EE PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XCR3032XL-10VQG44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	32	CMOS			3.3		3/3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	95 MHz	30 s		260 °C (500 °F)	10 mm	Yes	36
EPM3064ALC44-10N	Intel	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS			3.3		2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	100 MHz				16.5862 mm	Yes	34
EPM7064AETI44-7N	Intel	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS	36	PLA-TYPE	3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	2048	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	135.1 MHz		36		10 mm	Yes	36
EPM9320LC84-15N	Intel	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	16 ns	Yes	5.25 V		CMOS			5			Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 60 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e3	117.6 MHz				29.3116 mm		60
GAL22V10D-10QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e3	83.3 MHz		10		31.75 mm		10
LC4384V-75TN176C	Lattice Semiconductor	EE PLD		Gull Wing	176	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	384		132	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G176	3	1.6 mm	21 mm	No		e3	111 MHz	40 s	128	260 °C (500 °F)	21 mm	Yes	128
ATF1504ASVL-20JI44	Atmel	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	3.6 V	64	CMOS			3.3		2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	2	4.572 mm	16.586 mm	No		e0	83.3 MHz			225 °C (437 °F)	16.586 mm	Yes	32
EPM7128AETC100-10N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	128	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	98 MHz	30 s		260 °C (500 °F)	14 mm	Yes	84
XCR3032XL-10VQG44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	32	CMOS			3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	95 MHz	30 s		260 °C (500 °F)	10 mm	Yes	36
EPM7064STI44-7N	Intel	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	64	CMOS			5		5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V	e3	166.7 MHz				10 mm	No	36
LC4064V-5TN100C	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	64		74	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	10 Dedicated Inputs, 64 I/O	10	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	156 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
LC4256V-3TN100C	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	3 ns	Yes	3.6 V	256		74	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	10 Dedicated Inputs, 64 I/O	10	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	212 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
ATF1504ASL-25JU44	Microchip Technology	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V	64	CMOS	32		5	Tube		Chip Carrier	LDCC44,.7SQ		Yes	Macrocell	4.5 V	40	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	Power-Up Reset; Security Fuse	e3	60 MHz	40 s	32	245 °C (473 °F)	16.5862 mm	Yes	32
EPM7128AETI100-7N	Intel	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS	84	PLA-TYPE	3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	129.9 MHz		84		14 mm	Yes	84
EPM7256SRI208-10N	Intel	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	256	CMOS			5		3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz				28 mm	Yes	164
LC4064V-75TN100E	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64		74	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	130 °C (266 °F)	10 Dedicated Inputs, 64 I/O	10	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	111 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
LC4064ZC-75TN48C	Lattice Semiconductor	EE PLD		Gull Wing	48	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64		36	PAD-TYPE	1.8		1.8 V	Flatpack, Thin Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e3	111 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
XCR3256XL-10TQ144I	Xilinx	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3		3/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 120 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	105 MHz				20 mm	Yes	120
LC4032V-5TN44I	Lattice Semiconductor	EE PLD		Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	32		32	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	83	.8 mm	105 °C (221 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	156 MHz	40 s	30	260 °C (500 °F)	10 mm	Yes	30
LC4032V-75TN44I	Lattice Semiconductor	EE PLD		Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	32		32	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	83	.8 mm	105 °C (221 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	111 MHz	40 s	30	260 °C (500 °F)	10 mm	Yes	30
LC4128V-75TN128I	Lattice Semiconductor	EE PLD		Gull Wing	128	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128		96	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.64SQ,16	Programmable Logic Devices	Yes	Macrocell	3 V	83	.4 mm	105 °C (221 °F)	4 Dedicated Inputs, 92 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G128	3	1.6 mm	14 mm	No		e3	111 MHz	40 s	92	260 °C (500 °F)	14 mm	Yes	92
ATF750CL-15XU	Microchip Technology	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	10	CMOS			5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		1.2 mm	4.4 mm	No		e3	44 MHz				7.8 mm	No	10
GAL22V10D-15LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS	22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	55.5 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
LC4064V-5TN48C	Lattice Semiconductor	EE PLD		Gull Wing	48	TFQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	64		36	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e3	156 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
