Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
No |
e0 |
62.5 MHz |
30 s |
240 °C (464 °F) |
7 mm |
Yes |
32 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
32 |
CMOS |
PAL-TYPE |
3.3 |
3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
62.5 MHz |
40 s |
260 °C (500 °F) |
10 mm |
Yes |
32 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
128 |
CMOS |
PAL-TYPE |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e3 |
62.5 MHz |
40 s |
245 °C (473 °F) |
20 mm |
Yes |
64 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e3 |
62.5 MHz |
40 s |
245 °C (473 °F) |
20 mm |
Yes |
64 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
256 |
CMOS |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
14 Dedicated Inputs, 128 I/O |
14 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
62.5 MHz |
40 s |
245 °C (473 °F) |
28 mm |
Yes |
128 |
|||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
512 |
CMOS |
5 |
5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
71.4 MHz |
30 s |
225 °C (437 °F) |
28 mm |
Yes |
160 |
||||||||||
Analog Devices |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 32 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
e0 |
50 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
32 |
||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms |
e0 |
83.3 MHz |
10 |
30.734 mm |
10 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms |
e0 |
33.3 MHz |
10 |
30.734 mm |
10 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms |
e0 |
100 MHz |
10 |
30.734 mm |
10 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
26 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
136 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
e0 |
105.3 MHz |
30 s |
12 |
225 °C (437 °F) |
11.5062 mm |
12 |
|||||||||
Xilinx |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Thin Profile |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
105 MHz |
30 s |
240 °C (464 °F) |
10 mm |
32 |
||||||||||||||||
Xilinx |
EE PLD |
Industrial |
Ball |
48 |
FBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3.3 V |
Grid Array, Fine Pitch |
BGA48,7X7,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 40 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B48 |
3 |
1.8 mm |
7 mm |
No |
e0 |
119 MHz |
30 s |
240 °C (464 °F) |
7 mm |
Yes |
40 |
||||||||||
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e4 |
88 MHz |
28 mm |
Yes |
164 |
|||||||||||
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
88 MHz |
30 s |
260 °C (500 °F) |
20 mm |
Yes |
120 |
|||||||||
|
Xilinx |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
512 |
CMOS |
184 |
PLA-TYPE |
3.3 |
3/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 180 I/O |
0 |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e4 |
67.56 MHz |
180 |
28 mm |
Yes |
180 |
||||||||
Xilinx |
EE PLD |
Commercial |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
3.3 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
No |
e0 |
135 MHz |
30 s |
225 °C (437 °F) |
17 mm |
Yes |
212 |
||||||||||
Defense Logistics Agency |
EE PLD |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
2.54 mm |
8.89 mm |
No |
1 External Clock; Register Preload |
e0 |
41.6 MHz |
8.89 mm |
8 |
|||||||||||||||||
NXP Semiconductors |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
No |
e0 |
31.2 MHz |
10 |
|||||||||||||||||||||||
Defense Logistics Agency |
EE PLD |
Military |
J Bend |
QCCJ |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
1 Dedicated Inputs, 48 I/O |
1 |
-55 °C (-67 °F) |
Gold |
Quad |
4.826 mm |
24.13 mm |
No |
In-System Programmable; 4 External Clocks |
e4 |
38 MHz |
24.13 mm |
48 |
||||||||||||||||||||
Defense Logistics Agency |
EE PLD |
Military |
Gull Wing |
208 |
FQFP |
Square |
15 ns |
Yes |
5.5 V |
512 |
CMOS |
MIL-PRF-38535 Class Q |
165 |
PLA-TYPE |
5 |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Yes |
Macrocell |
4.5 V |
.5 mm |
125 °C (257 °F) |
1 Dedicated Inputs, 160 I/O |
1 |
-55 °C (-67 °F) |
Gold |
Quad |
S-XQFP-G208 |
2.94 mm |
28 mm |
Yes |
e4 |
62.5 MHz |
160 |
28 mm |
Yes |
160 |
||||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3 V |
Flatpack, Thin Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
83.3 MHz |
10 mm |
Yes |
32 |
||||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 48 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
3 |
4.57 mm |
24.2316 mm |
No |
64 Macrocells; In-system programmable; JTAG boundry-scan test circuitry |
e0 |
125 MHz |
225 °C (437 °F) |
24.2316 mm |
Yes |
48 |
||||||||||
Atmel |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
128 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
100 MHz |
30 s |
240 °C (464 °F) |
14 mm |
Yes |
80 |
|||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
128 |
3.3 |
3.3 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e0 |
100 MHz |
225 °C (437 °F) |
20 mm |
Yes |
80 |
||||||||||||
Atmel |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
128 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
83.3 MHz |
240 °C (464 °F) |
14 mm |
Yes |
80 |
||||||||||||
Atmel |
EE PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
10 |
CMOS |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
