EE PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
LC4256V-5TN144I	Lattice Semiconductor	EE PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	256			110	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	14 Dedicated Inputs, 96 I/O	14	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	156 MHz	40 s	96	260 °C (500 °F)	20 mm	Yes	96
LC4512V-10TN176I	Lattice Semiconductor	EE PLD		Gull Wing	176	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512			132	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	4 Dedicated Inputs, 128 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G176	3	1.6 mm	21 mm	No		e3	86 MHz	40 s	128	260 °C (500 °F)	21 mm	Yes	128
M4A3-64/32-55VNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5.5 ns	Yes	3.6 V	64	CMOS			PAL-TYPE	3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	105 MHz	40 s		260 °C (500 °F)	10 mm	Yes	32
M4A5-32/32-7VNI48	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	32	CMOS		34	PAL-TYPE	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	76.9 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
M4A5-96/48-12VNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	96	CMOS			PAL-TYPE	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 48 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	52.6 MHz	40 s		260 °C (500 °F)	14 mm	Yes	48
M4A5-96/48-55VNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5.5 ns	Yes	5.25 V	96	CMOS			PAL-TYPE	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 48 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	105 MHz	40 s		260 °C (500 °F)	14 mm	Yes	48
M4A5-96/48-7VNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	96	CMOS			PAL-TYPE	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 48 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	76.9 MHz	40 s		260 °C (500 °F)	14 mm	Yes	48
M5-192/68-15VC/1	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	192	CMOS				5		5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	55.6 MHz	30 s		240 °C (464 °F)	14 mm	Yes	68
XCR3032XL-5VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	32	CMOS				3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	213 MHz				10 mm	Yes	36
XCR3032XL-7CS48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	32	CMOS				3.3		3/3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	7 mm	Yes	36
XCR3128XL-7VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS				3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	14 mm	Yes	84
5962-8983901RA	Defense Logistics Agency	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	MIL-STD-883			5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	1 External Clock; Register Preload	e0	22.2 MHz				25.27 mm		8
5962-89839022A	Defense Logistics Agency	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.5 V		CMOS	MIL-STD-883			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		2.54 mm	8.89 mm	No	1 External Clock; Register Preload	e0	33.3 MHz				8.89 mm		8
5962-8983903RA	National Semiconductor	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset	e0	41.6 MHz				24.257 mm		8
5962-8984002LA	Defense Logistics Agency	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 8 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset	e0	33.3 MHz				31.9405 mm		8
5962-8984003LA	Defense Logistics Agency	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 8 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset	e0	41.6 MHz				31.9405 mm		8
ATF1502AS-10JI44	Atmel	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	32	CMOS				5		3.3,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	2	4.572 mm	16.586 mm	No		e0	125 MHz			225 °C (437 °F)	16.586 mm	Yes	32
ATF1504BE-7AU100	Microchip Technology	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V		CMOS				1.8	Tray		Flatpack, Thin Profile, Fine Pitch				Macrocell	1.7 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 64 I/O	4	-40 °C (-40 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm								14 mm		64
CY37512VP256-83BGC	Cypress Semiconductor	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	512	CMOS				3.3		3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 197 I/O	1	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.46 mm	27 mm	No	512 Macrocells	e0	62.5 MHz				27 mm	Yes	197
EPM3064ATC44-10	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS				3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e0	100 MHz				10 mm	Yes	34
EPM3512AQC208-10	Intel	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS				3.3		2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 172 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0					28 mm	Yes	172
EPM7032AETC44-10N	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	32	CMOS				3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	103.1 MHz				10 mm	Yes	36
EPM7032SLC44-7F	Altera	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No		e0	166.7 MHz			220 °C (428 °F)	16.5862 mm	Yes	36
EPM7064AETC44-4	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	4.5 ns	Yes	3.6 V	64	CMOS		36	PLA-TYPE	3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	2048	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e0	222.2 MHz		36		10 mm	Yes	36
