Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EP20K160EQC208-2	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.93 ns	6400	Yes	1.89 V	CMOS	135	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 143 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	160 MHz	20 s	135	220 °C (428 °F)	28 mm	143
EPF10K200SFC672-3N	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.8 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	470
EPF10K130EBC672-1	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 413 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						413
EP1K30FC256-3N	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.6 ns	1728	Yes	2.625 V	CMOS	171	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	171 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1		30 s	171	260 °C (500 °F)	17 mm	171
EPF8820BC225-2	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.25 V	CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	Registered	4.75 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 148 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0			148	220 °C (428 °F)	27 mm	148
EPF6016QC208-3	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		1320	Yes	5.25 V	CMOS	171	5	3.3/5,5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can Also Be Used 16000 Logic Gates	e0	133 MHz	20 s	171	220 °C (428 °F)	28 mm	171
EP20K400CF672I8	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	1.78 ns	16640	Yes	1.89 V	CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 488 I/O	4		Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0			480	220 °C (428 °F)	27 mm	488
EP20K600CF33C9	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	2 ns		Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0				220 °C (428 °F)	33 mm	588
EPF8282ALC84-4N	Altera	Loadable PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		208	Yes	5.25 V	CMOS	68	5	3.3,3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 68 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	208 Logic Elements	e3		30 s	68	245 °C (473 °F)	29.3116 mm	68
EPF10K50VBC356-1N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	3.6 V	CMOS	274	3.3	3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1		30 s	274	260 °C (500 °F)	35 mm	274
EP20K400EFC672-1N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.57 ns	16640	Yes	1.89 V	CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	160 MHz	30 s	480	245 °C (473 °F)	27 mm	488
EPF10K100AFC484-2N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	3.6 V	CMOS	369	3.3	2.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 369 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	4992 Logic Elements; 624 Labs	e1	80 MHz	30 s	369	260 °C (500 °F)	23 mm	369
EPF10K50VBI356-3	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns	2880	Yes	3.6 V	CMOS	310	3.3	3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 274 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	310	220 °C (428 °F)	35 mm	274
EPF10K100GC504-5	Altera	Loadable PLD	Commercial	Pin/Peg	504	PGA	Square	Ceramic, Metal-Sealed Cofired	27 ns		No	5.25 V	CMOS		5		Grid Array			Registered	4.75 V		70 °C (158 °F)	4 Dedicated Inputs, 406 I/O	4	0 °C (32 °F)		Perpendicular	S-CPGA-P504				No	4992 Logic elements Configurable I/O operation with 3.3 V or 5 V		53.76 MHz					406
EPF10K200SQC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	16 ns	9984	Yes	2.7 V	CMOS	182	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	70 °C (158 °F)	182 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			182	220 °C (428 °F)	32 mm	182
EP20K200RC240-1	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.5 ns	8320	Yes	2.625 V	CMOS	168	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			168	220 °C (428 °F)	32 mm	174
EPF8282VTC100-3	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		208	Yes	3.6 V	CMOS	78	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 74 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry	e0			74	220 °C (428 °F)	14 mm	74
EP20K400EBC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672				No		e0						488
EP20K200EBC652-2	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V	CMOS	368	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0			368	220 °C (428 °F)	45 mm	376
EPF8636ALM84-4	Altera	Loadable PLD	Military	J Bend	84	QCCJ	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Chip Carrier			Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs, 64 I/O	4	-55 °C (-67 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V						29.3116 mm	64
EP20K60EQI240-3X	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 151 I/O	4		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	151
EPF10K70GM504-5	Altera	Loadable PLD	Military	Pin/Peg	504	PGA	Square	Ceramic, Metal-Sealed Cofired	27 ns		No	5.5 V	CMOS		5		Grid Array			Registered	4.5 V		125 °C (257 °F)	4 Dedicated Inputs, 358 I/O	4	-55 °C (-67 °F)		Perpendicular	S-CPGA-P504				No	3744 Logic elements Configurable I/O operation with 3.3 V or 5 V		53.76 MHz					358
EPF10K200SQC240-3X	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	16 ns		Yes	2.7 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.3 V	.5 mm	70 °C (158 °F)	182 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	182
EP20K60EFC144-3	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	3.56 ns	2560	Yes	1.89 V	CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0	160 MHz	20 s	85	235 °C (455 °F)	13 mm	93
