Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K30EBC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 176 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

176

EPF10K50EBI484-2

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

85 °C (185 °F)

4 Dedicated Inputs, 254 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

254

EPF10K50VBC356-3N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

2880

Yes

3.6 V

CMOS

274

3.3

3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e1

30 s

274

260 °C (500 °F)

35 mm

274

EP20K60EQI240-2

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

2560

Yes

2.625 V

CMOS

143

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 151 I/O

4

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

143

220 °C (428 °F)

32 mm

151

EPF10K130EBC600-1

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.3 ns

6656

Yes

2.625 V

CMOS

424

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

424

220 °C (428 °F)

45 mm

424

EPF10K70GI504-4

Altera

Loadable PLD

Industrial

Pin/Peg

504

PGA

Square

Ceramic, Metal-Sealed Cofired

23.8 ns

No

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

85 °C (185 °F)

4 Dedicated Inputs, 358 I/O

4

-40 °C (-40 °F)

Perpendicular

S-CPGA-P504

No

3744 Logic elements Configurable I/O operation with 3.3 V or 5 V

60.6 MHz

358

EPF8820AGI192-A-4

Altera

Loadable PLD

Industrial

Pin/Peg

192

PGA

Square

Ceramic, Metal-Sealed Cofired

1.9 ns

No

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 152 I/O

4

-40 °C (-40 °F)

Perpendicular

S-CPGA-P192

5.43 mm

45.15 mm

No

Can also operate at 5 V supply

45.15 mm

152

EP20K160EBI356-1X

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

6400

Yes

2.625 V

CMOS

263

2.5

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 271 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

263

220 °C (428 °F)

35 mm

271

EPF10K100EQI208-2X

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.375 V

.5 mm

85 °C (185 °F)

147 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EP1K100FC484-1

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

4992

Yes

2.625 V

CMOS

333

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

333 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

90 MHz

20 s

333

220 °C (428 °F)

23 mm

333

EP20K30EFC144-1N

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

1.91 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

1.7 mm

13 mm

No

e1

160 MHz

13 mm

93

EPF10K50VRC240-2

Altera

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

0.4 ns

2880

Yes

3.6 V

CMOS

189

3.3

3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

20 s

189

220 °C (428 °F)

32 mm

189

EP20K30EQI208-3X

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 125 I/O

4

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

125

EPF8820AGC192-A-2

Altera

Loadable PLD

Commercial

Pin/Peg

192

PGA

Square

Ceramic, Metal-Sealed Cofired

1.7 ns

No

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 152 I/O

4

0 °C (32 °F)

Perpendicular

S-CPGA-P192

5.43 mm

45.15 mm

No

Can also operate at 5 V supply

45.15 mm

152

EPF10K130EFI484-3

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

16 ns

6656

Yes

2.7 V

CMOS

369

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

369 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

369

220 °C (428 °F)

23 mm

369

EPF10K40RC208-3N

Altera

Loadable PLD

Commercial

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

0.6 ns

Yes

5.25 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 147 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

2304 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

66.67 MHz

28 mm

147

EPF10K100EPC208-3

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

16 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.375 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 147 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EPF10K30AQI240-3

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

0.9 ns

1728

Yes

3.6 V

CMOS

246

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

1728 Logic Elements; 216 Labs

e0

80 MHz

20 s

246

220 °C (428 °F)

32 mm

189

EPF8282ATI100-A-3

Altera

Loadable PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

1.8 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 78 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

1.27 mm

14 mm

No

Can also operate at 5 V supply

e3

14 mm

78

EP20K1500CFI1020-9

Altera

Loadable PLD

Ball

1020

HBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Heat Sink/Slug

Macrocell

1.71 V

1 mm

808 I/O

Tin Silver Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

33 mm

808

EPXA10F1020C2

Altera

Loadable PLD

Other

Ball

1020

HBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Heat Sink/Slug

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 711 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

220 °C (428 °F)

33 mm

711

EP2A40F1020C7

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

1.55 ns

38400

Yes

1.575 V

CMOS

723

1.5

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

1.425 V

1 mm

85 °C (185 °F)

735 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

723

220 °C (428 °F)