EPM7064AETC44-7N	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS		36	PLA-TYPE	3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	2048	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	135.1 MHz		36		10 mm	Yes	36
EPM7128ELC84-10	Intel	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock	e0	125 MHz				29.3116 mm	No	68
EPM7128ELC84-10P	Intel	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	128 Macrocells		125 MHz				29.3116 mm	No	68
EPM7128SQC100-6N	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	6 ns	Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	166.7 MHz				20 mm	Yes	84
EPM7128SQC100-7	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	166.7 MHz				20 mm	Yes	84
EPM7128SQC100-7F	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No		e0	166.7 MHz				20 mm	Yes	84
EPM7256AETC100-7N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	256	CMOS				3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	126.6 MHz				14 mm	Yes	84
EPM7512AEFC256-12N	Intel	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	512	CMOS				3.3		2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e1	71.9 MHz				17 mm	Yes	212
EPM7512AEFI256-10	Intel	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS				3.3		2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	87 MHz	20 s		220 °C (428 °F)	17 mm	Yes	212
EPM7512AEFI256-10N	Intel	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS				3.3		2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	87 MHz				17 mm	Yes	212
GAL16V8D-10LJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No	Programmable Output Polarity	e0	66.7 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
GAL16V8D-10QJ	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e0	66.7 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
LC4064V-5TN44I	Lattice Semiconductor	EE PLD		Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	64			32	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	83	.8 mm	105 °C (221 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	156 MHz	40 s	30	260 °C (500 °F)	10 mm	Yes	30
LC4128V-10TN100I	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	128			74	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	10 Dedicated Inputs, 64 I/O	10	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	86 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
LC4128ZC-75MN132I	Lattice Semiconductor	EE PLD		Ball	132	LFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128			100	PAD-TYPE	1.8		1.8 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	83	.5 mm	105 °C (221 °F)	4 Dedicated Inputs, 96 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	111 MHz	40 s	96	260 °C (500 °F)	8 mm	Yes	96
LC4128ZE-7MN144I	Lattice Semiconductor	EE PLD		Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS				1.8		1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,12X12,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm		4 Dedicated Inputs, 96 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B144	3	1.1 mm	7 mm	No		e1	111 MHz	40 s		260 °C (500 °F)	7 mm	Yes	96
LC4256V-10T176I	Lattice Semiconductor	EE PLD		Gull Wing	176	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256			132	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	4 Dedicated Inputs, 128 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G176	3	1.6 mm	21 mm	No		e0	86 MHz	30 s	128	256 °C (492.8 °F)	21 mm	Yes	128
LC4256V-3T144C	Lattice Semiconductor	EE PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3 ns	Yes	3.6 V	256			110	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	14 Dedicated Inputs, 96 I/O	14	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	212 MHz	30 s	96	256 °C (492.8 °F)	20 mm	Yes	96
LC4256V-3TN176C	Lattice Semiconductor	EE PLD		Gull Wing	176	LFQFP	Square	Plastic/Epoxy	3 ns	Yes	3.6 V	256			132	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G176	3	1.6 mm	21 mm	No		e3	212 MHz	40 s	128	260 °C (500 °F)	21 mm	Yes	128
LC4256ZE-5MN144C	Lattice Semiconductor	EE PLD		Ball	144	TFBGA	Square	Plastic/Epoxy	5.8 ns	Yes	1.9 V	256	CMOS				1.8		1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,12X12,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm		4 Dedicated Inputs, 108 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B144	3	1.1 mm	7 mm	No		e1	149 MHz	40 s		260 °C (500 °F)	7 mm	Yes	108
M4A3-64/32-7VNC48	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			PAL-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	76.9 MHz	40 s		260 °C (500 °F)	7 mm	Yes	32
M4A5-192/96-12VNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	192	CMOS				5		5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	16 Dedicated Inputs, 96 I/O	16	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	52.6 MHz	40 s		260 °C (500 °F)	20 mm	Yes	96
M4A5-32/32-10JNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	62.5 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32
M4A5-32/32-12JNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	52.6 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.