LBGA Programmable Logic Devices (PLD) 623

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM570F100I5N	Intel	Flash PLD		Ball	100	LBGA	Square	Plastic/Epoxy	8.7 ns		Yes	2.625 V	440	CMOS	76		2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1		30 s	76	260 °C (500 °F)	11 mm	Yes	76
5M570ZF256C5N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V	440	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	159 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	118.3 MHz	30 s		260 °C (500 °F)	17 mm	Yes	159
5M2210ZF256C5N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS	203		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	201.1 MHz		203		17 mm	Yes	203
EPM570F100C5N	Intel	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	8.7 ns		Yes	2.625 V	440	CMOS	76		2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1		30 s	76	260 °C (500 °F)	11 mm	Yes	76
XC2C256-7FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS	184	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 184 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e1	108 MHz	30 s	184	260 °C (500 °F)	17 mm	Yes	184
EPM240F100C5N	Intel	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.625 V	192	CMOS	80		2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1		30 s	80	260 °C (500 °F)	11 mm	Yes	80
5M2210ZF256I5N	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS	203		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	203 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	201.1 MHz	30 s	203	260 °C (500 °F)	17 mm	Yes	203
5M1270ZF256C5N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	211 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	201.1 MHz				17 mm	Yes	211
5M1270ZF256I5N	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	211 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	201.1 MHz				17 mm	Yes	211
5M2210ZF256C4N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.1 ns		Yes	1.89 V	1700	CMOS	203		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	247.5 MHz		203		17 mm	Yes	203
5M2210ZF324C5N	Intel	Flash PLD	Other	Ball	324	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS	271		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	271 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.55 mm	19 mm	No		e1	201.1 MHz		271		19 mm	Yes	271
XC2C256-7FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS	184	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 184 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e1	108 MHz	30 s	184	260 °C (500 °F)	17 mm	Yes	184
XC2C384-10FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	384	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	83 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
EPM240F100I5N	Intel	Flash PLD		Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.625 V	192	CMOS	80		2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1			80		11 mm	Yes	80
EPM240GF100I5N	Intel	Flash PLD		Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.89 V	192	CMOS	80		1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1			80		11 mm	Yes	80
5M570ZF256I5N	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V	440	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	159 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	118.3 MHz				17 mm	Yes	159
LC4256V-3FTN256BC	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	3 ns		Yes	3.6 V	256		164	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 160 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	212 MHz	40 s	160	260 °C (500 °F)	17 mm	Yes	160
LC4256V-5FTN256AC	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	256		132	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	156 MHz	40 s	128	260 °C (500 °F)	17 mm	Yes	128
5M2210ZF324C4N	Intel	Flash PLD	Other	Ball	324	LBGA	Square	Plastic/Epoxy	9.1 ns		Yes	1.89 V	1700	CMOS	271		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	271 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.55 mm	19 mm	No		e1	247.5 MHz		271		19 mm	Yes	271
LC4512V-75FTN256C	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512		212	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	111 MHz	40 s	208	260 °C (500 °F)	17 mm	Yes	208
XC2C384-10FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	384	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	83 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
5M1270ZF256C4N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8.1 ns		Yes	1.89 V	980	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	211 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	247.5 MHz				17 mm	Yes	211
5M1270ZF324C5N	Intel	Flash PLD	Other	Ball	324	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	980	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	271 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.55 mm	19 mm	No		e1	201.1 MHz				19 mm	Yes	271
5M2210ZF256I5	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS	203		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	203 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	201.1 MHz		203		17 mm	Yes	203
5M2210ZF256C4	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.1 ns		Yes	1.89 V	1700	CMOS	203		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	247.5 MHz		203		17 mm	Yes	203
5M570ZF256C4N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	159 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	184.1 MHz				17 mm	Yes	159
XC2C256-6FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS	184	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 184 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e1	139 MHz	30 s	184	260 °C (500 °F)	17 mm	Yes	184
5M2210ZF256C5	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS	203		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	201.1 MHz		203		17 mm	Yes	203
XC2C384-7FT256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	384	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	112 MHz	30 s	212	225 °C (437 °F)	17 mm	Yes	212
XC2C256-7FT256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS	184	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 184 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e0	108 MHz	30 s	184	225 °C (437 °F)	17 mm	Yes	184
5M1270ZF324I5N	Intel	Flash PLD	Industrial	Ball	324	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	980	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	271 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.55 mm	19 mm	No		e1	201.1 MHz				19 mm	Yes	271
XC2C512-10FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	512	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	91 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
XC2C512-7FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	512	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	119 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
EPM570F100I5	Intel	Flash PLD		Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.625 V	440	CMOS	76		2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100		1.7 mm	11 mm	No	It can also operate at 3.3 V	e0			76		11 mm	Yes	76
XC2C512-10FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	512	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	91 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
XC2C512-7FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	512	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	119 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
XCR3512XL-10FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	97 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
EP20K100EBC356-2X	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	238		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			238		35 mm		246
EP20K100EBC356-3	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V		CMOS	238		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			238		35 mm		246
EP20K100EBC356-3N	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V		CMOS	238		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1			238		35 mm		246
EPM7256AEFI100-7	Intel	EE PLD	Industrial	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	126.6 MHz				11 mm	Yes	84
XCR3512XL-7FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	135 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
5M2210ZF324I5N	Intel	Flash PLD	Industrial	Ball	324	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS	271		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	271 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e1	201.1 MHz	30 s	271	260 °C (500 °F)	19 mm	Yes	271
CY39100V256B-83BBC	Cypress Semiconductor	Loadable PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	15 ns		Yes	2.7 V	1536	CMOS			2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 180 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.6 mm	17 mm	No	Also operates at 3.3 V nominal supply	e0					17 mm	Yes	180
EP20K30EFI144-2X	Intel	Loadable PLD		Ball	144	LBGA	Square	Plastic/Epoxy	2.69 ns	1200	Yes	1.89 V		CMOS	85		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays		Macrocell	1.71 V		1 mm		4 Dedicated Inputs, 93 I/O	4		Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0			85		13 mm		93
EPF10K100ABC356-3	Intel	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.8 ns	4992	Yes	3.6 V		CMOS	274		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	3 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			274		35 mm		274
EPF6016AFC100-2	Intel	Loadable PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy		1320	Yes	3.6 V		CMOS	81		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Field Programmable Gate Arrays		Macrocell	3 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 81 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	153 MHz		81		11 mm		81
EPM240GF100C5N	Intel	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.89 V	192	CMOS	80		1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1			80		11 mm	Yes	80

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.