Flash PLD Programmable Logic Devices (PLD) 1,975

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
5M570ZT144C5	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	17.7 ns	Yes	1.89 V						1.8			Flatpack, Low Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	85 °C (185 °F)	114 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e0	118.3 MHz				20 mm		114
ATF16V8B-15PC	Atmel	Flash PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	45 MHz		8		25.908 mm		8
ATF22V10B-7JC	Atmel	Flash PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	2	4.57 mm	11.5062 mm	No	10 Macrocells; 1 External Clock; Register Preload; Power-Up Reset; Shared Input/Clock	e0	125 MHz		10	225 °C (437 °F)	11.5062 mm		10
EPM570GT100C5N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	8.7 ns	Yes	1.89 V	440	CMOS		76		1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			76		14 mm	Yes	76
5M80ZT100A5N	Intel	Flash PLD	Industrial	Gull Wing	100	QFP	Square	Plastic	14 ns	Yes		64	CMOS	AEC-Q100					1.8,1.2/3.3 V	Flatpack	TQFP100,.63SQ	Programmable Logic Devices	Yes				.5 mm	105 °C (221 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G100				No								Yes
EPM2210F256C4N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	9.1 ns	Yes	2.625 V	1700	CMOS		204		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	204	260 °C (500 °F)	17 mm	Yes	204
EPM240T100I3N	Intel	Flash PLD		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	4.7 ns	Yes	2.625 V	192	CMOS		80		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			80		14 mm	Yes	80
XC2C512-10PQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	512	CMOS		173	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	91 MHz	30 s	173	245 °C (473 °F)	28 mm	Yes	173
XC95288XL-7TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	288	CMOS		117		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	125 MHz	30 s	117	260 °C (500 °F)	20 mm	Yes	117
ATF22V10CZ-15PI	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				55.5 MHz				31.877 mm		10
EPM240T100C4	Intel	Flash PLD	Commercial Extended	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6.1 ns	Yes	2.625 V	192	CMOS		80		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e0			80		14 mm	Yes	80
EPM240ZM100C6N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	7.9 ns	Yes	1.89 V	192	CMOS		80		1.8		1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1			80		6 mm	Yes	80
XC95288XL-6FGG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	288	CMOS		192		3.3		2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	208.3 MHz	30 s	192	260 °C (500 °F)	17 mm	Yes	192
XC95288XL-7BGG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	288	CMOS		192		3.3		2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	125 MHz	30 s	192	250 °C (482 °F)	27 mm	Yes	192
XC9536XL-5VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	36	CMOS		34		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	138.88 MHz		34		10 mm	Yes	34
XC9572XL-5VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	72	CMOS		34		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	72 Macrocells	e4	178.6 MHz		34		10 mm	Yes	34
5M2210ZF324C4N	Intel	Flash PLD	Other	Ball	324	LBGA	Square	Plastic/Epoxy	9.1 ns	Yes	1.89 V	1700	CMOS		271		1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	271 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.55 mm	19 mm	No		e1	247.5 MHz		271		19 mm	Yes	271
ATF16V8C-7PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V		CMOS		18	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	85 °C (185 °F)	7 Dedicated Inputs, 8 I/O	7	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	8 Macrocells	e3	100 MHz		8		25.908 mm		8
ATF22V10CZ-12PC	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				55.5 MHz				31.877 mm		10
EPM570GT144C3N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5.4 ns	Yes	1.89 V	440	CMOS		116		1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3			116		20 mm	Yes	116
XC2C384-10FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	384	CMOS		212	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	83 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
XC95144XL-7TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	144	CMOS		117		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	125 MHz		117		20 mm	Yes	117
XC95144XL-7TQG144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	144	CMOS		117		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	138.88 MHz	30 s	117	260 °C (500 °F)	20 mm	Yes	117
XC95288XL-10FGG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		192		3.3		2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	100 MHz	30 s	192	260 °C (500 °F)	17 mm	Yes	192
XC95288XL-10PQ208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		168		3.3		2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 168 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	100 MHz		168		28 mm	Yes	168
