Rectangular Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC73108-7PQ100C	Xilinx	OT PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	18 ns	Yes	5.25 V	108	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	12 Dedicated Inputs, 47 I/O	12	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	83.3 MHz	30 s		225 °C (437 °F)	20 mm	No	47
XC95144-7PQ100	Xilinx	Flash PLD		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS				5			Flatpack				Macrocell			.65 mm		0 Dedicated Inputs, 81 I/O	0		Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable	e0					20 mm		81
XCR5128-7TQ128C	Xilinx	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	9.5 ns	Yes	5.25 V	128	CMOS				5		5 V	Flatpack, Low Profile, Fine Pitch	QFP128,.63X.87,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 97 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128	1	1.6 mm	14 mm	No			95 MHz				20 mm	Yes	97
XCR5128C-10TQ128I	Xilinx	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS				5			Flatpack, Low Profile, Fine Pitch				Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			66 MHz				20 mm		96
XCR3128-15PQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.63 V	128	CMOS				3.3		3.3 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	2.97 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	59 MHz	30 s		225 °C (437 °F)	20 mm	Yes	80
XC9572F-10PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS				5			Flatpack				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	67 MHz	30 s		245 °C (473 °F)	20 mm		72
XCR22V10-10VO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS				5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.2 mm	4.4 mm	No			83 MHz				7.8 mm		10
XC95108-20PQG160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	HQFP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.5 V	108	CMOS				5		3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G160	3	4.1 mm	28 mm	No		e3		30 s		245 °C (473 °F)	28 mm	Yes	108
XC95144-7PQG100	Xilinx	Flash PLD		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS				5			Flatpack				Macrocell			.65 mm		0 Dedicated Inputs, 81 I/O	0		Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable	e3					20 mm		81
XCR3128-12TQ128I	Xilinx	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	3.63 V	128	CMOS				3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.63X.87,20	Programmable Logic Devices	Yes	Macrocell	2.97 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			69 MHz				20 mm	Yes	96
XC9572-7PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	83.3 MHz	30 s		225 °C (437 °F)	20 mm	Yes	72
XC7372-12PQ100C	Xilinx	OT PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	28 ns	Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	12 Dedicated Inputs, 42 I/O	12	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops	e0	62.5 MHz	30 s		225 °C (437 °F)	20 mm	No	42
XC9572F-7PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	83 MHz	30 s		225 °C (437 °F)	20 mm	Yes	72
XC95108F-7PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS				5			Flatpack				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	83 MHz	30 s		245 °C (473 °F)	20 mm		81
XCR5128-10PQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.25 V	128	CMOS				5		5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	71 MHz	30 s		225 °C (437 °F)	20 mm	Yes	80
XC9572-15PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	20 mm	Yes	72
XC7372-7PQ100C	Xilinx	OT PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	18.5 ns	Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	12 Dedicated Inputs, 42 I/O	12	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops	e0	95.2 MHz	30 s		225 °C (437 °F)	20 mm	No	42
XC95108-15PQG160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	HQFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	108	CMOS				5		3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G160	3	4.1 mm	28 mm	No		e3		30 s		245 °C (473 °F)	28 mm	Yes	108
XC95108F-15PQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5			Flatpack				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	56 MHz				20 mm		81
XC95108-7PQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.5 V	108	CMOS				5		3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0		30 s		225 °C (437 °F)	20 mm	Yes	81
XCR22LV10-10SO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS				3.3			Small Outline				Macrocell	3 V		1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			125 MHz				15.4 mm		10
XC95108-7PQG160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	HQFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	108	CMOS				5		3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G160	3	4.1 mm	28 mm	No		e3		30 s		245 °C (473 °F)	28 mm	Yes	108
XC9572-15PQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	72	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	55.6 MHz	30 s		225 °C (437 °F)	20 mm	Yes	72
XCR22LV10-15SO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS				3.3			Small Outline				Macrocell	3 V		1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			95 MHz				15.4 mm		10
XC95144-10PQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	144	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	67.7 MHz	30 s		245 °C (473 °F)	20 mm	Yes	81
