Flash PLD Programmable Logic Devices (PLD) 1,975

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC2C64A-7PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 33 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Real Digital Design Technology	e0	200 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	33
XC95144XL-10TQ144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	144	CMOS		117		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	144 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e4	81.3 MHz		117		20 mm	Yes	117
5M80ZE64I5	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V						1.8			Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V		.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	118.3 MHz				7 mm		54
ATF16V8C-7JU-T	Microchip Technology	Flash PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V		CMOS				5	Tape and Reel		Chip Carrier				Macrocell	4.75 V		1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 8 I/O	7	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20		4.572 mm	8.966 mm		8 Macrocells	e3	100 MHz				8.966 mm		8
EPM1270GT144C5N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS		116		1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3		30 s	116	260 °C (500 °F)	20 mm	Yes	116
EPM570F256I5N	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	2.625 V	440	CMOS		160		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			160		17 mm	Yes	160
XC2C32A-6VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	LCC32,.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e4	300 MHz				10 mm	Yes	33
XC95144XL-5TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	144	CMOS		117		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	138.88 MHz	30 s	117	260 °C (500 °F)	20 mm	Yes	117
ATF16LV8C-10JU-T	Microchip Technology	Flash PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS				3.3	Tape and Reel		Chip Carrier				Macrocell	3 V		1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 8 I/O	7	-40 °C (-40 °F)		Quad	S-PQCC-J20		4.572 mm	8.966 mm								8.966 mm		8
ATF16V8BQL-15XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns		Yes	5.5 V		CMOS		18	PAL-TYPE	5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	64	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	1	1.2 mm	4.4 mm	No		e3	45 MHz	40 s	8	260 °C (500 °F)	6.5 mm		8
EPM240F100I5N	Intel	Flash PLD		Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.625 V	192	CMOS		80		2.5		1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1			80		11 mm	Yes	80
EPM240GF100I5N	Intel	Flash PLD		Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.89 V	192	CMOS		80		1.8		1.5/3.3,1.8 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1			80		11 mm	Yes	80
EPM570F256C3	Intel	Flash PLD	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	5.4 ns		Yes	2.625 V	440	CMOS		160		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e0			160		17 mm	Yes	160
LCMXO640C-3TN100C4W	Lattice Semiconductor	Flash PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	4.9 ns	640	Yes	3.465 V		CMOS		74		1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm		7 Dedicated Inputs, 74 I/O	7		Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	It can also operate at 2.5 V and 3.3 V	e3	388 MHz	40 s	74	260 °C (500 °F)	14 mm		74
XC2C32A-6CP56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	33 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	300 MHz	30 s		240 °C (464 °F)	6 mm	Yes	33
XC9536XL-7VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS		34		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	138.88 MHz		34		10 mm	Yes	34
XC9572XL-5VQG64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	72	CMOS		36		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e3	178.6 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	52
5M570ZF256I5N	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V	440	CMOS				1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	159 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	118.3 MHz				17 mm	Yes	159
EPM1270F256A5N	Intel	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	980	CMOS		212		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	125 °C (257 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			212		17 mm	Yes	212
EPM1270T144A5N	Intel	Flash PLD	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	980	CMOS		116		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 116 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3			116		20 mm	Yes	116
XC2C256-7CPG132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS		106	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 106 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e1	300 MHz	30 s	106	260 °C (500 °F)	8 mm	Yes	106
XC9572XL-7VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	72	CMOS		36		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e4	125 MHz		36		10 mm	Yes	52
EPM2210F324C5	Intel	Flash PLD	Commercial Extended	Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS		272		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e0			272		19 mm	Yes	272
EPM570GM100C5N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS		76		1.8		1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1			76		6 mm	Yes	76