LC4128V-75TN100I	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128		74	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	10 Dedicated Inputs, 64 I/O	10	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	111 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
GAL16V8D-10LJ	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS	18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No	Programmable Output Polarity	e0	66.7 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
LC4032V-25TN44C	Lattice Semiconductor	EE PLD		Gull Wing	44	TQFP	Square	Plastic/Epoxy	2.5 ns	Yes	3.6 V	32		32	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	83	.8 mm	90 °C (194 °F)	2 Dedicated Inputs, 30 I/O	2	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	250 MHz	40 s	30	260 °C (500 °F)	10 mm	Yes	30
EPM7032AETI44-7N	Intel	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	32	CMOS	36	PLA-TYPE	3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	1024	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	138.9 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	36
EPM7064AETC44-10N	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e3	100 MHz	30 s		260 °C (500 °F)	10 mm	Yes	36
LC4064V-25TN48C	Lattice Semiconductor	EE PLD		Gull Wing	48	TFQFP	Square	Plastic/Epoxy	2.5 ns	Yes	3.6 V	64		36	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e3	250 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
ISPLSI2032E-110LJ44	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	13 ns	Yes	5.25 V	32	CMOS			5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
ATF1502ASV-15JU44	Microchip Technology	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	32	CMOS			3.3	Tube	3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	100 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32
EPM3128ATC144-10N	Intel	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	128	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 96 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3	98 MHz				20 mm	Yes	96
GAL16V8D-7LJN	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS	18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e3	100 MHz	40 s	8	250 °C (482 °F)	8.9662 mm		8
GAL22V10D-5LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	5.25 V		CMOS	22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	142.8 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
EPM7064AETC44-4N	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	4.5 ns	Yes	3.6 V	64	CMOS	36	PLA-TYPE	3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	2048	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	222.2 MHz		36		10 mm	Yes	36
EPM7128SQI100-10	Intel	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	128	CMOS	84		5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz		84		20 mm	Yes	84
GAL22V10D-25QJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS	22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	33.3 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
ATF1504ASL-20AC100	Atmel	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	64	CMOS			5		3.3/5,5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	83.3 MHz			240 °C (464 °F)	14 mm	Yes	64
EPM3032ALC44-4N	Intel	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	4.5 ns	Yes	3.6 V	32	CMOS			3.3		2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	227.3 MHz				16.5862 mm	Yes	34
EPM7192SQC160-10N	Intel	EE PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	192	CMOS			5		3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 124 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz				28 mm	Yes	124
GAL16V8D-7LJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e3	100 MHz	40 s	8	250 °C (482 °F)	8.9662 mm		8
ISPLSI1016E-125LJN	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS	35	PLA-TYPE	5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	3 Dedicated Inputs, 32 I/O	3	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.59 mm	No		e3	100 MHz	40 s	32	245 °C (473 °F)	16.59 mm	No	32
LC4256ZE-5TN100C	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5.8 ns	Yes	1.9 V	256	CMOS			1.8		1.8 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm		10 Dedicated Inputs, 64 I/O	10		Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	149 MHz	40 s		260 °C (500 °F)	14 mm	Yes	64
LC5512MV-75Q208C	Lattice Semiconductor	EE PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy	9.5 ns	Yes	3.6 V	512	CMOS			3.3		3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm		0 Dedicated Inputs, 149 I/O	0		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		30 s		225 °C (437 °F)	28 mm	Yes	149
M4A3-64/32-10VNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS		PAL-TYPE	3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	62.5 MHz	40 s		260 °C (500 °F)	10 mm	Yes	32
LC4032V-5TN48I	Lattice Semiconductor	EE PLD		Gull Wing	48	TFQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	32		36	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	4 Dedicated Inputs, 32 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e3	156 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
LC4128V-5TN128I	Lattice Semiconductor	EE PLD		Gull Wing	128	LFQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	128		96	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.64SQ,16	Programmable Logic Devices	Yes	Macrocell	3 V	83	.4 mm	105 °C (221 °F)	4 Dedicated Inputs, 92 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G128	3	1.6 mm	14 mm	No		e3	156 MHz	40 s	92	260 °C (500 °F)	14 mm	Yes	92

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.