XC95288XL-10PQG208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		168		3.3		2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 168 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	100 MHz	30 s	168	245 °C (473 °F)	28 mm	Yes	168
XC9536XL-10CSG48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS		36		3.3		2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	138.88 MHz	30 s	36	260 °C (500 °F)	7 mm	Yes	36
EPM240T100I3	Intel	Flash PLD		Gull Wing	100	QFP	Square	Plastic	4.7 ns	Yes	2.625 V	192	CMOS		80				1.5/3.3,2.5/3.3 V	Flatpack	TQFP100,.63SQ	Programmable Logic Devices	Yes		2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3		14 mm	No		e0	166.66 MHz		80		14 mm	Yes	80
EPM570GT144C4N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7 ns	Yes	1.89 V	440	CMOS		116		1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3			116		20 mm	Yes	116
EPM570GT144C5N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.7 ns	Yes	1.89 V	440	CMOS		116		1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3			116		20 mm	Yes	116
PALCE22V10-10JCR	Cypress Semiconductor	Flash PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS				5			Chip Carrier				Macrocell	4.75 V			75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28				No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms		76.9 MHz						10
PALCE22V10-10JCT	Cypress Semiconductor	Flash PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS				5			Chip Carrier				Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.572 mm	11.5316 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms		76.9 MHz				11.5316 mm		10
XC2C32A-6CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	300 MHz	30 s		240 °C (464 °F)	6 mm	Yes	33
XC95108-10TQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	HLFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	108	CMOS				5		3.3/5,5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm	Yes	81
XC9536-15VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	36	CMOS				5		3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	55.6 MHz	30 s		240 °C (464 °F)	10 mm	Yes	34
5M1270ZF256C4N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8.1 ns	Yes	1.89 V	980	CMOS				1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	211 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	247.5 MHz				17 mm	Yes	211
5M1270ZF324C5N	Intel	Flash PLD	Other	Ball	324	LBGA	Square	Plastic/Epoxy	11.2 ns	Yes	1.89 V	980	CMOS				1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	271 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.55 mm	19 mm	No		e1	201.1 MHz				19 mm	Yes	271
5M1270ZT144C5	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	1.89 V						1.8			Flatpack, Low Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	85 °C (185 °F)	114 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e0	201.1 MHz				20 mm		114
5M2210ZF256I5	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	11.2 ns	Yes	1.89 V	1700	CMOS		203		1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	203 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	201.1 MHz		203		17 mm	Yes	203
5M40ZE64C4	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns	Yes	1.89 V						1.8			Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V		.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	184.1 MHz				7 mm		54
5M570ZT100I5	Intel	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.7 ns	Yes	1.89 V						1.8			Flatpack, Thin Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	100 °C (212 °F)	74 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e0	118.3 MHz				14 mm		74
5M80ZM68C5N	Intel	Flash PLD	Other	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	64	CMOS				1.8		1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	52 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	118.3 MHz				5 mm	Yes	52
ATF16V8C-5JX	Microchip Technology	Flash PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5	Tube	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 8 I/O	7	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J20		4.572 mm	8.966 mm	No	8 Macrocells	e3	142 MHz		8		8.966 mm		8
ATF16V8CZ-15XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			PAL-TYPE	5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	64	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	1	1.2 mm	4.4 mm	No		e3	45 MHz	40 s	8	260 °C (500 °F)	6.5 mm		8
ATF22V10C-10PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	Shared Input/Clock	e0	90 MHz		10		31.877 mm		10
ATF22V10C-15PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e0	55.5 MHz		10		31.877 mm		10
ATF22V10C-7JU	Microchip Technology	Flash PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No		e3	125 MHz		10		11.5062 mm		10
ATF22V10CZ-15PC	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				55.5 MHz				31.877 mm		10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.