EPM570ZM100C6N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS		76		1.8		1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1			76		6 mm	Yes	76
EPM570ZM100C7N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	15.1 ns		Yes	1.89 V	440	CMOS		76		1.8		1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1		30 s	76	260 °C (500 °F)	6 mm	Yes	76
LCMXO2280C-3TN100I4W	Lattice Semiconductor	Flash PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5.1 ns	2280	Yes	3.465 V		CMOS		73		1.8		1.8/2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm		7 Dedicated Inputs, 73 I/O	7		Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	It can also operate at 2.5 V and 3.3 V	e3	388 MHz	40 s	73	260 °C (500 °F)	14 mm		73
LCMXO640C-3TN100I4W	Lattice Semiconductor	Flash PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	4.9 ns	640	Yes	3.465 V		CMOS		74		1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm		7 Dedicated Inputs, 74 I/O	7		Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	It can also operate at 2.5 V and 3.3 V	e3	388 MHz	40 s	74	260 °C (500 °F)	14 mm		74
XC2C128-7CPG132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	119 MHz	30 s	100	260 °C (500 °F)	8 mm	Yes	100
XC95108-10PQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns		Yes	5.5 V	108	CMOS		81		5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	66.7 MHz	30 s	81	225 °C (437 °F)	20 mm	Yes	81
XC9536XL-7CSG48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS		36		3.3		2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	138.88 MHz	30 s	36	260 °C (500 °F)	7 mm	Yes	36
ATF22V10CQZ-20SC	Microchip Technology	Flash PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	20 ns		Yes	5.25 V		CMOS				5			Small Outline				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm				38.5 MHz				15.4 mm		10
EPM570T100C4N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	440	CMOS		76		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			76		14 mm	Yes	76
5M1270ZT144C4	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.1 ns		Yes	1.89 V						1.8			Flatpack, Low Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	85 °C (185 °F)	114 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e0	247.5 MHz				20 mm		114
5M240ZM100I5N	Intel	Flash PLD	Industrial	Ball	100	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	192	CMOS		79		1.8		1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	79 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	118.3 MHz		79		6 mm	Yes	79
ATF16V8C-7SU	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	7.5 ns		Yes	5.25 V		CMOS		18	PAL-TYPE	5	Tube	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 8 I/O	7	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20		2.65 mm	7.5 mm	No	8 Macrocells	e3	100 MHz		8		12.8 mm		8
ATF22V10CQZ-20JC	Microchip Technology	Flash PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V		CMOS				5			Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.572 mm	11.506 mm				38.5 MHz				11.506 mm		10
ATF22V10CQZ-20JI	Microchip Technology	Flash PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.5 V		CMOS				5			Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Quad	S-PQCC-J28		4.572 mm	11.506 mm				38.5 MHz				11.506 mm		10
XC2C128-7VQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS		80	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	119 MHz		80		14 mm	Yes	80
XC2C64A-7PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 33 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Real Digital Design Technology	e3	200 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	33
XC95288XL-10FGG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS		192		3.3		2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	100 MHz	30 s	192	260 °C (500 °F)	17 mm	Yes	192
XC95288XL-6FG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V	288	CMOS		192		3.3		2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	208.3 MHz	30 s	192	225 °C (437 °F)	17 mm	Yes	192
XC9572XL-5TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	72	CMOS		72		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	72 Macrocells	e4	178.6 MHz		72		14 mm	Yes	72
XC9572XL-5TQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	72	CMOS		72		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	72 Macrocells	e3	178.6 MHz	30 s	72	260 °C (500 °F)	14 mm	Yes	72
5M1270ZF256A5N	Intel	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic	10 ns		Yes	1.89 V	980	CMOS	AEC-Q100					1.8,1.2/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes		1.71 V		1 mm	105 °C (221 °F)	0 Dedicated Inputs, 211 I/O		-40 °C (-40 °F)		Bottom	S-PBGA-B256			17 mm	No							17 mm	Yes
XC2C128-6CPG132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	152 MHz	30 s	100	260 °C (500 °F)	8 mm	Yes	100
5M570ZT144A5N	Altera	Flash PLD	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	17.7 ns		Yes		440	CMOS						1.8,1.2/3.3 V	Flatpack	QFP144,.87SQ,20	Programmable Logic Devices	Yes				.5 mm	105 °C (221 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G144				No								Yes
5M570ZT144C4	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V						1.8			Flatpack, Low Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	85 °C (185 °F)	114 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e0	184.1 MHz				20 mm		114

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.