EE PLD Programmable Logic Devices (PLD) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
GAL39V18-20HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	50 MHz	10
GAL20V8-25QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL20V8AS-15EC1J	STMicroelectronics	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8	11.5062 mm	8
GAL39V18-15QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	67 MHz	10
GAL20V8-30QZ2	STMicroelectronics	EE PLD	Military	No Lead	28	QCCN	Square	Ceramic	30 ns	Yes		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-N28			No		e0	22.2 MHz	8
GAL39V18-15HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	67 MHz	10
GAL39V18-35HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	29 MHz	10
GAL6001S-30HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No	5.25 V	CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	75	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 38 Macros; 2 External Clocks; Buried Macros; Input Macros	e0	23.5 MHz	10		10
GAL20V8-20HZ1	STMicroelectronics	EE PLD	Commercial	No Lead	28	QCCN	Square	Ceramic	20 ns	Yes		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-XQCC-N28			No		e0	33.3 MHz	8
GAL20V8-35QZ1	STMicroelectronics	EE PLD	Commercial	No Lead	28	QCCN	Square	Ceramic	35 ns	Yes		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-XQCC-N28			No		e0	18.1 MHz	8
GAL16V8S-25QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL39V18-35QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	29 MHz	10
GAL6001S-35HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	40 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T24			No		e0	22.9 MHz	10
GAL16V8S-20QC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes		CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	33.3 MHz	8
GAL16V8-20QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	33.3 MHz	8
GAL16V8-25QD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic	25 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	28.5 MHz	8
GAL16V8-20HD2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
GAL16V8-25HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL16V8-15HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic	15 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	41.6 MHz	8
GAL20V8AS-15HC1J	STMicroelectronics	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8	11.5062 mm	8
GAL20V8S-25QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL20V8AS-20HC1J	STMicroelectronics	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8	11.5062 mm	8
GAL20V8AS-15HC3J	STMicroelectronics	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8	11.5062 mm	8
GAL20V8AS-25HC3J	STMicroelectronics	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28			No		e0	28.5 MHz	8
GAL20V8S-15EB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	41.6 MHz	8
GAL16V8S-20HC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes		CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	33.3 MHz	8
GAL20V8S-25HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL39V18-15HF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	67 MHz	10
GAL16V8S-25HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL16V8AS-15HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8	25.15 mm	8
GAL16V8AS-20QC3	STMicroelectronics	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.5 V	CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8	8.9662 mm	8
GAL39V18-30HZ1	STMicroelectronics	EE PLD	Commercial	No Lead		QCCN		Ceramic	30 ns	Yes		CMOS	20	PLS-TYPE	5	5 V	Chip Carrier	LCC(UNSPEC)	Programmable Logic Devices			75		70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad				No		e0	33 MHz	10
GAL20V8-20HF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33.3 MHz	8
PZ3128AS7BE-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	9.5 ns	Yes	3.63 V	CMOS			3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No	128 Macrocells		95 MHz		20 mm	96
PZ5064C10A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.25 V	CMOS			5		Chip Carrier			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	64 Macrocells		77 MHz		16.5862 mm	32
PZ5128NS10BE-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.5 V	CMOS			5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No	128 Macrocells		66 MHz		20 mm	96
PZ5128NS10BP-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	CMOS			5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	128 Macrocells		66 MHz		14 mm	80
PZ3128AS12BE	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS			3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No	128 Macrocells		63 MHz		20 mm	96
PZ3064I12BC	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS			3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No			67 MHz		10 mm	32
PZ3032DS10A44-T	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS			3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	32 Macrocells		59 MHz		16.5862 mm	32
PZ5128NS15BP-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.5 ns	Yes	5.5 V	CMOS			5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	128 Macrocells		63 MHz		14 mm	80
PZ5064I10BB1	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS			5		Flatpack			Macrocell	4.5 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			77 MHz		20 mm	64
PZ5128-S10BB2-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS			5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G160	4.07 mm	28 mm	No			71 MHz		28 mm	96
PZ5128-S10BP-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS			5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No			71 MHz		14 mm	80
PZ5064I12A68-T	NXP Semiconductors	EE PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	5.5 V	CMOS			5		Chip Carrier			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J68	4.57 mm	24.2316 mm	No			67 MHz		24.2316 mm	48
PZ3128IS15A84	NXP Semiconductors	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	17.5 ns	Yes	3.6 V	CMOS			3.3		Chip Carrier			Macrocell	3 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J84	4.57 mm	29.3116 mm	No			59 MHz		29.3116 mm	64
PZ3064AS7A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	9 ns	Yes	3.6 V	CMOS			3.3		Chip Carrier			Macrocell	3 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No			111 MHz		16.5862 mm	32
PL22V10-15N	NXP Semiconductors	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	CMOS			5		In-Line			Macrocell	4.75 V		2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		50 MHz		31.7 mm	10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.