EE PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
TIBPAL20L10MJT	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No			TTL		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No					10
SN74LS336NP3	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			TTL		12	PLA-TYPE	5	5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24									6
SN74LS333JP4	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL		12	PLS-TYPE	5	5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24									6
SN74LS336N	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			TTL		12	PLA-TYPE	5	5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No					6
5962-01-289-7422	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No			TTL	38535Q/M;38534H;883B	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No					10
TIBPAL20L10CFN	Texas Instruments	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns	Yes			TTL		20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Combinatorial		40	1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J28				No					10
SN74LS333J4	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL		12	PLS-TYPE	5	5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24									6
TIBPAL20X4MJTB	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices				40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			25 MHz		10
SN74LS333J	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL		12	PLS-TYPE	5	5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24				No					6
SN74LS335NP3	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			TTL		12	PLS-TYPE	5	5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24									6
TIBPAL20X10CNT	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			TTL		10	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices				40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			35 MHz		10
SNJ54LS333J	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL	38535Q/M;38534H;883B	12	PLS-TYPE	5	5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No					6
SN54LS334W	Texas Instruments	EE PLD	Military	Flat	24	DFP	Rectangular	Ceramic		Yes			TTL		12	PLA-TYPE	5	5 V	Flatpack	FL24,.4	Programmable Logic Devices				32	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F24				No					6
TIBPAL16L8-30MFHB	Texas Instruments	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic	30 ns	Yes			TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Combinatorial		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N20				No					8
SN74LS335NP1	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			TTL		12	PLS-TYPE	5	5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No					6
SN74LS335J4	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL		12	PLS-TYPE	5	5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24									6
TIBPAL20X4-25MJTB	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices				40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			25 MHz		10
SN74LS333NP1	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			TTL		12	PLS-TYPE	5	5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No					6
TIBPAL20X10-25MWB	Texas Instruments	EE PLD	Military	Flat	24	DFP	Rectangular	Ceramic		Yes			TTL	38535Q/M;38534H;883B	10	PAL-TYPE	5	5 V	Flatpack	FL24,.4	Programmable Logic Devices				40	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F24				No			25 MHz		10
SN54PL16R6-2J	Texas Instruments	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			TTL		10	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No					6
TIBPAL20X4CNT	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			TTL		16	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices				40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			35 MHz		10
SN74LS333N	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			TTL		12	PLS-TYPE	5	5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No					6
TIBPAL20X8CJT	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL		12	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices				40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24				No			35 MHz		10
5962-01-351-3812	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No			TTL	38535Q/M;38534H;883B	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No					10
TIBPAL20L10CJT	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No			TTL		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24				No					10
MACH210-18JI	Analog Devices	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	18 ns	Yes	5.5 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 32 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	40 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
MACH210A-12JI	Analog Devices	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 32 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	64 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
MACH210A-7JC	Analog Devices	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	100 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
MACH210AQ-20JC	Analog Devices	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	40 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
MACH210-12JC	Analog Devices	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
MACH210A-14JI	Analog Devices	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	5.5 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 32 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	53 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
MACH210-20JC	Analog Devices	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	40 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
MACH210A-12JC	Analog Devices	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
MACH210AQ-12JC	Analog Devices	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
MACH210A-10VC	Analog Devices	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS				5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	80 MHz			240 °C (464 °F)	10 mm	No	32
MACH210A-12VC	Analog Devices	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	64	CMOS				5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	66.7 MHz			240 °C (464 °F)	10 mm	No	32
MACH210A-10JC	Analog Devices	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	80 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
MACH210-24JI	Analog Devices	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	24 ns	Yes	5.5 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 32 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	32 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
MACH210-14JI	Analog Devices	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	5.5 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 32 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	53 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
MACH210A-7VC	Analog Devices	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	64	CMOS				5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	100 MHz			240 °C (464 °F)	10 mm	No	32
GAL20V8-35QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24				No		e0	18.1 MHz		8
GAL39V18-15HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No			CMOS		20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24				No		e0	67 MHz		10
GAL16V8AS-15EC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS				5		Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20		4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		41.6 MHz				8.9662 mm		8
GAL16V8S-20EB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz		8		25.15 mm		8
GAL16V8AS-15QC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20		4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz		8		8.9662 mm		8
GAL20V8-30HF2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24				No		e0	22.2 MHz		8
GAL16V8S-25HC3	STMicroelectronics	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes			CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20				No		e0	28.5 MHz		8
GAL16V8AS-15EC3	STMicroelectronics	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Quad	S-PQCC-J20		4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		41.6 MHz				8.9662 mm		8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.