Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K10ATI144-1

Altera

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 102 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

1.6 mm

20 mm

No

e3

20 mm

102

EPF8636ARI160-3

Altera

Loadable PLD

Industrial

Gull Wing

160

HQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Heat Sink/Slug

Registered

4.5 V

.65 mm

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G160

3.91 mm

28 mm

No

636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

EPF10K50BC356-5

Altera

Loadable PLD

Commercial

Ball

356

HLBGA

Square

Plastic/Epoxy

27 ns

2880

Yes

5.25 V

CMOS

274

5

3.3/5,5 V

Grid Array, Heat Sink/Slug, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

57.8 MHz

274

220 °C (428 °F)

35 mm

274

EP20K400EFI672-2

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

16640

Yes

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1 mm

4 Dedicated Inputs, 488 I/O

4

Tin Lead

Bottom

S-PBGA-B672

3

No

e0

480

220 °C (428 °F)

488

EP20K200EBC356-2

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

263

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

263

220 °C (428 °F)

35 mm

271

EPF10K100EFC672-3X

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

70 °C (158 °F)

338 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

338

EP1M120FI484-5

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 303 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

303

EP20K1000EBC652

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

160 MHz

45 mm

488

EPF81188ARI240-4N

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 180 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.2 mm

32 mm

No

1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

32 mm

180

EP20K200BC356-2V

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

0.4 ns

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 279 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

34 MHz

271

220 °C (428 °F)

35 mm

279

EPF10K10QM240-4

Altera

Loadable PLD

Military

Gull Wing

240

FQFP

Square

Plastic/Epoxy

23.8 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

576 Logic elements; Built-in JTAG boundry-scan test circuitry

e3

60.6 MHz

32 mm

EPF10K200SBC600-3X

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.8 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K50SQC208-1X

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.3 ns

2880

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

147

220 °C (428 °F)

28 mm

147

EP20K30ETC144-2N

Altera

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2.69 ns

1200

Yes

1.89 V

CMOS

84

1.8

1.8,1.8/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 92 I/O

4

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

160 MHz

30 s

84

245 °C (473 °F)

20 mm

92

EP20K200QC240-1

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

168

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 174 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

168

220 °C (428 °F)

32 mm

174

EP20K200QC240-3

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

168

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 174 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

168

220 °C (428 °F)

32 mm

174

EPF8452LI84-3

Altera

Loadable PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Chip Carrier

Registered

4.5 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 64 I/O

4

-40 °C (-40 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements

29.3116 mm

64

EP20K200FC784-2

Altera

Loadable PLD

Other

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EP20K400FC672-3V

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

3.6 ns

16640

Yes

2.625 V

CMOS

496

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 502 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

496

220 °C (428 °F)

27 mm

502

EPF6016ATC100-3N

Altera

Loadable PLD

Other

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 81 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

Can Also Be Used 16000 Logic Gates

e3

133 MHz

14 mm

81

EPF10K50SQC240-3X

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.375 V

.5 mm

70 °C (158 °F)

189 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EPF10K100ABC356-3N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.8 ns

4992

Yes

3.6 V

CMOS

274

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e1

30 s

274

260 °C (500 °F)

35 mm

274

EP20K200CBI652-8

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

376 I/O

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

376

EPF8820AQC160-A-2

Altera

Loadable PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

1.7 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Registered

3 V

.65 mm

70 °C (158 °F)

4 Dedicated Inputs, 120 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G160

4.07 mm

28 mm

No

Can also operate at 5 V supply

e3

28 mm

120

EP20K30ERI208-2X

Altera

Loadable PLD

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

1200

Yes

2.625 V

CMOS

117

2.5

1.8,1.8/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 125 I/O

4

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

117

220 °C (428 °F)

28 mm

125

EP20K60EBI356-1

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

2560

Yes

2.625 V

CMOS

188

2.5

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 196 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

188

220 °C (428 °F)

35 mm

196

EPF8282ATC100-A-4

Altera

Loadable PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

1.9 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 78 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

1.27 mm

14 mm

No

Can also operate at 5 V supply

e3

14 mm

78

EP20K100EFI324

Altera

Loadable PLD

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

1 mm

4 Dedicated Inputs, 252 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.1 mm

19 mm

No

e1

220 °C (428 °F)

19 mm

252

EP20K200FC484-3N

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

3.6 ns

8320

Yes

2.625 V

CMOS

376

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

30 s

376

260 °C (500 °F)

23 mm

382

EPF10K130ERC240-3

Altera

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

16 ns

6656

Yes

2.7 V

CMOS

186

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e0

186

220 °C (428 °F)

32 mm

186

EP20K30EQC208

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 128 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

160 MHz

28 mm

128

EPF8452AGC160-A-4

Altera

Loadable PLD

Commercial

Pin/Peg

160

PGA

Square

Ceramic, Metal-Sealed Cofired

1.9 ns

No

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 120 I/O

4

0 °C (32 °F)

Perpendicular

S-CPGA-P160

5.34 mm

39.624 mm

No

Can also operate at 5 V supply

39.624 mm

120

EPF10K200SBC356-2X

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

9984

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

274

220 °C (428 °F)

35 mm

274

EP20K30EFC144-1

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

1.91 ns

1200

Yes

1.89 V

CMOS

85

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA144,12X12,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.7 mm

13 mm

No

e0

160 MHz

20 s

85

235 °C (455 °F)

13 mm

93

EP20K100EFC144-3X

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

2.2 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

1.7 mm

13 mm

No

e1

160 MHz

220 °C (428 °F)

13 mm

93

EP20K200CB356C9

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2 ns

8320

Yes

1.89 V

CMOS

263

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

1.7 mm

35 mm

No

e0

263

220 °C (428 °F)

35 mm

271

EP20K200RC240-1V

Altera

Loadable PLD

Other

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

0.3 ns

8320

Yes

2.625 V

CMOS

168

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 174 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

100 MHz

168

220 °C (428 °F)

32 mm

174

EP20K30EFC484-2

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 128 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

160 MHz

23 mm

128

EP20K300EFI784

Altera

Loadable PLD

Ball

784

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

4 Dedicated Inputs

4

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EPF10K130VGC599-3

Altera

Loadable PLD

Commercial

Pin/Peg

599

IPGA

Square

Ceramic, Metal-Sealed Cofired

0.7 ns

832

No

3.6 V

CMOS

470

3.3

3.3 V

Grid Array, Interstitial Pitch

SPGA599,47X47

Field Programmable Gate Arrays

Registered

3 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P599

1

5.08 mm

62.484 mm

No

e0

466

220 °C (428 °F)

62.484 mm

470

EP20K300ERI240-2

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

11520

Yes

2.625 V

CMOS

144

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 152 I/O

4

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

144

220 °C (428 °F)

32 mm

152

EPF10K30ARC240-1

Altera

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

11 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EP1K100QC208

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Flatpack, Fine Pitch

Registered

2.375 V

.5 mm

70 °C (158 °F)

6 Dedicated Inputs, 147 I/O

6

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EP20K200CBC356-8

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

271 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

271

EP20K200EBC652XES

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

376

EPF10K10RC208-4

Altera

Loadable PLD

Commercial

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 134 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

134

EP20K100EFC324

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.1 mm

19 mm

No

e1

220 °C (428 °F)

19 mm

252

EP20K100EQC208-3X

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2.2 ns

Yes

1.89 V

CMOS

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 151 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

151

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.