Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K40QM240-4

Altera

Loadable PLD

Military

Gull Wing

240

FQFP

Square

Plastic/Epoxy

23.8 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

2304 Logic elements; Built-in JTAG boundry-scan test circuitry

e3

60.6 MHz

32 mm

EP20K400ERC240-2

Altera

Loadable PLD

Other

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 132 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

220 °C (428 °F)

32 mm

132

EPF10K200EBC600-1N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.4 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

5962-9473301MXC

Altera

Loadable PLD

Military

Pin/Peg

232

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

CMOS

MIL-STD-883

5

Grid Array

Registered

4.5 V

2.54 mm

125 °C (257 °F)

4 Dedicated Inputs, 180 I/O

4

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P232

5.207 mm

44.7 mm

No

1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e4

220 °C (428 °F)

44.7 mm

180

EP20K600CB652C8ES

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

488

EPF10K130EBC600-1N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.3 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

424

EP20K1500EFC1020

Altera

Loadable PLD

Other

Ball

1020

HBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Heat Sink/Slug

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 808 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

160 MHz

33 mm

808

EPF10K50EBC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPF10K40QM240-5

Altera

Loadable PLD

Military

Gull Wing

240

FQFP

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

2304 Logic elements; Built-in JTAG boundry-scan test circuitry

e3

53.76 MHz

32 mm

EPF8636AQI208-2

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

504

Yes

5.5 V

CMOS

136

5

3.3/5,5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 136 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

504 Logic elements; 63 Labs; Configurable I/O operation with 3.3 V or 5 V

e0

132

220 °C (428 °F)

28 mm

136

EP20K100RI208-1X

Altera

Loadable PLD

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

4160

Yes

2.625 V

CMOS

153

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 159 I/O

4

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

153

220 °C (428 °F)

28 mm

159

EPF10K10ATI100-3

Altera

Loadable PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

16 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 66 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

1.27 mm

14 mm

No

e3

14 mm

66

EP20K600EFC33-2XN

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

2.25 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 588 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

33 mm

588

EP20K300ERC240-1

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

11520

Yes

2.625 V

CMOS

144

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 152 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

160 MHz

144

220 °C (428 °F)

32 mm

152

EP20K30EFC324-1

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

1.91 ns

1200

Yes

1.89 V

CMOS

120

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 128 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.1 mm

19 mm

No

e1

160 MHz

120

220 °C (428 °F)

19 mm

128

EPF10K10QM208-4

Altera

Loadable PLD

Military

Gull Wing

208

FQFP

Square

Plastic/Epoxy

23.8 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

576 Logic elements Configurable I/O operation with 3.3 V or 5 V

e3

60.6 MHz

28 mm

EPF10K200SFC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.8 ns

9984

Yes

2.625 V

CMOS

369

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

369 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

369

220 °C (428 °F)

23 mm

369

EP20K100FC784-3

Altera

Loadable PLD

Other

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EPF10K100EBC356-2

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EPF10K100BFI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

4992

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

191

220 °C (428 °F)

17 mm

191

EPF81188AQI208-3

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1008

Yes

5.5 V

CMOS

148

5

3.3/5,5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 148 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

385 MHz

144

220 °C (428 °F)

28 mm

148

EPF10K50SQI208-2X

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.4 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.375 V

.5 mm

85 °C (185 °F)

147 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EPF81500AQC240-3N

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1.8 ns

1296

Yes

3.6 V

CMOS

181

3.3

3.3,3.3/5,5 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 181 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

Can also operate at 5 V supply

e3

30 s

181

245 °C (473 °F)

32 mm

181

EP20K100EBI356-2X

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

2.02 ns

4160

Yes

1.89 V

CMOS

238

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

4 Dedicated Inputs, 246 I/O

4

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

238

220 °C (428 °F)

35 mm

246

EPF10K100EBC356-2X

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

274

220 °C (428 °F)

