Flash PLD Programmable Logic Devices (PLD) 1,975

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM240T100I4N	Intel	Flash PLD		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6.1 ns	Yes	2.625 V	192	CMOS		80		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			80		14 mm	Yes	80
XA2C64A-8VQG44Q	Xilinx	Flash PLD	Automotive	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS	AEC-Q100			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	125 °C (257 °F)	0 Dedicated Inputs, 33 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	10 mm	Yes	33
ATF16V8C-7JU	Microchip Technology	Flash PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5	Tube	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 8 I/O	7	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20		4.572 mm	8.966 mm	No	8 Macrocells	e3	100 MHz		8		8.966 mm		8
XC95288XL-10TQ144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		117		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	288 Macrocells	e4	100 MHz		117		20 mm	Yes	117
ATF22V10CQZ-20PC	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				38.5 MHz				31.877 mm		10
EPM1270T144C4N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.1 ns	Yes	2.625 V	980	CMOS		116		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3		40 s	116	260 °C (500 °F)	20 mm	Yes	116
XC2C32A-4VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	4 ns	Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	LCC32,.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e4	450 MHz				10 mm	Yes	33
XC95144XL-10CSG144C	Xilinx	Flash PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	144	CMOS		117		3.3		2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	138.88 MHz	30 s	117	260 °C (500 °F)	12 mm	Yes	117
5M240ZT100A5N	Intel	Flash PLD	Industrial	Gull Wing	100	QFP	Square	Plastic	17.7 ns	Yes	1.89 V	192	CMOS						1.8,1.2/3.3 V	Flatpack	TQFP100,.63SQ	Programmable Logic Devices	Yes		1.71 V		.5 mm	105 °C (221 °F)	0 Dedicated Inputs, 79 I/O		-40 °C (-40 °F)		Quad	S-PQFP-G100			14 mm	No							14 mm	Yes
ATF22V10C-5JX	Microchip Technology	Flash PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	142 MHz		10		11.5062 mm		10
5M1270ZT144I5	Intel	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	1.89 V						1.8			Flatpack, Low Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	100 °C (212 °F)	114 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e0	201.1 MHz				20 mm		114
XC9572XL-10VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS		34		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	72 Macrocells	e4	100 MHz		34		10 mm	Yes	34
5M1270ZF256C5N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	1.89 V	980	CMOS				1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	211 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	201.1 MHz				17 mm	Yes	211
EPM570F256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns	Yes	2.625 V	440	CMOS		160		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			160		17 mm	Yes	160
XC95144XL-7TQ144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	144	CMOS		117		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	138.88 MHz		117		20 mm	Yes	117
XC9536XL-10CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS		36		3.3		2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	138.88 MHz	30 s	36	260 °C (500 °F)	7 mm	Yes	36
5M1270ZT144C4N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.1 ns	Yes	1.89 V	980	CMOS				1.8		1.8,1.2/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	114 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3	247.5 MHz				20 mm	Yes	114
ATF16LV8C-10JU	Microchip Technology	Flash PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	3.3	Tube	3.3/5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	3 V	64	1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 8 I/O	7	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20		4.572 mm	8.966 mm	No		e3	71 MHz		8		8.966 mm		8
XC2C64A-5VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 33 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e4	333 MHz				10 mm	Yes	33
XC2C128-7TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	119 MHz	30 s	100	260 °C (500 °F)	20 mm	Yes	100
XC2C64A-7VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 33 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e4	200 MHz				10 mm	Yes	33
XC9536XL-10VQG64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS		36		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3	138.88 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	36
EPM1270M256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns	Yes	2.625 V	980	CMOS		212		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
XC95144XL-10TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	144	CMOS		81		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	144 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e4	81.3 MHz		81		14 mm	Yes	81
ATF1500A-10JU	Microchip Technology	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	32					5	Tube		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.586 mm	No		e3	76.9 MHz	40 s		245 °C (473 °F)	16.586 mm		32
ATF22V10CQZ-20PI	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				38.5 MHz				31.877 mm		10
5M160ZE64C4N	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns	Yes	1.89 V	128	CMOS				1.8		1.2/3.3,1.8 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e3	184.1 MHz				7 mm	Yes	54
5M570ZT144C4N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	9.5 ns	Yes	1.89 V	440	CMOS				1.8		1.8,1.2/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	114 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3	184.1 MHz				20 mm	Yes	114
ATF16V8B-10JU	Microchip Technology	Flash PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS			PAL-TYPE	5	Tube	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20		4.572 mm	8.966 mm	No		e3	68 MHz		8		8.966 mm		8
XC2C512-10PQG208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	512	CMOS		173	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 173 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	91 MHz	30 s	173	245 °C (473 °F)	28 mm	Yes	173
XC2C64A-7CP56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 45 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	200 MHz	30 s		240 °C (464 °F)	6 mm	Yes	45
5M1270ZF256I5N	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	1.89 V	980	CMOS				1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	211 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	201.1 MHz				17 mm	Yes	211
5M240ZT100I5	Intel	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	192			79		1.8			Flatpack, Thin Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	100 °C (212 °F)	79 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e0	118.3 MHz		79		14 mm		79
EPM2210F324I5N	Intel	Flash PLD		Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns	Yes	2.625 V	1700	CMOS		272		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 272 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e1		30 s	272	260 °C (500 °F)	19 mm	Yes	272
EPM240T100I5	Intel	Flash PLD		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	2.625 V	192	CMOS		80		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e0			80		14 mm	Yes	80
XA9572XL-15VQG44Q	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15.5 ns	Yes	3.6 V		CMOS	AEC-Q100; TS 16949			3.3			Flatpack, Thin Profile				Macrocell	3 V		.8 mm	105 °C (221 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm		34
5M240ZM100C5N	Intel	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	192	CMOS		79		1.8		1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	79 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	118.3 MHz		79		6 mm	Yes	79
5M80ZE64C4N	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns	Yes	1.89 V	64	CMOS				1.8		1.8,1.2/3.3 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e3	184.1 MHz				7 mm	Yes	54
EPM240M100I5N	Intel	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.625 V	192	CMOS		80		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1		30 s	80	260 °C (500 °F)	6 mm	Yes	80
XC2C32A-6CPG56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	33 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	300 MHz	30 s		260 °C (500 °F)	6 mm	Yes	33
XC9572XL-7TQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS		72		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	72 Macrocells	e3	125 MHz	30 s	72	260 °C (500 °F)	14 mm	Yes	72
5M40ZM64I5N	Intel	Flash PLD	Industrial	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns	Yes	1.89 V						1.8			Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	100 °C (212 °F)	30 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	118.3 MHz				4.5 mm		30
EPM240T100C3	Intel	Flash PLD	Commercial Extended	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	4.7 ns	Yes	2.625 V	192	CMOS		80		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e0			80		14 mm	Yes	80
XC2C128-7VQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS		80	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	119 MHz	30 s	80	240 °C (464 °F)	14 mm	Yes	80
EPM1270GT144C4N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.1 ns	Yes	1.89 V	980	CMOS		116		1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3			116		20 mm	Yes	116
XC2C128-7TQG144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	119 MHz	30 s	100	260 °C (500 °F)	20 mm	Yes	100
XC2C256-7VQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS		80	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e0	108 MHz	30 s	80	240 °C (464 °F)	14 mm	Yes	80
XC2C64A-5CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	333 MHz	30 s		240 °C (464 °F)	6 mm	Yes	45

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.