Flash PLD Programmable Logic Devices (PLD) 1,975

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

XC95288XV-7TQG144I

Xilinx

Flash PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

288

CMOS

2.5

1.8/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

2.37 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

125 MHz

30 s

260 °C (500 °F)

20 mm

Yes

117

XC95216-20PQ160I

Xilinx

Flash PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

216

CMOS

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 133 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G160

3

3.7 mm

28 mm

No

e0

50 MHz

30 s

225 °C (437 °F)

28 mm

Yes

133

XC95108-15PQG160I

Xilinx

Flash PLD

Industrial

Gull Wing

160

HQFP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.5 V

108

CMOS

5

3.3/5,5 V

Flatpack, Heat Sink/Slug

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 108 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

R-PQFP-G160

3

4.1 mm

28 mm

No

e3

30 s

245 °C (473 °F)

28 mm

Yes

108

XC9536XL-4VQ64C

Xilinx

Flash PLD

Commercial

Gull Wing

64

TFQFP

Square

Plastic/Epoxy

4 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

3

1.2 mm

10 mm

No

36 Macrocells

e0

200 MHz

10 mm

36

XC95108F-15PQG100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 81 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e3

56 MHz

20 mm

81

XC95576-12BGG432C

Xilinx

Flash PLD

Commercial

Ball

432

LBGA

Square

Plastic/Epoxy

12 ns

Yes

CMOS

5

Grid Array, Low Profile

Macrocell

1.27 mm

70 °C (158 °F)

232 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e1

40 mm

232

XC95108-7PQ100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

HQFP

Rectangular

Plastic/Epoxy

7.5 ns

Yes

5.5 V

108

CMOS

5

3.3/5,5 V

Flatpack, Heat Sink/Slug

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 81 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

108 Macrocells; Configurable I/O operation with 3.3 V or 5 V

e0

30 s

225 °C (437 °F)

20 mm

Yes

81

XC9572-15TQG100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

72

CMOS

5

3.3/5,5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 72 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

55.6 MHz

30 s

260 °C (500 °F)

14 mm

Yes

72

XA95144XL-10CSG144I

Xilinx

Flash PLD

Industrial

Ball

144

TFBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

144

CMOS

AEC-Q100

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

30 s

260 °C (500 °F)

12 mm

Yes

117

XC95108-7PQG160C

Xilinx

Flash PLD

Commercial

Gull Wing

160

HQFP

Rectangular

Plastic/Epoxy

7.5 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Flatpack, Heat Sink/Slug

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 108 I/O

0

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G160

3

4.1 mm

28 mm

No

e3

30 s

245 °C (473 °F)

28 mm

Yes

108

XC95288XL-10BGG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e1

100 MHz

30 s

192

250 °C (482 °F)

27 mm

Yes

192

XC95144-10PQG160

Xilinx

Flash PLD

Gull Wing

160

QFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack

Macrocell

.65 mm

0 Dedicated Inputs, 133 I/O

0

Matte Tin

Quad

S-PQFP-G160

3

4.1 mm

28 mm

No

Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable

e3

28 mm

133

XC9572-15PQ100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.5 V

72

CMOS

5

3.3/5,5 V

Flatpack

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 72 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e0

55.6 MHz

30 s

225 °C (437 °F)

20 mm

Yes

72

XC9572F-15PC84I

Xilinx

Flash PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 69 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

56 MHz

29.3116 mm

69

XC9572XV-4PC44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4 ns

Yes

2.62 V

72

CMOS

2.5

1.8/3.3,2.5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

2.37 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

e0

250 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

34

XC95144-10PQG160I

Xilinx

Flash PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

144

CMOS

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 133 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G160

3

4.1 mm

28 mm

No

e3

67.7 MHz

30 s

245 °C (473 °F)

28 mm

Yes

133

XC95216-20BG352C

Xilinx

Flash PLD

Commercial

Ball

352

LBGA

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

216

CMOS

5

3.3/5,5 V

Grid Array, Low Profile

BGA352,26X26,50

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 166 I/O

0

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B352

3

1.4 mm

35 mm

No

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

e0

50 MHz

30 s

225 °C (437 °F)

35 mm

Yes

166

XC9572XL-10TQ100Q

Xilinx

Flash PLD

Automotive

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

72

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 72 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e0

30 s

225 °C (437 °F)

14 mm

Yes

72

XC2C256-5PQG208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

5 ns

Yes

1.9 V

256

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 173 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Real Digital Design Technology

e3

30 s

245 °C (473 °F)

28 mm

Yes

173

XC2C32-6CPG56C

Xilinx

Flash PLD

Commercial

Ball

56

LFBGA

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

32

CMOS

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile, Fine Pitch

BGA56,10X10,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

1 Dedicated Inputs, 33 I/O

1

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B56

3

1.35 mm

6 mm

No

Real Digital Design Technology

e1

30 s

260 °C (500 °F)

6 mm

Yes

33

XC95288XV-10FGG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

2.62 V

288

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.37 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e1

100 MHz

30 s

260 °C (500 °F)

17 mm

Yes

192

XC95288XL-7FG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

125 MHz

30 s

192

225 °C (437 °F)

