Flash PLD Programmable Logic Devices (PLD) 1,975

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC9536XV-3VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V						2.5		Flatpack, Thin Profile				Registered	2.4 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0					10 mm		34
XC95216-10PQG160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	216	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 133 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	3.7 mm	28 mm	No		e3	66.7 MHz	30 s		245 °C (473 °F)	28 mm	Yes	133
XC95288-15HQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell	4.75 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	28 mm		168
XA2C256-7TQG144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS	AEC-Q100			1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Real digital design technology, XILIK00255-1	e3	141 MHz	30 s		260 °C (500 °F)	20 mm	Yes	118
XC9572F-15PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	72	CMOS				5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	56 MHz	30 s		225 °C (437 °F)	20 mm	Yes	72
XC95108-15PQ160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	HQFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G160	3	4.1 mm	28 mm	No		e0		30 s		225 °C (437 °F)	28 mm	Yes	108
XC2C384-6TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	384	CMOS				1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 118 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0		30 s		225 °C (437 °F)	20 mm	Yes	118
XC2C32A-3CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	3 ns	Yes	1.9 V		CMOS				1.8		Grid Array, Low Profile, Fine Pitch				Macrocell	1.7 V	.5 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e0	500 MHz				6 mm		33
XC95216-10BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	216	CMOS				5	3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 166 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	66.7 MHz	30 s		225 °C (437 °F)	35 mm	Yes	166
XC9572XV-4TQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	4 ns	Yes	2.62 V						2.5		Flatpack, Low Profile, Fine Pitch				Macrocell	2.37 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	250 MHz	30 s		260 °C (500 °F)	14 mm		72
XC95108F-20PQG160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	20 ns	Yes	5.25 V		CMOS				5		Flatpack				Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e3	50 MHz	30 s		245 °C (473 °F)	28 mm		108
XC95288XV-10TQ144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	2.62 V	288	CMOS				2.5	1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	100 MHz	30 s		225 °C (437 °F)	20 mm	Yes	117
XC2C384-10FGG324C	Xilinx	Flash PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	384	CMOS		240	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 240 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	83 MHz	30 s	240	250 °C (482 °F)	23 mm	Yes	240
XC95576-12HQG304	Xilinx	Flash PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		232 I/O			Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No	3.3 or 5 V I/O Capability	e3	100 MHz				40 mm		232
XC9536F-15PC44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	56 MHz				16.5862 mm		34
XC95108-7PQG160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	HQFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V	.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G160	3	4.1 mm	28 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3		30 s		245 °C (473 °F)	28 mm	Yes	108
XC95144-15PQ160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	144	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 133 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0	55.6 MHz	30 s		225 °C (437 °F)	28 mm	Yes	133
XC95216-10BGG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS				5		Grid Array, Low Profile				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 166 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e1	66.7 MHz	30 s		260 °C (500 °F)	35 mm		166
XA9572XL-10VQG44Q	Xilinx	Flash PLD	Automotive	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS	AEC-Q100			3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	125 °C (257 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm	Yes	34
XC9536F-15PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	56 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC9536F-7VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	83 MHz	30 s		240 °C (464 °F)	10 mm	Yes	34
XC2C64-5VQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS				1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	14 mm	Yes	64
XC2C64-5PC44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS				1.8	1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 33 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0		30 s		225 °C (437 °F)	16.5862 mm	Yes	33
XC9536-15PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC95144-10PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	144	CMOS				5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	67.7 MHz	30 s		245 °C (473 °F)	20 mm	Yes	81
XC95288XV-7CS280I	Xilinx	Flash PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	288	CMOS				2.5	1.8/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	125 MHz	30 s		240 °C (464 °F)	16 mm	Yes	192
XC9536XL-10PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS				3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3		30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC95288-20BGG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns	Yes	5.25 V		CMOS				5		Grid Array, Low Profile				Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	50 MHz	30 s		260 °C (500 °F)	35 mm		192
XC95108F-15PQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5		Flatpack				Macrocell	4.5 V	.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	56 MHz				20 mm		81
XC9536-10VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	36	CMOS		34		5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	66.7 MHz	30 s	34	240 °C (464 °F)	10 mm	Yes	34
XC2C128-6TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	152 MHz		100		20 mm	Yes	100
XC95108F-20PC84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	50 MHz				29.3116 mm		69
XC2C32A-4PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	4 ns	Yes	1.9 V	32	CMOS				1.8	1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	1.27 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Real Digital Design Technology	e3	450 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	33
XC9536-15VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	36	CMOS				5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	55.6 MHz	30 s		260 °C (500 °F)	10 mm	Yes	34
XC95288XL-10CSG280I	Xilinx	Flash PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	100 MHz	30 s	192	260 °C (500 °F)	16 mm	Yes	192
XC9536F-15VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5		Flatpack, Thin Profile				Macrocell	4.5 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	56 MHz				10 mm		34
XA95144XL-15CSG144I	Xilinx	Flash PLD	Industrial	Ball	144	BGA	Square	Plastic/Epoxy	15.5 ns	Yes	3.6 V		CMOS				3.3		Grid Array				Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1		30 s		260 °C (500 °F)	12 mm		117
XAC2C128-8VQG100Q	Xilinx	Flash PLD	Automotive	Flat	100	QFF	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS	AEC-Q100	80	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-F100	3	1.2 mm	14 mm	No		e3	119 MHz	30 s	80	260 °C (500 °F)	14 mm	Yes	80
XC9572-7PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	72	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	4.572 mm	16.5862 mm	No		e0	83.3 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	69
XC9536-15VQ44Q	Xilinx	Flash PLD	Automotive	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	36	CMOS				5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	.8 mm	125 °C (257 °F)	34 I/O		-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0		30 s		240 °C (464 °F)	10 mm	Yes	34
XC9572-7PCG84	Xilinx	Flash PLD		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS				5		Chip Carrier				Macrocell		1.27 mm		0 Dedicated Inputs, 69 I/O	0		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable	e3					29.3116 mm		69
XA2C128-7CPG132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS	AEC-Q100			1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	112 MHz	30 s		260 °C (500 °F)	8 mm	Yes	100
XC95288XL-6BGG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V		CMOS				3.3		Grid Array, Low Profile				Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	288 Macrocells	e1	151.5 MHz	30 s		260 °C (500 °F)	35 mm		192
XC95108-15TQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	HLFQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm	Yes	81
XC2C384-10FG324C	Xilinx	Flash PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	384	CMOS		240	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 240 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	83 MHz	30 s	240	225 °C (437 °F)	23 mm	Yes	240
XC9572XL-10VQG64Q	Xilinx	Flash PLD	Automotive	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm		52
XC95288XL-6CS280C	Xilinx	Flash PLD	Commercial	Ball	280	TFBGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	208.3 MHz	30 s	192	240 °C (464 °F)	16 mm	Yes	192
XC2C384-7TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	384	CMOS		118	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 118 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	112 MHz		118		20 mm	Yes	118

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.