Grid Array, Low Profile				Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	55.6 MHz	30 s		260 °C (500 °F)	35 mm		192
XC95216-10BG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	216	CMOS			5	3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 166 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	66.7 MHz	30 s		225 °C (437 °F)	35 mm	Yes	166
XC95216-20BGG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns		Yes	5.5 V		CMOS			5		Grid Array, Low Profile				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 166 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e1	50 MHz	30 s		260 °C (500 °F)	35 mm		166
XC2C384-10FT256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	384	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	83 MHz	30 s	212	225 °C (437 °F)	17 mm	Yes	212
XC2C256-5FT256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	5 ns		Yes	1.9 V	256	CMOS			1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 184 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e0		30 s		225 °C (437 °F)	17 mm	Yes	184
XCR3384XL-10FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	384	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	102 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
XCR3256XL-12FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	88 MHz	30 s		260 °C (500 °F)	17 mm	Yes	164
XCR3512XL-10FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	97 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
XC95576-12BGG432C	Xilinx	Flash PLD	Commercial	Ball	432	LBGA	Square	Plastic/Epoxy	12 ns		Yes			CMOS			5		Grid Array, Low Profile				Macrocell		1.27 mm	70 °C (158 °F)	232 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1					40 mm		232
XC95216-20BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	216	CMOS			5	3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 166 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	50 MHz	30 s		225 °C (437 °F)	35 mm	Yes	166
XCR3384XL-12FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	384	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	83 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
XCR3512XL-12FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	512	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
XCR3384XL-10FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	384	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	102 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XC95216-15BGG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	15 ns		Yes	5.25 V		CMOS			5		Grid Array, Low Profile				Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 166 I/O	0	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e1	55.6 MHz	30 s		260 °C (500 °F)	35 mm		166
XCR3512XL-10FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	97 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XCR3256XL-12FTG256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	88 MHz	30 s		260 °C (500 °F)	17 mm	Yes	164
EP20K1000CB652I-9	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy		38400	Yes	1.89 V		CMOS	480		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Lead	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e0			480	220 °C (428 °F)	45 mm		488
EPF10K50VBC356-4	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns	2880	Yes	3.6 V		CMOS	274		3.3	3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm		274
EP20K100EFC144-2XN	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	2.02 ns		Yes	1.89 V		CMOS			1.8		Grid Array, Low Profile				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144		1.7 mm	13 mm	No		e1	160 MHz				13 mm		93
EPF10K100EBI356-3X	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V		CMOS			2.5		Grid Array, Low Profile				Mixed	2.3 V	1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		274
EP20K200BI356-2X	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		8320	Yes	2.625 V		CMOS	271		2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 277 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			271	220 °C (428 °F)	35 mm		277
EPF10K100EBC356-3X	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.625 V		CMOS			2.5		Grid Array, Low Profile				Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		274
EPM7512BBC256-10	Altera	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	5.5 ns		Yes	2.625 V	512	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Low Profile	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	2.375 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.7 mm	27 mm	No		e0	163.9 MHz			220 °C (428 °F)	27 mm	Yes	212
EPF10K50SBC356-3X	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V		CMOS			2.5		Grid Array, Low Profile				Mixed	2.375 V	1.27 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		220
EP20K200EBC356-2XN	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.97 ns		Yes	1.89 V		CMOS			1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		271
EPF10K130EBI356-3	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	16 ns	6656	Yes	2.7 V		CMOS	274		2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			274	220 °C (428 °F)	35 mm		274
EP20K200CBC652-9	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		376
EPM7064AEFC100-7	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64	CMOS			3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e0	135.1 MHz	20 s		235 °C (455 °F)	11 mm	Yes	68
EPF10K130EBI356-2	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V		CMOS	274		2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm		274
EP20K400CB652I-8	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Lead	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e0				220 °C (428 °F)	45 mm		488
EP20K200CB356C7N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.48 ns		Yes	1.89 V					1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.7 mm	35 mm	No		e1					35 mm		271
EPF10K130EBC356-3X	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.625 V		CMOS			2.5		Grid Array, Low Profile				Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		274
EPM570F100I4N	Altera	Flash PLD		Ball	100	LBGA	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	440	CMOS			2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		0 Dedicated Inputs, 76 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No	It can also operate at 3.3 V	e1					11 mm	Yes	76
EPF10K50SBI356-2	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	9.5 ns	2880	Yes	2.7 V		CMOS	220		2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	85 °C (185 °F)	220 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			220	220 °C (428 °F)	35 mm		220
EP20K200CB652I-9	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1				220 °C (428 °F)	45 mm		376
5M1270ZF324I5	Altera	Flash PLD	Industrial	Ball	324	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	980	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	100 °C (212 °F)	271 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324		1.55 mm	19 mm	No		e0	201.1 MHz				19 mm	Yes	271

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.