Rectangular Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
CPL16R6-15NC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0	41.6 MHz		6
CPL20L10L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Combinatorial			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz		10
CPL16V8-20NC	Samsung	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No			CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0	33.3 MHz		8
CPL20L8-25WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No			CMOS		12	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		72	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0			8
CPL20V8-20NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0	33.3 MHz		8
CPL20R4-35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		60	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0	16.5 MHz		8
CPL16R4-35WC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	18 MHz		4
CPL16R6-25WC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	28.5 MHz		6
CPL16R6-35WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	16.5 MHz		6
CPL20R8L35DC	Samsung		Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	35 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDSO-G24				No			18 MHz		8
CPL20R8L25DC	Samsung		Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDSO-G24				No			28.5 MHz		8
CPL20V8L-25WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0	28.5 MHz		8
CPL16R6-35WC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	18 MHz		6
CPL20R6L35WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered			2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24				No			18 MHz		8
CPL20L10L-30NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0			10
CPL16R4L-20NC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0	33.3 MHz		4
EP600IPC-55	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V						5		In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		3.81 mm	7.62 mm		Seated HGT-NOM	e0	23.3 MHz			220 °C (428 °F)	26.162 mm
EP320PI-2	Altera	OT PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns	No	5.5 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	72	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			7.62 mm	No	8 Macrocells; Shared Input/Clock	e0	40 MHz		8	220 °C (428 °F)	26.162 mm		8
EPM5130WC	Altera	UV PLD	Commercial	Gull Wing	100	WQFP	Rectangular	Ceramic, Metal-Sealed Cofired	55 ns	Yes	5.25 V	128	CMOS				5	5 V	Flatpack, Window	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	19 Dedicated Inputs, 64 I/O	19	0 °C (32 °F)	Tin Lead	Quad	R-CQFP-G100		2.99 mm	14 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz			220 °C (428 °F)	19.2 mm	No	64
EPM5130WI	Altera	UV PLD	Industrial	Gull Wing	100	WQFP	Rectangular	Ceramic, Metal-Sealed Cofired	55 ns	Yes	5.5 V	128	CMOS				5	5 V	Flatpack, Window	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	19 Dedicated Inputs, 64 I/O	19	-40 °C (-40 °F)	Tin Lead	Quad	R-CQFP-G100		2.99 mm	14 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz			220 °C (428 °F)	19.2 mm	No	64
EP610ADC-12	Altera		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	12 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		160	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24				No		e0	83.3 MHz		16	220 °C (428 °F)
EPM570M256A3N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	5.4 ns	Yes	2.625 V	440	CMOS				2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	160
5962-8863501RX	Altera	UV PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	50 ns	No	5.5 V		CMOS	MIL-STD-883			5		In-Line				Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20				No									8
EP320IDC-30	Altera	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic	30 ns	No			CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		72	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20				No		e0	28.5 MHz		8	220 °C (428 °F)
EP610ASI-10	Altera	OT PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS				5		Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks		100 MHz				15.4 mm		16
EPM7160EQI100-10	Altera	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	160	CMOS				5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	100 MHz			220 °C (428 °F)	20 mm	No	80
EPM7128EQC100-15C	Altera	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS				5		Flatpack				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100		3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	76.9 MHz				20 mm		80
EP610SI-20T	Altera	OT PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	22 ns	Yes	5.5 V		CMOS				5		Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			55.6 MHz				15.4 mm		16
5962-01-416-1943	Altera		Military	Through-Hole	40	DIP	Rectangular	Ceramic	60 ns	No			CMOS		36	PAL-TYPE	5	5 V	In-Line	DIP40,.6	Programmable Logic Devices		Macrocell		240	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T40				No			16.7 MHz		24