33 mm

735

EP20K600CF1020C-8

Altera

Loadable PLD

Other

Ball

1020

HBGA

Square

Plastic/Epoxy

24320

Yes

1.89 V

CMOS

580

1.8

1.8,1.8/3.3 V

Grid Array, Heat Sink/Slug

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 588 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

580

220 °C (428 °F)

33 mm

588

EP20K100BC196-2

Altera

Loadable PLD

Other

Ball

196

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs, 149 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

No

e1

149

EP20K600CF672I-7

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

1.6 ns

24320

Yes

1.89 V

CMOS

500

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 508 I/O

4

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

500

220 °C (428 °F)

27 mm

508

EPF10K30RC208-4N

Altera

Loadable PLD

Commercial

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

0.6 ns

1728

Yes

5.25 V

CMOS

147

5

3.3/5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 147 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

1728 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

62.89 MHz

30 s

147

245 °C (473 °F)

28 mm

147

EP20K1000EBC652-3N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.32 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

160 MHz

40 s

245 °C (473 °F)

45 mm

488

EP20K1500CBC652-8

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

488 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

488

EPF10K50STI144-1

Altera

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

8 ns

2880

Yes

2.7 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.63SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

85 °C (185 °F)

102 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

102

220 °C (428 °F)

20 mm

102

EPF10K50SQI208-3X

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

12.5 ns

Yes

2.7 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.3 V

.5 mm

85 °C (185 °F)

147 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EP20K400EFI784-2

Altera

Loadable PLD

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs

4

Tin Lead

Bottom

S-PBGA-B784

3

No

e0

220 °C (428 °F)

EP20K200BC356-2N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

3 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 277 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

277

EPF10K50VBC356-4N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

2880

Yes

3.6 V

CMOS

274

3.3

3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e1

30 s

274

260 °C (500 °F)

35 mm

274

EP20K100RI240-1X

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

4160

Yes

2.625 V

CMOS

183

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 189 I/O

4

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

183

220 °C (428 °F)

32 mm

189

EPF10K100EBC356-1

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.4 ns

4992

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EPF8452ALC84-A-2

Altera

Loadable PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

1.7 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 68 I/O

4

0 °C (32 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

Can also operate at 5 V supply

29.3116 mm

68

EP20K200EFI784-2

Altera

Loadable PLD

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs

4

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EP20K1000EPC984-1

Altera

Loadable PLD

Other

Pin/Peg

984

PGA

Square

Ceramic, Metal-Sealed Cofired

No

1.89 V

1.8

Grid Array

Macrocell

1.71 V

85 °C (185 °F)

4 Dedicated Inputs, 716 I/O

4

0 °C (32 °F)

Perpendicular

S-CPGA-P984

No

160 MHz

716

EP20K200FC484-3X

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

3.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

220 °C (428 °F)

23 mm

382

EPF10K130EFI484-3X

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

369 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

369

EPF10K50SQI240-1X

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

8 ns

Yes

2.7 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.3 V

.5 mm

85 °C (185 °F)

189 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EPF10K70QM240-5

Altera

Loadable PLD

Military

Gull Wing

240

FQFP

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

3744 Logic elements; Built-in JTAG boundry-scan test circuitry

e3

53.76 MHz

32 mm

EP20K600EBC652-2

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.25 ns

24320

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

160 MHz

20 s

480

220 °C (428 °F)

45 mm

488

EPF81188AGC232-A-2

Altera

Loadable PLD

Commercial

Pin/Peg

232

PGA

Square

Ceramic, Metal-Sealed Cofired

1.7 ns

No

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 184 I/O

4

0 °C (32 °F)

Perpendicular

S-CPGA-P232

5.207 mm

44.7 mm

No

Can also operate at 5 V supply

44.7 mm

184

EPF10K130EFI672-3

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

16 ns

6656

Yes

2.7 V

CMOS

413

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

413 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

413

220 °C (428 °F)

27 mm

413

EPF10K130EBC600-2X

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.5 ns

6656

Yes

2.625 V

CMOS

424

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

424

220 °C (428 °F)

45 mm

424

EP20K600EFC33-3N

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

2.92 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 588 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

40 s

245 °C (473 °F)

33 mm

588

EP20K300ERC240-2X

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

11520

Yes

2.625 V

CMOS

144

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 152 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

160 MHz

144

220 °C (428 °F)

32 mm

152

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.