EPF10K50EQI208-1	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8.5 ns	2880	Yes	2.7 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			147	220 °C (428 °F)	28 mm	147
EPF8282ALI100-A-3	Altera	Loadable PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	0.5 ns		Yes	5.5 V	CMOS		5		Chip Carrier			Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 78 I/O	4	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			95 MHz				16.5862 mm	78
EPF10K50STC144-3X	Altera	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Low Profile, Fine Pitch			Mixed	2.375 V	.5 mm	70 °C (158 °F)	102 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3					20 mm	102
EP20K200CB652C-9	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1				220 °C (428 °F)	45 mm	376
EPF10K100ABI356-3	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	0.8 ns	4992	Yes	3.6 V	CMOS	274	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 274 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm	274
EP20K100FC484	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	252
EPF6024ABC256-1	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V	CMOS	218	3.3	2.5/3.3,3.3 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays	Macrocell	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 218 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.3 mm	27 mm	No	Can Also Be Used 24000 Logic Gates	e0	172 MHz	20 s	218	220 °C (428 °F)	27 mm	218
EP20K200RI240-1X	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	168	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 174 I/O	4		Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3			168	220 °C (428 °F)	32 mm	174
EP20K60EFC144-2N	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	2.41 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144		1.7 mm	13 mm	No		e1	160 MHz				13 mm	93
EP20K100TC144-1N	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2.5 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Low Profile, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 101 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3					20 mm	101
EP1K10FC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	576	Yes	2.625 V	CMOS	136	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	136 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	37.5 MHz	20 s	136	220 °C (428 °F)	17 mm	136
EP20K60EQC240	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 183 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3	160 MHz				32 mm	183
EP20K160EQC240-3	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.29 ns	6400	Yes	1.89 V	CMOS	167	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 175 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	160 MHz	20 s	167	220 °C (428 °F)	32 mm	175
EP20K100TC144-3X	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3.6 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Low Profile, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 101 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3				220 °C (428 °F)	20 mm	101
EP20K200RI240-1	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	168	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 174 I/O	4		Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			168	220 °C (428 °F)	32 mm	174
EP20K60EBC356-1N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.72 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1	160 MHz				35 mm	196
EP2A40F672C8	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.78 ns	38400	Yes	1.575 V	CMOS	480	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.425 V	1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			480	220 °C (428 °F)	27 mm	492
EPF8636AGM192-4	Altera	Loadable PLD	Military	Pin/Peg	192	PGA	Square	Ceramic, Metal-Sealed Cofired			No	5.5 V	CMOS		5		Grid Array			Registered	4.5 V	2.54 mm	125 °C (257 °F)	4 Dedicated Inputs, 132 I/O	4	-55 °C (-67 °F)		Perpendicular	S-CPGA-P192		5.43 mm	45.15 mm	No	636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V						45.15 mm	132
EPF6010ATC100-2N	Altera	Loadable PLD	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy			Yes	3.6 V			3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 71 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	Can Also Be Used 10000 Logic Gates	e3	153 MHz				14 mm	71
EPF8820AGI192-3	Altera	Loadable PLD	Industrial	Pin/Peg	192	PGA	Square	Ceramic, Metal-Sealed Cofired		672	No	5.5 V	CMOS	152	5	3.3/5,5 V	Grid Array	PGA192M,17X17	Field Programmable Gate Arrays	Registered	4.5 V	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P192	1	5.43 mm	45.15 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		148	220 °C (428 °F)	45.15 mm	152
EPF8452ALI84-2	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		336	Yes	5.5 V	CMOS	68	5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 68 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	336 Logic elements; 42 Labs; Configurable I/O operation with 3.3 V or 5 V	e0			64	220 °C (428 °F)	29.3116 mm	68
EPF10K100EFI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	9 ns	4992	Yes	2.7 V	CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			191	220 °C (428 °F)	17 mm	191
EP1M350FI780-5	Altera	Loadable PLD		Ball	780	HBGA	Square	Plastic/Epoxy			Yes	1.89 V	CMOS		1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 486 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e1					29 mm	486
EP20K100BI484-3	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs, 252 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						252

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.