EE PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

SN54PL16R8-2J

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

25 MHz

8

TIBPAL20X8CNT

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

35 MHz

10

SNJ54LS334W

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

38535Q/M;38534H;883B

12

PLA-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

32

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

6

5962-01-354-8218

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

35 MHz

10

SN74PL16L8-1N

Texas Instruments

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

8

SN74LS336N3

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

6

SNC54LS335J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

MIL-STD-883 Class B (Modified)

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

TIBPAL20L10-25MJTB

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

25 ns

No

TTL

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

10

TIBPAL20X8MFK

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

12

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

10

TIBPAL20X8-25MFKB

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

10

TIBPAL20L10-25MWB

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

25 ns

Yes

TTL

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

Combinatorial

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

10

TIBPAL20X8MFKB

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

10

SN74LS334NP3

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

6

SN74PL16R4-1N

Texas Instruments

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

8

SNC54LS334W

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

MIL-STD-883 Class B (Modified)

12

PLA-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

32

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

6

SN54PL16L8-2J

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

35 ns

No

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

8

F20X4-25MJT

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

25 MHz

10

SN74LS334JP4

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

6

SN74LS335JP4

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

6

TIBPAL20X10CJT

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

No

35 MHz

10

SNC54LS335W

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

MIL-STD-883 Class B (Modified)

12

PLS-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

32

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

6

TIBPAL20X4-25MFKB

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

10

TIBPAL20X8MJT

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

25 MHz

10

5962-01-351-9521

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

25 ns

No

TTL

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

10

F16R4-25CJ

Texas Instruments

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

25 ns

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T20

No

28.6 MHz

8

SN54PL16R4-1J

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

8

SN74LS335N

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

6

TIBPAL20L10MJTB

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

25 ns

No

TTL

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

10

TIBPAL20X4MFKB

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

10

SN74PL16R6-1N

Texas Instruments

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

6

5962-01-229-3340

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

25 ns

No

TTL

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

10

TIBPAL20X8-25MJTB

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

25 MHz

10

5962-01-283-4324

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

25 MHz

10

SN74LS336N1

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

6

SNJ54LS335J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

SNJ54LS335W

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

38535Q/M;38534H;883B

12

PLS-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

32

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

6

SN74LS336JP4

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

6

SN54LS333J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

SN74LS336J4

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

6

SN54PL16R4-2J

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

8

TIBPAL20L10-20CN

Texas Instruments

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

20 ns

No

TTL

20

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

40

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

10

SN74LS333NP3

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

6

SN74LS333N3

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

6

SN74PL16R6-2N

Texas Instruments

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

6

TIBPAL20X4MJT

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

25 MHz

10

TIBPAL20L10MFK

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

25 ns

Yes

TTL

20

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

10

SN74LS334N

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

6

SN74PL16R4-2N

Texas Instruments

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.