XCR5064-10PQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS				5		5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	20 mm	No	64
XC95108-10PQ100I4307	Xilinx	Flash PLD		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	108	CMOS		81		5			Flatpack	QFP100,.7X.9		Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm				66.7 MHz		81		20 mm	Yes	81
TC9808P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	29 ns	No	5.25 V	8	CMOS		18	PLA-TYPE	5			In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function	e0	22 MHz		9		24.6 mm		9
TC9809P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	29 ns	No	5.25 V	8	CMOS		18	PLA-TYPE	5			In-Line				Macrocell	4.75 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function	e0	22 MHz		9		24.6 mm		9
TC9800FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	60 ns	Yes	6 V	8	CMOS		18	PLA-TYPE	5			Small Outline				Macrocell	2 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock		10 MHz		9		12.8 mm		9
TC9801FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	60 ns	Yes	5.5 V	8	CMOS		18	PLA-TYPE	5			Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock		10 MHz		9		12.8 mm		9
TC9802FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	6 V	8	CMOS		18	PLA-TYPE	5			Small Outline				Macrocell	2 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Copper/Tin Silver	Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e2	14 MHz		9		12.8 mm		9
TC9803P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	5.5 V	8	CMOS		18	PLA-TYPE	5			In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	14 MHz		9		24.6 mm		9
TC9801P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	60 ns	No	5.5 V	8	CMOS		18	PLA-TYPE	5			In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	10 MHz		9		24.6 mm		9
TC9802P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	6 V	8	CMOS		18	PLA-TYPE	5			In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	14 MHz		9		24.6 mm		9
TC9807P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	21 ns	No	5.25 V		CMOS		16	PAD-TYPE	5			In-Line				Combinatorial	4.75 V		2.54 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	Zero-Standby Function	e0			12		24.6 mm		10
TC9806P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	21 ns	No	5.25 V		CMOS		16	PAD-TYPE	5			In-Line				Combinatorial	2 V		2.54 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	Zero-Standby Function	e0			12		24.6 mm		10
TC9800P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	60 ns	No	6 V	8	CMOS		18	PLA-TYPE	5			In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	10 MHz		9		24.6 mm		9
TC9807FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	21 ns	Yes	5.25 V		CMOS		16	PAD-TYPE	5			Small Outline				Combinatorial	4.75 V		1.27 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)	Tin Copper/Tin Silver	Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	Zero-Standby Function	e2			12		12.8 mm		10
TC9808FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	29 ns	Yes	5.25 V	8	CMOS		18	PLA-TYPE	5			Small Outline				Macrocell	2 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function		22 MHz		9		12.8 mm		9
TC9803FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	8	CMOS		18	PLA-TYPE	5			Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Copper/Tin Silver	Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e2	14 MHz		9		12.8 mm		9
TC9809FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	29 ns	Yes	5.25 V	8	CMOS		18	PLA-TYPE	5			Small Outline				Macrocell	4.75 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function		22 MHz		9		12.8 mm		9
TC9804P	Toshiba	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	16	CMOS		22	PLA-TYPE	5			In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	2 Dedicated Inputs, 16 I/O	2	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		4.45 mm	7.62 mm	No	16 Macrocells; 4 External Clocks; Shared Input/Clock; Set/Reset In Asynchronous Enable	e0	12 MHz		16		29.8 mm		16
TC9805P	Toshiba	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	16	CMOS		22	PLA-TYPE	5			In-Line				Macrocell	4.75 V		2.54 mm	85 °C (185 °F)	2 Dedicated Inputs, 16 I/O	2	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		4.45 mm	7.62 mm	No	16 Macrocells; 4 External Clocks; Shared Input/Clock; Set/Reset In Asynchronous Enable	e0	12 MHz		16		29.8 mm		16
TC9806FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	21 ns	Yes	5.25 V		CMOS		16	PAD-TYPE	5			Small Outline				Combinatorial	2 V		1.27 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	Zero-Standby Function				12		12.8 mm		10
5962-01-333-2525	Renesas Electronics	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	125 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No					8
5962-01-286-1613	Renesas Electronics	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	55 ns	No			TTL	MIL-STD-883 Class B (Modified)	18	PLA-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices				42	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No					10
SLG46169VTR	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	1.89 V	9			12	PLA-TYPE	1.8	Box, Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC14,.08X.09,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 11 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14		.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				11		2.2 mm	No	11

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.