5.334 mm |
7.62 mm |
No |
e0 |
55 MHz |
31.877 mm |
No |
10 |
||||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
10 |
CMOS |
5 |
5 V |
Small Outline |
SOP24,.4 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
2 |
2.65 mm |
7.5 mm |
No |
e0 |
44 MHz |
15.4 mm |
No |
10 |
||||||||||||
Cypress Semiconductor |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
32 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 37 I/O |
1 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
1.6 mm |
10 mm |
No |
32 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
105 MHz |
10 mm |
Yes |
37 |
||||||||||||
Infineon Technologies |
EE PLD |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
32 |
CMOS |
37 |
PLA-TYPE |
5 |
Flatpack, Low Profile |
QFP44,.47SQ,32 |
Yes |
Macrocell |
4.5 V |
87 |
.8 mm |
85 °C (185 °F) |
5 Dedicated Inputs, 32 I/O |
5 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G44 |
1.6 mm |
10 mm |
105 MHz |
32 |
10 mm |
Yes |
32 |
|||||||||||||||
Cypress Semiconductor |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
1 Dedicated Inputs, 69 I/O |
1 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
64 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
83 MHz |
14 mm |
Yes |
69 |
|||||||||||
|
Cypress Semiconductor |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
1 Dedicated Inputs, 69 I/O |
1 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
64 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e3 |
125 MHz |
40 s |
260 °C (500 °F) |
14 mm |
Yes |
69 |
||||||||
Cypress Semiconductor |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
1 Dedicated Inputs, 69 I/O |
1 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
64 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
29.3116 mm |
Yes |
69 |
|||||||||||
Cypress Semiconductor |
EE PLD |
Commercial |
Gull Wing |
160 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5 V |
Flatpack, Low Profile, Fine Pitch |
QFP160,1.0SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
1 Dedicated Inputs, 133 I/O |
1 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
1.6 mm |
24 mm |
No |
128 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
83 MHz |
24 mm |
Yes |
133 |
|||||||||||
Cypress Semiconductor |
EE PLD |
Military |
J Bend |
84 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
3.6 V |
128 |
CMOS |
38535Q/M;38534H;883B |
3.3 |
3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
125 °C (257 °F) |
1 Dedicated Inputs, 69 I/O |
1 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J84 |
4.826 mm |
29.21 mm |
No |
128 Macrocells |
e0 |
62.5 MHz |
29.21 mm |
Yes |
69 |
|||||||||||
Cypress Semiconductor |
EE PLD |
Military |
Gull Wing |
208 |
FQFP |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
5.5 V |
512 |
CMOS |
38535Q/M;38534H;883B |
165 |
PLA-TYPE |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
125 °C (257 °F) |
1 Dedicated Inputs, 160 I/O |
1 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-G208 |
1 |
3.94 mm |
28 mm |
No |
512 Macrocells; Configurable I/O Operation with 3.3 V or 5 V |
e0 |
62.5 MHz |
160 |
28 mm |
Yes |
160 |
|||||||
Altera |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
35 ns |
No |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
72 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
No |
e0 |
25 MHz |
8 |
220 °C (428 °F) |
|||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e0 |
138.9 MHz |
220 °C (428 °F) |
10 mm |
Yes |
34 |
|||||||||||
|
Intel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
135.1 MHz |
16.5862 mm |
Yes |
34 |
|||||||||||
Intel |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 66 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
100 MHz |
14 mm |
Yes |
66 |
||||||||||||
Intel |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 66 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
135.1 MHz |
14 mm |
Yes |
66 |
||||||||||||
Intel |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e0 |
222.2 MHz |
10 mm |
Yes |
34 |
||||||||||||
Intel |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 116 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
95.2 MHz |
20 mm |
Yes |
116 |
||||||||||||
|
Intel |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 208 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
3.5 mm |
17 mm |
No |
e1 |
17 mm |
Yes |
208 |
||||||||||||
Intel |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 208 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
3.5 mm |
17 mm |
No |
e0 |
17 mm |
Yes |
208 |
|||||||||||||
|
Intel |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
32 |
CMOS |
36 |
PLA-TYPE |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1024 |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e3 |
138.9 MHz |
36 |
10 mm |
Yes |
36 |
|||||||
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
1 |
4.572 mm |
16.5862 mm |
No |
e0 |
250 MHz |
220 °C (428 °F) |
16.5862 mm |
Yes |
36 |
|||||||||||
Intel |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
1 |
4.57 mm |
16.5862 mm |
No |
64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
135.1 MHz |
16.5862 mm |
Yes |
36 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.