Rectangular Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
CPL16R6-15NC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy		No			CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0	41.6 MHz	6
CPL20L10L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes			CMOS	20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Combinatorial			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	10
CPL16V8-20NC	Samsung	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No			CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0	33.3 MHz	8
CPL20L8-25WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No			CMOS	12	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		72	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		8
CPL20V8-20NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0	33.3 MHz	8
CPL20R4-35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		60	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0	16.5 MHz	8
CPL16R4-35WC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	18 MHz	4
CPL16R6-25WC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	28.5 MHz	6
CPL16R6-35WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	16.5 MHz	6
CPL20R8L35DC	Samsung		Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	35 ns	Yes			CMOS	20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDSO-G24				No			18 MHz	8
CPL20R8L25DC	Samsung		Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes			CMOS	20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDSO-G24				No			28.5 MHz	8
CPL20V8L-25WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0	28.5 MHz	8
CPL16R6-35WC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	18 MHz	6
CPL20R6L35WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No			CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered			2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24				No			18 MHz	8
CPL20L10L-30NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No			CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0		10
CPL16R4L-20NC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy		No			CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0	33.3 MHz	4
EP610DC24-25	Altera	UV PLD	Commercial	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	27 ns	No	5.25 V		CMOS	20	PAL-TYPE	5	5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	16 Macrocells; 2 External Clocks	e0	47.6 MHz	16	220 °C (428 °F)	32 mm		16
EP610ASC24-10	Altera	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS			5		Small Outline				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	16 Macrocells; 2 External Clocks		100 MHz			15.4 mm		16
EP320DC-2	Altera	UV PLD	Commercial	Through-Hole	20	WDIP	Rectangular	Ceramic, Glass-Sealed	35 ns	No	5.25 V		CMOS	18	PAL-TYPE	5	5 V	In-Line, Window	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	72	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T20		4.826 mm	7.62 mm	No	8 Macrocells; Shared Input/Clock	e0	40 MHz	8	220 °C (428 °F)	24.003 mm		8
EP22V10EPC-15	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.32 mm	7.62 mm	No	Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock	e0	64.5 MHz	10	220 °C (428 °F)	31.68 mm		10
EPM5016SI-17	Altera		Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	17 ns	Yes			CMOS	16	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices				160	1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20				No		e0		8	220 °C (428 °F)
EPM5128QC-2	Altera	OT PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	30 ns	Yes		128	CMOS			5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No				.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3			No		e0			220 °C (428 °F)		No
EP610DC24-35	Altera	UV PLD	Commercial	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	37 ns	No	5.25 V		CMOS	20	PAL-TYPE	5	5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	16 Macrocells; 2 External Clocks	e0	37 MHz	16	220 °C (428 °F)	32 mm		16
EPM5032PI-20	Altera	OT PLD	Industrial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V		CMOS	24	PAL-TYPE	5	5 V	In-Line	DIP28,.3	Programmable Logic Devices		Macrocell	4.5 V	320	2.54 mm	85 °C (185 °F)	7 Dedicated Inputs, 16 I/O	7	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz	16	220 °C (428 °F)			16
EPM7064QI100-10C	Altera	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS			5		Flatpack				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100		3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	100 MHz			20 mm		64
EPM570GM256A3N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	5.4 ns	Yes	1.89 V	440	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1					Yes	160
EPM7128EQI100-15	Altera	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	128	CMOS			5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	100 MHz		220 °C (428 °F)	20 mm	No	84
EP610DI-15	Altera	UV PLD	Industrial	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V					5		In-Line				Macrocell	4.5 V			85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Dual	R-GDIP-T24				No			83.3 MHz					16
