Flash PLD Programmable Logic Devices (PLD) 1,975

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC2C512-10FGG324I	Xilinx	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	512	CMOS		270	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 270 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	91 MHz	30 s	270	250 °C (482 °F)	23 mm	Yes	270
XC9536XL-10CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	36	CMOS		36		3.3		2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	100 MHz	30 s	36	240 °C (464 °F)	7 mm	Yes	36
5M160ZE64C4	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V						1.8			Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V		.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	184.1 MHz				7 mm		54
5M160ZE64C5	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V						1.8			Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V		.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	118.3 MHz				7 mm		54
5M2210ZF256C4	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.1 ns		Yes	1.89 V	1700	CMOS		203		1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	247.5 MHz		203		17 mm	Yes	203
5M570ZF256C4N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS				1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	159 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	184.1 MHz				17 mm	Yes	159
5M570ZM100C5N	Intel	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V	440	CMOS				1.8		1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	74 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	118.3 MHz				6 mm	Yes	74
5M570ZT100C4	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V						1.8			Flatpack, Thin Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	85 °C (185 °F)	74 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e0	184.1 MHz				14 mm		74
ATF16V8BQL-15PI	Atmel	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No		e0	45 MHz		8		25.908 mm		8
ATF22V10C-10NM/883	Microchip Technology	Flash PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns		Yes	5.5 V		CMOS	MIL-STD-883	22	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 10 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.54 mm	11.4554 mm	No			90 MHz		10		11.455 mm		10
ATF22V10CQ-15PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e0	55.5 MHz		10		31.877 mm		10
EPM1270T144C5	Intel	Flash PLD	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	980	CMOS		116		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e0			116		20 mm	Yes	116
EPM2210F324C3	Intel	Flash PLD	Commercial Extended	Ball	324	BGA	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	1700	CMOS		272		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e0			272		19 mm	Yes	272
EPM2210F324C4	Intel	Flash PLD	Commercial Extended	Ball	324	BGA	Square	Plastic/Epoxy	9.1 ns		Yes	2.625 V	1700	CMOS		272		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e0			272		19 mm	Yes	272
EPM2210F324I5	Intel	Flash PLD		Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS		272		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 272 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e0			272		19 mm	Yes	272
EPM240GT100C5	Intel	Flash PLD	Commercial Extended	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.89 V	192	CMOS		80		1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0			80		14 mm	Yes	80
EPM240M100C4N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	6.1 ns		Yes	2.625 V	192	CMOS		80		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1		30 s	80	260 °C (500 °F)	6 mm	Yes	80
EPM570GM100I5N	Intel	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS		76		1.8		1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1			76		6 mm	Yes	76
XC2C256-6VQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS		80	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e4	139 MHz		80		14 mm	Yes	80
XC2C256-7PQG208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS		173	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 173 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Real Digital Design Technology	e3	108 MHz	30 s	173	245 °C (473 °F)	28 mm	Yes	173
XC2C32A-4CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	4 ns		Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	450 MHz	30 s		260 °C (500 °F)	6 mm	Yes	33
XC2C64A-7CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	200 MHz	30 s		240 °C (464 °F)	6 mm	Yes	45
XC95108-10PQ160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	HQFP	Rectangular	Plastic/Epoxy	10 ns		Yes	5.25 V	108	CMOS				5		3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G160	3	4.1 mm	28 mm	No		e0		30 s		225 °C (437 °F)	28 mm	Yes	108
XC95108-15PC84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	108	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0		30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XC95108-7PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	7.5 ns		Yes	5.25 V	108	CMOS				5		3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0		30 s		225 °C (437 °F)	20 mm	Yes	81
XC9536-15PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	36	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9572-10TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	14 mm	Yes	72
XC9572-15PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	55.6 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XC9572-15PCG84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	29.3116 mm	Yes	69
XC9572XL-10VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	72	CMOS		36		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e4	100 MHz		36		10 mm	Yes	52
5M160ZE64I5	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V						1.8			Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V		.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	118.3 MHz				7 mm		54
5M40ZE64I5	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V						1.8			Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V		.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	118.3 MHz				7 mm		54
5M570ZT100C5	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V						1.8			Flatpack, Thin Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	85 °C (185 °F)	74 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e0	118.3 MHz				14 mm		74
5M80ZE64C4	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V						1.8			Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V		.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	184.1 MHz				7 mm		54
EPM1270GM256I5N	Intel	Flash PLD		Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS		212		1.8		1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
EPM1270T144C3	Intel	Flash PLD	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6.2 ns		Yes	2.625 V	980	CMOS		116		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e0			116		20 mm	Yes	116
EPM1270T144C4	Intel	Flash PLD	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.1 ns		Yes	2.625 V	980	CMOS		116		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e0			116		20 mm	Yes	116
EPM2210F256A5N	Intel	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS		204		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	125 °C (257 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM2210F256I5	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS		204		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e0			204		17 mm	Yes	204
EPM2210GF256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS		204		1.8		1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM240ZM68C6N	Intel	Flash PLD	Other	Ball	68	BGA	Rectangular	Plastic/Epoxy	7.9 ns		Yes	1.89 V	192	CMOS		54		1.8		1.5/3.3,1.8 V	Grid Array	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B68	3		5 mm	No	It can also operate at 3.3 V	e1			54		5 mm	Yes	54
EPM240ZM68C7N	Intel	Flash PLD	Other	Ball	68	BGA	Rectangular	Plastic/Epoxy	12 ns		Yes	1.89 V	192	CMOS		54		1.8		1.5/3.3,1.8 V	Grid Array	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B68	3		5 mm	No	It can also operate at 3.3 V	e1			54		5 mm	Yes	54
EPM570GT100I5N	Intel	Flash PLD		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS		76		1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			76		14 mm	Yes	76
LCMXO2280C-5TN144C4W	Lattice Semiconductor	Flash PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3.6 ns	2280	Yes	3.465 V		CMOS		113		1.8		1.8/2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm		7 Dedicated Inputs, 113 I/O	7		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 2.5 V and 3.3 V	e3	388 MHz	40 s	113	260 °C (500 °F)	20 mm		113
XA2C64A-7VQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	64	CMOS	AEC-Q100			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	14 mm	Yes	64
XC2C128-6TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	152 MHz	30 s	100	260 °C (500 °F)	20 mm	Yes	100
XC2C256-6FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS		184	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 184 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e1	139 MHz	30 s	184	260 °C (500 °F)	17 mm	Yes	184
XC2C256-6VQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS		80	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3	139 MHz	30 s	80	260 °C (500 °F)	14 mm	Yes	80

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.