Flash PLD Programmable Logic Devices (PLD) 1,975

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM240T100C5N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	2.625 V	192	CMOS	80		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3		30 s	80	260 °C (500 °F)	14 mm	Yes	80
EPM570T100C5N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	8.7 ns	Yes	2.625 V	440	CMOS	76		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3		30 s	76	260 °C (500 °F)	14 mm	Yes	76
XC2C128-6VQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	128	CMOS	80	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	152 MHz	30 s	80	260 °C (500 °F)	14 mm	Yes	80
EPM240T100I5N	Intel	Flash PLD		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	2.625 V	192	CMOS	80		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3		30 s	80	260 °C (500 °F)	14 mm	Yes	80
ATF22V10C-15PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS	22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	55.5 MHz		10		31.877 mm		10
XC9572XL-10VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS	34		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	72 Macrocells	e3	100 MHz	30 s	34	260 °C (500 °F)	10 mm	Yes	34
EPM1270T144I5N	Intel	Flash PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	2.625 V	980	CMOS	116		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 116 I/O	0	-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3		30 s	116	260 °C (500 °F)	20 mm	Yes	116
EPM1270T144C5N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	2.625 V	980	CMOS	116		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3		30 s	116	260 °C (500 °F)	20 mm	Yes	116
XC2C64A-7VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 33 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e3	200 MHz	30 s		260 °C (500 °F)	10 mm	Yes	33
XC2C128-7VQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS	80	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	119 MHz	30 s	80	260 °C (500 °F)	14 mm	Yes	80
XC95144XL-10TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	144	CMOS	117		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	138.88 MHz	30 s	117	260 °C (500 °F)	20 mm	Yes	117
EPM240T100C5NAH	Intel	Flash PLD		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	2.625 V	192		80		2.5			Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ		Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm		It can also operate at 3.3 V		104.16 MHz		80		14 mm	Yes	80
XC9572XL-10TQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS	72		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	72 Macrocells	e3	100 MHz	30 s	72	260 °C (500 °F)	14 mm	Yes	72
XC95144XL-10TQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	144	CMOS	81		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	138.88 MHz	30 s	81	260 °C (500 °F)	14 mm	Yes	81
XC9536XL-10VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS	34		3.3	Tray	2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	138.88 MHz	30 s	34	260 °C (500 °F)	10 mm	Yes	34
XC9572XL-10VQG64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS	36		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e3	100 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	52
5M1270ZT144C5N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	1.89 V	980	CMOS			1.8		1.8,1.2/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	114 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3	201.1 MHz				20 mm	Yes	114
XC2C256-7VQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS	80	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3	108 MHz	30 s	80	260 °C (500 °F)	14 mm	Yes	80
EPM570T100I5N	Intel	Flash PLD		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	8.7 ns	Yes	2.625 V	440	CMOS	76		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3		40 s	76	260 °C (500 °F)	14 mm	Yes	76
XC2C384-10TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	384	CMOS	118	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 118 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	83 MHz	30 s	118	260 °C (500 °F)	20 mm	Yes	118
ATF22V10CQZ-20PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V		CMOS	22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	38.5 MHz		10		32 mm		10
5M80ZE64C5N	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	64	CMOS			1.8		1.8,1.2/3.3 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G64	3	1.2 mm	7 mm	No		e3	118.3 MHz	30 s		260 °C (500 °F)	7 mm	Yes	54
5M570ZT100C5N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.7 ns	Yes	1.89 V	440	CMOS			1.8		1.8,1.2/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	74 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	118.3 MHz	30 s		260 °C (500 °F)	14 mm	Yes	74
5M160ZE64C5N	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	128	CMOS			1.8		1.2/3.3,1.8 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e3	118.3 MHz				7 mm	Yes	54
EPM570T144C5N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.7 ns	Yes	2.625 V	440	CMOS	116		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3			116		20 mm	Yes	116
XC95144XL-10TQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	144	CMOS	81		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	138.88 MHz	30 s	81	260 °C (500 °F)	14 mm	Yes	81