EP610DI-30	Altera	UV PLD	Industrial	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	32 ns	No	5.5 V		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	160	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)	Tin Lead	Dual	R-GDIP-T24				No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	33.3 MHz	16	220 °C (428 °F)			16
EPM7160SQC100-15	Altera	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	160	CMOS			5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	76.9 MHz		220 °C (428 °F)	20 mm	Yes	80
EPM7128SQC100-7C	Altera	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS			5		Flatpack				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100		3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz			20 mm		80
EP220PC-7	Altera	OT PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	72	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		4.318 mm	7.62 mm	No	8 Macrocells	e0	100 MHz	8	220 °C (428 °F)	26.162 mm		8
EP220DC-10A	Altera	UV PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.25 V		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	72	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T20				No	8 Macrocells	e0	111 MHz	8	220 °C (428 °F)			8
5962-01-400-3523	Altera		Commercial	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		74	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T20				No			30.3 MHz	8
EPM5032ASC-12	Altera	OT PLD	Commercial	Gull Wing	28	SOP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.25 V		CMOS	24	PAL-TYPE	5	5 V	Small Outline	SOP28,.5	Programmable Logic Devices		Macrocell	4.75 V	320	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G28		2.65 mm	7.5 mm	No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	111.1 MHz	16	220 °C (428 °F)	17.9 mm		16
EPM5130AQC-15	Altera	OT PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS			5		Flatpack				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	19 Dedicated Inputs, 64 I/O	19	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100		3.65 mm	14 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e3	83.3 MHz			20 mm		64
EP610ADC-15	Altera		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No			CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		160	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24				No		e0	71.4 MHz	16	220 °C (428 °F)
EP610DM-35	Altera	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	37 ns	No	5.5 V		CMOS	20	PAL-TYPE	5	5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	160	2.54 mm	125 °C (257 °F)	4 Dedicated Inputs, 16 I/O	4	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.334 mm	7.62 mm	No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	28.6 MHz	16	220 °C (428 °F)	31.75 mm		16
EP610IDC-25	Altera	UV PLD	Commercial	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		CMOS	20	PAL-TYPE	5	5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No		e0	40 MHz	16	220 °C (428 °F)	32 mm		16
EP310DC-1	Altera		Commercial	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		74	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20				No		e0	30 MHz	8	220 °C (428 °F)
EP910IDI-15	Altera	UV PLD	Industrial	Through-Hole	40	WDIP	Rectangular	Ceramic, Glass-Sealed	18 ns	No	5.5 V		CMOS	36	PAL-TYPE	5	5 V	In-Line, Window	DIP40,.6	Programmable Logic Devices		Macrocell	4.5 V	450	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-GDIP-T40		5.75 mm	15.24 mm	No	Macrocells Interconnected By Global Bus; 24 Macrocells; 2 External Clocks	e0	66.6 MHz	24	220 °C (428 °F)	52.07 mm		24
EPS448DM28-20	Altera	UV PLD	Military	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed		No	5.5 V		CMOS			5		In-Line, Window				Registered	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	PLS		20 MHz			36.83 mm		0
EP610PC24-25	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	27 ns	No	5.25 V		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.318 mm	7.62 mm	No	16 Macrocells; 2 External Clocks	e0	47.6 MHz	16	220 °C (428 °F)	31.6865 mm		16
EP1210DMB	Altera		Military	Through-Hole	40	DIP	Rectangular	Ceramic		No			CMOS	36	PAL-TYPE			In-Line	DIP40,.6	Programmable Logic Devices				236	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T40						e0	12.5 MHz	24	220 °C (428 °F)
EP320IPI-40	Altera	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No			CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		72	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20				No		e0	21.7 MHz	8	220 °C (428 °F)
EPM5032DM	Altera		Military	Through-Hole	28	DIP	Rectangular	Ceramic	25 ns	No			CMOS	24	PAL-TYPE	5	5 V	In-Line	DIP28,.3	Programmable Logic Devices				320	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T28				No		e0	62.5 MHz	16	220 °C (428 °F)
EPS448DI-20	Altera	UV PLD	Industrial	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed		No	5.5 V		CMOS			5		In-Line, Window				Registered	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 0 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-GDIP-T28		5.334 mm	7.62 mm	No	Stand-Alone Microsequencer	e0	20 MHz		220 °C (428 °F)	36.83 mm		0
EP330PI20-15	Altera	OT PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	16 ns	No	5.5 V		CMOS			5		In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)		Dual	R-PDIP-T20		4.318 mm	7.62 mm	No	8 Macrocells; Shared Input/Clock		83.3 MHz			26.162 mm		8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.