35 mm

274

EPF10K20LM84-5

Altera

Loadable PLD

Military

J Bend

84

QCCJ

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Registered

4.5 V

1.27 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

1152 Logic elements; Built-in JTAG boundry-scan test circuitry

53.76 MHz

29.3116 mm

EP20K400GI655-3

Altera

Loadable PLD

Pin/Peg

655

IPGA

Square

Ceramic, Metal-Sealed Cofired

16640

No

2.625 V

CMOS

496

2.5

2.5,2.5/3.3 V

Grid Array, Interstitial Pitch

SPGA655,47X47

Field Programmable Gate Arrays

Macrocell

2.375 V

2.54 mm

4 Dedicated Inputs, 502 I/O

4

Tin Lead

Perpendicular

S-CPGA-P655

1

4.08 mm

62.484 mm

No

e0

496

220 °C (428 °F)

62.484 mm

502

EP20K60EQC240-1X

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1.72 ns

2560

Yes

1.89 V

CMOS

143

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 151 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

160 MHz

20 s

143

220 °C (428 °F)

32 mm

151

EPF10K200SBC356-3X

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.8 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EP20K60EQC240-2XN

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

2.41 ns

Yes

1.89 V

CMOS

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 151 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

160 MHz

32 mm

151

EPF81500ARI304-4

Altera

Loadable PLD

Industrial

Gull Wing

304

HFQFP

Square

Plastic/Epoxy

1.9 ns

1296

Yes

3.6 V

CMOS

208

3.3

3.3/5,5 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP304,1.7SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 208 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G304

4.5 mm

40 mm

No

Can also operate at 5 V supply

e0

204

220 °C (428 °F)

40 mm

208

EP20K400EBC652

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array, Low Profile

Macrocell

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

488

EP20K160EBC356-2X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.93 ns

6400

Yes

1.89 V

CMOS

263

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

160 MHz

20 s

263

220 °C (428 °F)

35 mm

271

EP20K200CF484I-9

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 376 I/O

4

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

368

220 °C (428 °F)

23 mm

376

EP20K1500CB652I-9

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

4 Dedicated Inputs, 488 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

220 °C (428 °F)

45 mm

488

EP20K300EBI652

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array, Low Profile

Macrocell

1.27 mm

4 Dedicated Inputs, 408 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

220 °C (428 °F)

45 mm

408

EP2A70F1508C8N

Altera

Loadable PLD

Other

Ball

1508

BGA

Square

Plastic/Epoxy

2.49 ns

Yes

1.575 V

CMOS

1.5

Grid Array

Macrocell

1.425 V

1 mm

85 °C (185 °F)

1060 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1508

3.5 mm

40 mm

No

e1

40 mm

1060

EPF10K100ERC240-1

Altera

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

9 ns

4992

Yes

2.7 V

CMOS

189

2.5

2.5/3.3,3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

70 °C (158 °F)

189 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e0

189

220 °C (428 °F)

32 mm

189

EP20K100RI240-3

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

4160

Yes

2.625 V

CMOS

183

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 189 I/O

4

Tin Lead

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e0

183

220 °C (428 °F)

32 mm

189

EPF8636ALC84-A-2

Altera

Loadable PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

1.7 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 68 I/O

4

0 °C (32 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

Can also operate at 5 V supply

29.3116 mm

68

EP20K600CB652I-7

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

1.6 ns

24320

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

4 Dedicated Inputs, 488 I/O

4

Tin Lead

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e0

480

220 °C (428 °F)

45 mm

488

EPF81500RC240-2

Altera

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

Yes

5.25 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

1500 Flip Flops; 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

32 mm

EP20K400FI784-1

Altera

Loadable PLD

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs

4

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EPF81188ARM208-5

Altera

Loadable PLD

Military

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

EP2A40F1020I8

Altera

Loadable PLD

Ball

1020

BGA

Square

Plastic/Epoxy

1.78 ns

38400

Yes

1.575 V

CMOS

723

1.5

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

1.425 V

1 mm

735 I/O

Tin Lead

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e0

723

33 mm

735

EPF81500RM240-2

Altera

Loadable PLD

Military

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

1500 Flip Flops; 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

32 mm

EP20K100FC324-2V

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

3 ns

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e1

34 MHz

246

220 °C (428 °F)

19 mm

252

EP20K200ERC240-3X

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 168 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

220 °C (428 °F)

32 mm

168

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.