EPM7064SQC100-10	Altera	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS				5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	100 MHz			220 °C (428 °F)	20 mm	No	64
EPM1270M256A3N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	6.2 ns	Yes	2.625 V	980	CMOS				2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	212
EPM5032DI28-15	Altera	UV PLD	Industrial	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS				5		In-Line, Window				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	7 Dedicated Inputs, 16 I/O	7	-40 °C (-40 °F)		Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	32 Macrocells		83.3 MHz				36.83 mm		16
MPM5032PC-25	Altera	Mask PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS				5		In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)		Dual	R-PDIP-T28		4.318 mm	7.62 mm	No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock		50 MHz			220 °C (428 °F)	34.29 mm		16
EPM7128QC100-15	Altera	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	128	CMOS				5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.425 mm	14 mm	No	128 Macrocells; Shared Input/Clock	e0	76.9 MHz			220 °C (428 °F)	20 mm	No	80
EP610ASC24-15	Altera	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	16 ns	Yes	5.25 V		CMOS				5		Small Outline				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	16 Macrocells; 2 External Clocks		71.4 MHz				15.4 mm		16
EPM5130AWC-20	Altera	UV PLD	Commercial	Gull Wing	100	WQFP	Rectangular	Ceramic, Metal-Sealed Cofired	33 ns	Yes	5.25 V		CMOS				5		Flatpack, Window				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	19 Dedicated Inputs, 64 I/O	19	0 °C (32 °F)	Matte Tin	Quad	R-CQFP-G100		2.99 mm	14 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e3	66.7 MHz				19.2 mm		64
EPM570M256C5N	Altera	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	8.7 ns	Yes	2.625 V	440	CMOS				2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3			No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)		Yes	160
EP610SI-20	Altera	OT PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	22 ns	Yes	5.5 V		CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	4.5 V	160	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G24				No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	55.6 MHz		16	220 °C (428 °F)			16
EPM5127DC-2	Altera	UV PLD	Commercial	Through-Hole	40	DIP	Rectangular	Ceramic		No		128	CMOS				5	5 V	In-Line	DIP40,.6	Programmable Logic Devices	No				2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T40				No		e0				220 °C (428 °F)		No
EPM7160QC100-20	Altera	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.25 V	160	CMOS				5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.425 mm	14 mm	No	160 Macrocells; Shared Input/Clock	e0	62.5 MHz			220 °C (428 °F)	20 mm	No	80
EP610SC-20	Altera	OT PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	22 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	4.75 V	160	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24				No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	55.6 MHz		16	220 °C (428 °F)			16
EPM7128QC100-20	Altera	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.25 V	128	CMOS				5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.425 mm	14 mm	No	128 Macrocells; Shared Input/Clock	e0	62.5 MHz			220 °C (428 °F)	20 mm	No	80
EPS448PC28-20	Altera	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy		No	5.25 V		CMOS				5		In-Line				Registered	4.75 V		2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T28		4.318 mm	7.62 mm	No	PLS		20 MHz				34.29 mm		0
EPM5192WC-2	Altera	UV PLD	Commercial	Gull Wing	100	WQFP	Rectangular	Ceramic, Metal-Sealed Cofired	45 ns	Yes	5.25 V	192	CMOS				5	5 V	Flatpack, Window	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	7 Dedicated Inputs, 64 I/O	7	0 °C (32 °F)	Tin Lead	Quad	R-CQFP-G100		3.35 mm	13.2 mm	No	Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock	e0	40 MHz			220 °C (428 °F)	19.2 mm	No	64
EP910PI40-35	Altera	OT PLD	Industrial	Through-Hole	40	DIP	Rectangular	Plastic/Epoxy	38 ns	No	5.5 V		CMOS		36	PAL-TYPE	5	5 V	In-Line	DIP40,.6	Programmable Logic Devices		Macrocell	4.5 V	240	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T40		4.826 mm	15.24 mm	No	24 Macrocells; 2 External Clocks	e0	37 MHz		24	220 °C (428 °F)	52.4256 mm		24
EP600PI-3	Altera	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	45 ns	No	5.5 V		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	160	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No	16 Macrocells	e0	26.3 MHz		16	220 °C (428 °F)	26.162 mm		16
5962-8753905LA	Altera	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-STD-883 Class B			5		In-Line, Window				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz				32 mm		10
EP610ASC-10	Altera	OT PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	4.75 V	160	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	100 MHz		16	220 °C (428 °F)	15.4 mm		16

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.