EE PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

ISPLSI2096A-100LTN128

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

128

LFQFP

Square

Plastic/Epoxy

13 ns

Yes

5.25 V

96

CMOS

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP128,.64SQ,16

Programmable Logic Devices

Yes

Macrocell

4.75 V

.4 mm

70 °C (158 °F)

3 Dedicated Inputs, 96 I/O

3

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G128

3

1.6 mm

14 mm

No

e3

77 MHz

40 s

260 °C (500 °F)

14 mm

No

96

LA4064V-75TN48E

Lattice Semiconductor

EE PLD

Automotive

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

8 ns

Yes

3.6 V

64

CMOS

AEC-Q100

32

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e3

168 MHz

40 s

32

260 °C (500 °F)

7 mm

Yes

32

LC4064V-75T44I

Lattice Semiconductor

EE PLD

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

32

PAD-TYPE

3.3

3.3 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

83

.8 mm

105 °C (221 °F)

2 Dedicated Inputs, 30 I/O

2

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

111 MHz

30 s

30

240 °C (464 °F)

10 mm

Yes

30

LC4128V-10TN128I

Lattice Semiconductor

EE PLD

Gull Wing

128

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

96

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP128,.64SQ,16

Programmable Logic Devices

Yes

Macrocell

3 V

83

.4 mm

105 °C (221 °F)

4 Dedicated Inputs, 92 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G128

3

1.6 mm

14 mm

No

e3

86 MHz

40 s

92

260 °C (500 °F)

14 mm

Yes

92

PALCE16V8H-25PC/4

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T20

4.953 mm

7.62 mm

No

e0

37 MHz

8

26.1366 mm

8

XCR3512XL-10FT256C

Xilinx

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

97 MHz

30 s

225 °C (437 °F)

17 mm

Yes

212

5962-8983904RA

Defense Logistics Agency

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

Yes

1 External Clock; Register Preload

e0

58.8 MHz

25.27 mm

8

ATF750CL-15JC

Atmel

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

10

CMOS

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

2

4.572 mm

11.5062 mm

No

e0

44 MHz

225 °C (437 °F)

11.5062 mm

No

10

CY37064P100-125AXI

Cypress Semiconductor

EE PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

64

CMOS

5

3.3/5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

1 Dedicated Inputs, 69 I/O

1

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

64 Macrocells; Configurable I/O operation with 3.3 V or 5 V

e4

83 MHz

40 s

260 °C (500 °F)

14 mm

Yes

69

EPM3064ATC100-4

Intel

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

4.5 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 66 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

e0

222.2 MHz

14 mm

Yes

66

EPM3128ATC100-7

Intel

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 80 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

e0

129.9 MHz

14 mm

Yes

80

EPM7032LC44-15T

Altera

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

32

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

1

4.572 mm

16.5862 mm

No

Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock

e0

83.3 MHz

20 s

220 °C (428 °F)

16.5862 mm

No

36

EPM7032STC44-7

Altera

EE PLD

Commercial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

32

CMOS

5

5 V

Flatpack, Low Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

e0

166.7 MHz

220 °C (428 °F)

10 mm

Yes

36

EPM7064LC44-15

Intel

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

64

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

1

4.572 mm

16.5862 mm

No

Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock

e0

100 MHz

16.5862 mm

No

36

EPM7064LC84-15

Intel

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

64

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 68 I/O

0

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Configurable I/O operation with 3.3 V or 5 V

e0

100 MHz

30 s

220 °C (428 °F)

29.3116 mm

No

68

EPM7128AETC100-10

Intel

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

e0

98 MHz

30 s

235 °C (455 °F)

14 mm

Yes

84

EPM7128AETC144-7N

Intel

EE PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

129.9 MHz

20 mm

Yes

100

EPM7128AETI144-7N

Intel

EE PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

129.9 MHz

20 mm

Yes

100

EPM7128SLC84-7

Intel

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

128

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 68 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Configurable I/O operation with 3.3 V or 5 V

e0

166.7 MHz

29.3116 mm

Yes

68

EPM7160STC100-6

Intel

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

6 ns

Yes

5.25 V

160

CMOS

5

3.3/5,5 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

160 Macrocells; 10 Labs; Configurable I/O operation with 3.3 V or 5 V

e0

166.7 MHz

14 mm

Yes

84

EPM7192EGI160-20

Intel

EE PLD

Industrial

Pin/Peg

160

PGA

Square

Ceramic, Metal-Sealed Cofired

20 ns

No

5.5 V

192

CMOS

5

3.3/5,5 V

Grid Array

PGA160M,15X15

Programmable Logic Devices

No

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

0 Dedicated Inputs, 124 I/O

0

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P160

1

5.34 mm

39.624 mm

No

Configurable I/O operation with 3.3 V or 5 V

e0

83.3 MHz

39.624 mm

No

124

EPM7256AEFI100-7

Intel

EE PLD

Industrial

Ball

100

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 84 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

126.6 MHz

11 mm

Yes

84

EPM7256EGI192-15

Intel

EE PLD

Industrial

Pin/Peg

192

PGA

Square

Ceramic, Metal-Sealed Cofired

15 ns

No

5.5 V

256

CMOS

5

3.3/5,5 V

Grid Array

PGA192M,17X17

Programmable Logic Devices

No

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P192

1

5.43 mm

45.15 mm

No

Configurable I/O operation with 3.3 V or 5 V

e0

76.9 MHz

220 °C (428 °F)

45.15 mm

No

160

EPM7512AEFC256-10

Intel

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

87 MHz

20 s

220 °C (428 °F)

17 mm

Yes

212

EPM9320LI84-15

Altera

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

16 ns

Yes

5.5 V

320

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 60 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

