EE PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

SNC54LS334J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

MIL-STD-883 Class B (Modified)

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

5962-01-305-3124

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

10

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

25 MHz

10

SN54PL16L8-1J

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

25 ns

No

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

8

SN54LS335W

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

12

PLS-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

32

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

6

TIBPAL20X10MJT

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

25 MHz

10

SN54LS335J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

SN74LS334N3

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

6

SNJ54LS333W

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

38535Q/M;38534H;883B

12

PLS-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

32

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

6

5962-8983901RX

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

MIL-STD-883

16

PLA-TYPE

5

In-Line

No

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

1 External Clock; Register Preload

22.2 MHz

8

25.27 mm

No

8

TIBPAL16R8-30MFHB

Texas Instruments

EE PLD

Military

No Lead

20

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

8

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

25 MHz

8

SN54PL16R6-1J

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

6

TIBPAL20X4MFK

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

16

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

10

SN74PL16L8-2N

Texas Instruments

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

35 ns

No

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

8

TIBPAL20X10CFN

Texas Instruments

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

TTL

10

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

35 MHz

10

5962-8983902RX

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

CMOS

MIL-STD-883

16

PLA-TYPE

5

In-Line

No

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

PAL with Macrocells; 8 Macrocells

33.3 MHz

8

24.257 mm

No

8

TIBPAL16R8-20MFHB

Texas Instruments

EE PLD

Military

No Lead

20

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

8

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

40 MHz

8

TIBPAL20X10MJTB

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

10

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

25 MHz

10

SNC54LS336W

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

MIL-STD-883 Class B (Modified)

12

PLA-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

32

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

6

SN54LS333W

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

12

PLS-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

32

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

6

SN74LS336J

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

No

6

SN74LS334J4

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

6

SN74LS335J

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

No

6

TIBPAL20X8-25MWB

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

25 MHz

10

5962-01-279-5563

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

25 MHz

10

SN74LS335N3

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

6

TIBPAL20X8CFN

Texas Instruments

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

TTL

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

35 MHz

10

SN74LS334J

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

No

6

SNC54LS333J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

MIL-STD-883 Class B (Modified)

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

SNJ54LS336J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

TIBPAL20X10-25MFKB

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

10

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

10

GAL16V8-20LJM

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

20 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T20

No

e0

33.3 MHz

8

SN54PL16R8-1J

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

35 MHz

8

TIBPAL20X4CJT

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

No

35 MHz

10

SN54LS336J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

TIBPAL16R6-20MFHB

Texas Instruments

EE PLD

Military

No Lead

20

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

10

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

6

SN74LS336NP1

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

6

SNC54LS333W

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

MIL-STD-883 Class B (Modified)

12

PLS-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

32

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

6

TIBPAL20X4-25MWB

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

25 MHz

10

SNC54LS336J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

MIL-STD-883 Class B (Modified)

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

SNJ54LS334J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

TIBPAL20L10CNT

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

20 ns

No

TTL

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

40

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

10

TIBPAL20L10MFKB

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

25 ns

Yes

TTL

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

10

TIBPAL20X10MFK

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

10

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

10

SN74PL16R8-2N

Texas Instruments

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

25 MHz

8

5962-8983903RX

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

PAL with Macrocells; 8 Macrocells

41.6 MHz

24.257 mm

8

SN74LS333N1

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

6

TIBPAL20X4CFN

Texas Instruments

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

TTL

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

35 MHz

10

SN74LS335N1

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

6

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.