5M40ZE64C5N	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V					1.8			Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V		.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	7 mm	No		e3	118.3 MHz				7 mm		54
XC9536XL-10VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS	34		3.3	Tray	2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	138.88 MHz	30 s	34	260 °C (500 °F)	10 mm	Yes	34
XC2C256-7TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS	118	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 118 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Real Digital Design Technology	e3	108 MHz	30 s	118	260 °C (500 °F)	20 mm	Yes	118
XC2C64A-7VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 33 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e3	200 MHz	30 s		260 °C (500 °F)	10 mm	Yes	33
XC2C64A-7QFG48I	Xilinx	Flash PLD	Industrial	No Lead	48	VQCCN	Square		7.5 ns	Yes	1.9 V	64	CMOS			1.8		1.5/3.3,1.8 V	Chip Carrier, Very Thin Profile	LCC48,.27SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 37 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-XQCC-N48	3	1 mm	7 mm	No	Real Digital Design Technology	e3	200 MHz	30 s		260 °C (500 °F)	7 mm	Yes	37
5M570ZT100C4N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	9.5 ns	Yes	1.89 V	440	CMOS			1.8		1.8,1.2/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	74 I/O		0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	184.1 MHz	30 s		260 °C (500 °F)	14 mm	Yes	74
5M1270ZT144I5N	Intel	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	1.89 V	980	CMOS			1.8		1.8,1.2/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	114 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3	201.1 MHz				20 mm	Yes	114
5M240ZT144C5N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	17.7 ns	Yes	1.89 V	192	CMOS	114		1.8		1.8,1.2/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	114 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3	118.3 MHz		114		20 mm	Yes	114
5M160ZT100C5N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	128	CMOS			1.8		1.2/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	79 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e3	118.3 MHz				14 mm	Yes	79
5M240ZT100C5N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	192	CMOS	79		1.8		1.8,1.2/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	79 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	118.3 MHz		79		14 mm	Yes	79
5M80ZT100C5N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	64	CMOS			1.8		1.8,1.2/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	79 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e3	118.3 MHz				14 mm	Yes	79
5M570ZT100I5N	Intel	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.7 ns	Yes	1.89 V	440	CMOS			1.8		1.8,1.2/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	74 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e3	118.3 MHz				14 mm	Yes	74
XC9572XL-10VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS	34		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	72 Macrocells	e3	100 MHz	30 s	34	260 °C (500 °F)	10 mm	Yes	34
EPM570F100I5N	Intel	Flash PLD		Ball	100	LBGA	Square	Plastic/Epoxy	8.7 ns	Yes	2.625 V	440	CMOS	76		2.5		1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1		30 s	76	260 °C (500 °F)	11 mm	Yes	76
ATF22V10C-15JU	Microchip Technology	Flash PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5	Tube	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	2	4.572 mm	11.5062 mm	No		e3	55.5 MHz		10		11.5062 mm		10
XC2C256-7VQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS	80	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3	108 MHz	30 s	80	260 °C (500 °F)	14 mm	Yes	80
ATF22V10C-10PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V		CMOS	22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	90 MHz		10		31.877 mm		10
5M80ZE64I5N	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	64	CMOS			1.8		1.8,1.2/3.3 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V		.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G64	3	1.2 mm	7 mm	No		e3	118.3 MHz	30 s		260 °C (500 °F)	7 mm	Yes	54
ATF22V10C-10JU	Microchip Technology	Flash PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5	Tube	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No		e3	90 MHz		10		11.5062 mm		10
5M240ZT100I5N	Intel	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	192	CMOS	79		1.8		1.8,1.2/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	79 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e3	118.3 MHz		79		14 mm	Yes	79
5M570ZF256C5N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17.7 ns	Yes	1.89 V	440	CMOS			1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	159 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	118.3 MHz	30 s		260 °C (500 °F)	17 mm	Yes	159
EPM570T144I5N	Intel	Flash PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.7 ns	Yes	2.625 V	440	CMOS	116		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 116 I/O	0	-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3		30 s	116	260 °C (500 °F)	20 mm	Yes	116

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.