17 mm

Yes

192

XC9572XL-7CSG48I

Xilinx

Flash PLD

Industrial

Ball

48

FBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

72

CMOS

38

3.3

2.5/3.3,3.3 V

Grid Array, Fine Pitch

BGA48,7X7,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 38 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B48

3

1.8 mm

7 mm

No

72 Macrocells

e1

125 MHz

30 s

38

260 °C (500 °F)

7 mm

Yes

38

XC2C256-6PQG208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

256

CMOS

173

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 173 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Real Digital Design Technology

e3

139 MHz

30 s

173

245 °C (473 °F)

28 mm

Yes

173

XC95288XL-7BGG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e1

125 MHz

30 s

192

250 °C (482 °F)

27 mm

Yes

192

XC95108-20PC84I

Xilinx

Flash PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 69 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

30 s

225 °C (437 °F)

29.3116 mm

Yes

69

XC95288XV-7FGG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

288

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.37 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e1

125 MHz

30 s

260 °C (500 °F)

17 mm

Yes

192

XC9536F-10VQ44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

No

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

67 MHz

30 s

240 °C (464 °F)

10 mm

Yes

34

XC95216-20PQG160I

Xilinx

Flash PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

216

CMOS

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 133 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G160

3

3.7 mm

28 mm

No

e3

50 MHz

30 s

245 °C (473 °F)

28 mm

Yes

133

XC9572F-10PC84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

67 MHz

30 s

225 °C (437 °F)

29.3116 mm

Yes

69

XC95144-10PQG100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.5 V

144

CMOS

5

3.3/5,5 V

Flatpack

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 81 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e3

67.7 MHz

30 s

245 °C (473 °F)

20 mm

Yes

81

XC95108F-10PC84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

67 MHz

30 s

225 °C (437 °F)

29.3116 mm

Yes

69

XC2C64-5CPG56I

Xilinx

Flash PLD

Industrial

Ball

56

LFBGA

Square

Plastic/Epoxy

5 ns

Yes

1.9 V

CMOS

1.8

Grid Array, Low Profile, Fine Pitch

Macrocell

1.7 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 45 I/O

0

-40 °C (-40 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B56

3

1.35 mm

6 mm

No

e1

30 s

260 °C (500 °F)

6 mm

45

XC95288XV-7FG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

288

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.37 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

125 MHz

30 s

225 °C (437 °F)

17 mm

Yes

192

XC9572F-15PC84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

56 MHz

30 s

225 °C (437 °F)

29.3116 mm

Yes

69

XC9536XV-3VQ44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

3.5 ns

Yes

2.62 V

36

CMOS

2.5

1.8/3.3,2.5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

2.37 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

30 s

240 °C (464 °F)

10 mm

Yes

34

XC95216-20PQ160C

Xilinx

Flash PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

216

CMOS

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 133 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G160

3

3.7 mm

28 mm

No

e0

50 MHz

30 s

225 °C (437 °F)

28 mm

Yes

133

XC2C64-5VQ100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

5 ns

Yes

1.9 V

64

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 64 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Real Digital Design Technology

e0

30 s

240 °C (464 °F)

14 mm

Yes

64

XC9536-6PC44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

6 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e0

100 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

34

XC2C256-5VQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

5 ns

Yes

1.9 V

256

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 80 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Real Digital Design Technology

e3

30 s

260 °C (500 °F)

14 mm

Yes

80

XC9572F-10PC84I

Xilinx

Flash PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 69 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

67 MHz

29.3116 mm

69

XC2C384-6PQG208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

384

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 173 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

30 s

245 °C (473 °F)

28 mm

Yes

173

XC9536XL-4PC44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4 ns

Yes

3.6 V

36

CMOS

3.3

2.5/3.3,3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

36 Macrocells

e0

200 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

34

XC9572-10TQ100

Xilinx

Flash PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack, Low Profile, Fine Pitch

Macrocell

.5 mm

0 Dedicated Inputs, 72 I/O

0

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable

e0

30 s

225 °C (437 °F)

14 mm

72

XA2C32A-7VQG44Q

Xilinx

Flash PLD

Automotive

Gull Wing

44

TQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

32

CMOS

AEC-Q100

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

1.7 V

.8 mm

125 °C (257 °F)

0 Dedicated Inputs, 33 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

Real Digital Design Technology

e3

30 s

260 °C (500 °F)

10 mm

Yes

33

XC9536XL-5CS48C

Xilinx

Flash PLD

Commercial

Ball

48

FBGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

36

CMOS

36

3.3

2.5/3.3,3.3 V

Grid Array, Fine Pitch

BGA48,7X7,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B48

3

1.8 mm

7 mm

No

36 Macrocells

e0

178.6 MHz

30 s

36

240 °C (464 °F)

7 mm

Yes

36

XC2C64-7VQG100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

64

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 64 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Real Digital Design Technology

e3

30 s

260 °C (500 °F)

14 mm

Yes

64

XC95216-15HQG208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Flatpack, Fine Pitch

Macrocell

4.75 V

.4 mm

70 °C (158 °F)

0 Dedicated Inputs, 166 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

55.6 MHz

30 s

245 °C (473 °F)

28 mm

166

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.