Flash PLD Programmable Logic Devices (PLD) 1,975

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM570T100I4N	Intel	Flash PLD		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	440	CMOS		76		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			76		14 mm	Yes	76
PALCE16V8-25JC	Cypress Semiconductor	Flash PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.25 V		CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20		4.57 mm	8.9662 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset	e0	37 MHz		8		8.9662 mm		8
PALCE16V8-7JC	Cypress Semiconductor	Flash PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V		CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20		4.57 mm	8.9662 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset	e0	100 MHz		8		8.9662 mm		8
XA2C256-7VQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS	AEC-Q100			1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real digital design technology, XILIK00225-1	e3	141 MHz	30 s		260 °C (500 °F)	14 mm	Yes	80
XA2C256-8TQG144Q	Xilinx	Flash PLD	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS	AEC-Q100			1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Real digital design technology, XILIK00255-1	e3	130 MHz	30 s		260 °C (500 °F)	20 mm	Yes	118
XA2C256-8VQG100Q	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS	AEC-Q100			1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	105 °C (221 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3	130 MHz	30 s		260 °C (500 °F)	14 mm	Yes	80
XC2C384-7TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	384	CMOS		118	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 118 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	112 MHz	30 s	118	260 °C (500 °F)	20 mm	Yes	118
XC95144-7PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns		Yes	5.25 V	144	CMOS				5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	83.3 MHz	30 s		245 °C (473 °F)	20 mm	Yes	81
XC95216-10PQ160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	216	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 133 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	3.7 mm	28 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	28 mm	Yes	133
XC9536-10PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	66.7 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9536XL-7VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS		36		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e4	125 MHz		36		10 mm	Yes	36
XC9572-10PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	72	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	66.7 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9572-10PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns		Yes	5.25 V	72	CMOS				5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	20 mm	Yes	72
XC9572-15PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	55.6 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
5M2210ZF324I5N	Intel	Flash PLD	Industrial	Ball	324	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS		271		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	271 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e1	201.1 MHz	30 s	271	260 °C (500 °F)	19 mm	Yes	271
5M240ZM68C5N	Intel	Flash PLD	Other	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	192	CMOS		52		1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	52 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	118.3 MHz		52		5 mm	Yes	52
5M40ZM64C4	Intel	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V						1.8		Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e0	184.1 MHz				4.5 mm		30
5M80ZM64C5N	Intel	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	64	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	118.3 MHz				4.5 mm	Yes	30
5M80ZT100C4N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	64	CMOS				1.8	1.8,1.2/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	79 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e3	184.1 MHz				14 mm	Yes	79
ATF1500A-12JC	Atmel	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns		Yes	5.25 V	32	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	2	4.572 mm	16.586 mm	No		e0	62.5 MHz			225 °C (437 °F)	16.586 mm	No	32
ATF1500AL-20AC	Atmel	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	32	CMOS				5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	40 MHz				10 mm	No	32
ATF16V8B-15GM	Atmel	Flash PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns		No	5.5 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	45 MHz		8		24.35 mm		8
ATF22V10B-15PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.06 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Register Preload; Power-Up Reset; Shared Input/Clock	e0	55.5 MHz		10		32 mm		10
EPM1270GF256I5	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS		212		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0			212		17 mm	Yes	212
EPM1270GM256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS		212		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
EPM1270GT144I5N	Intel	Flash PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS		116		1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 116 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3			116		20 mm	Yes	116
EPM2210F256A5	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS		204		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	124 °C (255.2 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3		17 mm	No		e0			204		17 mm	Yes	204
EPM2210F256C3N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	1700	CMOS		204		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM2210GF256C3N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes	1.89 V	1700	CMOS		204		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	204	260 °C (500 °F)	17 mm	Yes	204
EPM240GF100C5N	Intel	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.89 V	192	CMOS		80		1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1			80		11 mm	Yes	80
EPM240GT100C4N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6.1 ns		Yes	1.89 V	192	CMOS		80		1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			80		14 mm	Yes	80
EPM240GT100I5N	Intel	Flash PLD		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.89 V	192	CMOS		80		1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			80		14 mm	Yes	80
EPM570GT144I5	Intel	Flash PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS		116		1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 116 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0			116		20 mm	Yes	116
EPM570T144C3N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5.4 ns		Yes	2.625 V	440	CMOS		116		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3		30 s	116	260 °C (500 °F)	20 mm	Yes	116
EPM570T144C4N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	440	CMOS		116		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3			116		20 mm	Yes	116
LCMXO256C-3M100C4W	Lattice Semiconductor	Flash PLD		Ball	100	LFBGA	Square	Plastic/Epoxy	4.9 ns	256	Yes	3.465 V		CMOS		78		1.8	1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA100,14X14,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm		7 Dedicated Inputs, 78 I/O	7		Tin Lead	Bottom	S-PBGA-B100	3	1.35 mm	8 mm	No	It can also operate at 2.5 V and 3.3 V	e0	388 MHz	30 s	78	240 °C (464 °F)	8 mm		78
PALC22V10D-15KMB	Cypress Semiconductor	Flash PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	15 ns		Yes	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	Flatpack	FL24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDFP-F24				No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz		10				10
PALCE16V8-10DMB	Cypress Semiconductor	Flash PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns		No	5.5 V		CMOS	38535Q/M;38534H;883B	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset	e0	58 MHz		8		24.13 mm		8
PALCE16V8-15PC	Cypress Semiconductor	Flash PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		4.826 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset	e0	45.5 MHz		8		25.527 mm		8
PALCE20V8-15PC	Cypress Semiconductor	Flash PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.826 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	45.5 MHz		8		31.75 mm		8
PALCE22V10-15KMB	Cypress Semiconductor	Flash PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	15 ns		Yes	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	Flatpack	FL24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDFP-F24		2.286 mm	9.652 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz		10		15.367 mm		10
PALCE22V10-5PC	Cypress Semiconductor	Flash PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	5 ns		No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.826 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	143 MHz		10		30.099 mm		10
XA2C384-11TQG144Q	Xilinx	Flash PLD	Automotive	Flat	144	QFF	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	384	CMOS	AEC-Q100	118	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-F144	3	1.6 mm	20 mm	No		e3	85 MHz	30 s	118	260 °C (500 °F)	20 mm	Yes	118
XA9572XL-15VQG64Q	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	15.5 ns		Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V		.5 mm	105 °C (221 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm		52
XC2C128-6VQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	128	CMOS		80	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	152 MHz		80		14 mm	Yes	80
XC2C256-6CPG132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS		106	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 106 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e1	139 MHz	30 s	106	260 °C (500 °F)	8 mm	Yes	106
XC2C256-7FT256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS		184	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 184 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e0	108 MHz	30 s	184	225 °C (437 °F)	17 mm	Yes	184
XC2C256-7VQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS		80	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e0	108 MHz	30 s	80	240 °C (464 °F)	14 mm	Yes	80

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.