320 Macrocells

e0

117.6 MHz

220 °C (428 °F)

29.3116 mm

Yes

60

EPM9560GC280-15

Altera

EE PLD

Commercial

Pin/Peg

280

PGA

Square

Ceramic, Metal-Sealed Cofired

16.6 ns

No

5.25 V

560

CMOS

5

3.3/5,5 V

Grid Array

PGA280,19X19

Programmable Logic Devices

Yes

Macrocell

4.75 V

2.54 mm

70 °C (158 °F)

0 Dedicated Inputs, 216 I/O

0

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P280

1

5.081 mm

49.78 mm

No

772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V

e0

117.6 MHz

220 °C (428 °F)

49.78 mm

Yes

216

GAL16V8B-25LP

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

4.57 mm

7.62 mm

No

Register Preload; Power-Up Reset

e0

37 MHz

8

26.125 mm

8

GAL20V8B-15LJN

Lattice Semiconductor

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

Register Preload; Power-Up Reset

e3

45.5 MHz

40 s

8

245 °C (473 °F)

11.5062 mm

8

GAL20V8B-25LJ

Lattice Semiconductor

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

Register Preload; Power-Up Reset

e0

37 MHz

30 s

8

225 °C (437 °F)

11.5062 mm

8

GAL20V8B-25LJN

Lattice Semiconductor

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

Register Preload; Power-Up Reset

e3

37 MHz

40 s

8

245 °C (473 °F)

11.5062 mm

8

GAL20V8C-5LJ

Lattice Semiconductor

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

5.25 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

Register Preload; Power-Up Reset

e0

142.8 MHz

30 s

8

225 °C (437 °F)

11.5062 mm

8

GAL22V10B-25QP

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

132

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

4.953 mm

7.62 mm

No

Register Preload; Power-Up Reset

e0

33.3 MHz

10

31.877 mm

10

GAL22V10D-10LPI

Lattice Semiconductor

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.5 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Dual

R-PDIP-T24

1

5.334 mm

7.62 mm

No

10 Macrocells; Shared Input/Clock

e0

83.3 MHz

10

31.75 mm

10

ISPLSI1016E-80LT44

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

18.5 ns

Yes

5.25 V

64

CMOS

35

PLA-TYPE

5

5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

3 Dedicated Inputs, 32 I/O

3

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

57 MHz

30 s

32

240 °C (464 °F)

10 mm

No

32

ISPLSI1016EA-100LT44

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

44

QFP

Square

Plastic/Epoxy

12.5 ns

Yes

5.25 V

64

CMOS

5

5 V

Flatpack

QFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

10 mm

No

e0

77 MHz

240 °C (464 °F)

10 mm

No

32

ISPLSI2032A-110LJN44

Lattice Semiconductor

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

13 ns

Yes

5.25 V

32

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e3

77 MHz

40 s

245 °C (473 °F)

16.5862 mm

No

32

ISPLSI2032A-80LJ44

Lattice Semiconductor

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

18.5 ns

Yes

5.25 V

32

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e0

57 MHz

30 s

225 °C (437 °F)

16.5862 mm

No

32

ISPLSI2064E-100LT100

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

13 ns

Yes

5.25 V

64

CMOS

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 64 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e0

77 MHz

30 s

240 °C (464 °F)

14 mm

No

64

ISPLSI2064VE-135LTN44I

Lattice Semiconductor

EE PLD

Industrial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

CMOS

3.3

3.3 V

Flatpack, Low Profile

QFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.6 mm

10 mm

No

e3

100 MHz

30 s

260 °C (500 °F)

10 mm

No

32

ISPLSI3256A-70LQI

Lattice Semiconductor

EE PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

18 ns

Yes

5.5 V

256

CMOS

5

5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 128 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G160

3

4.1 mm

28 mm

No

e0

50 MHz

30 s

225 °C (437 °F)

28 mm

Yes

128

LA4032V-75TN48E

Lattice Semiconductor

EE PLD

Automotive

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

8 ns

Yes

3.6 V

32

CMOS

AEC-Q100

32

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e3

168 MHz

40 s

32

260 °C (500 °F)

7 mm

Yes

32

LA4064V-75TN100E

Lattice Semiconductor

EE PLD

Automotive

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

8 ns

Yes

3.6 V

64

CMOS

AEC-Q100

64

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 64 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

168 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

LC4032ZE-5MN64C

Lattice Semiconductor

EE PLD

Ball

64

TFBGA

Square

Plastic/Epoxy

5.8 ns

Yes

1.9 V

32

CMOS

1.8

1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA64,8X8,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

4 Dedicated Inputs, 32 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B64

3

1.1 mm

5 mm

No

e1

149 MHz

40 s

260 °C (500 °F)

5 mm

Yes

32

LC4032ZE-5TN48I

Lattice Semiconductor

EE PLD

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

5.8 ns

Yes

1.9 V

32

CMOS

1.8

1.8 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

4 Dedicated Inputs, 32 I/O

4

Matte Tin

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e3

149 MHz

40 s

260 °C (500 °F)

7 mm

Yes

32

LC4064V-5TN100I

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

64

74

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

10 Dedicated Inputs, 64 I/O

10

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

156 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

LC4128V-5T100I

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

128

74

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

10 Dedicated Inputs, 64 I/O

10

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e0

156 MHz

30 s

64

240 °C (464 °F)

14 mm

Yes

64

LC4256V-75TN100I

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

74

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

10 Dedicated Inputs, 64 I/O

10

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

111 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

M4A3-256/128-10YI

Lattice Semiconductor

EE PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

256

CMOS

3.3

3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

14 Dedicated Inputs, 128 I/O

14

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

62.5 MHz

30 s

225 °C (437 °F)

28 mm

Yes

128

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.