Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EPF6024AQI208-2	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy		1960	Yes	3.6 V	CMOS	171	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm		4 Dedicated Inputs, 171 I/O	4		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also Configurable with 5 V VCC	e0	153 MHz		171	220 °C (428 °F)	28 mm	171
EPF10K30AQC208	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	3.6 V			3.3		Flatpack, Fine Pitch			Mixed	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	147
EPF10K70BM560-4	Altera	Loadable PLD	Military	Ball	560	BGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V	CMOS		5		Grid Array			Registered	4.5 V		125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B560				No	3744 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz
EPF10K50VBC356-2N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	3.6 V	CMOS	274	3.3	3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1		30 s	274	260 °C (500 °F)	35 mm	274
EPF6024AQI240-1	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy		1960	Yes	3.6 V	CMOS	199	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm		4 Dedicated Inputs, 199 I/O	4		Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Also Configurable with 5 V VCC	e0	172 MHz		199	220 °C (428 °F)	32 mm	199
EPF10K100EQI208-2N	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.375 V	.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm	147
EPF10K100EQI240-3X	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	16 ns		Yes	2.7 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.3 V	.5 mm	85 °C (185 °F)	189 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EP2A70F1508C9N	Altera	Loadable PLD	Other	Ball	1508	BGA	Square	Plastic/Epoxy	2.87 ns		Yes	1.575 V	CMOS		1.5		Grid Array			Macrocell	1.425 V	1 mm	85 °C (185 °F)	1060 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508		3.5 mm	40 mm	No		e1					40 mm	1060
EP20K160EQC208-2N	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.93 ns	6400	Yes	1.89 V	CMOS	135	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 143 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	160 MHz	30 s	135	245 °C (473 °F)	28 mm	143
EPF8820AQC160-4N	Altera	Loadable PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Flatpack			Registered	4.75 V	.65 mm	70 °C (158 °F)	4 Dedicated Inputs, 120 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm	120
EP1K10QC208-2N	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.5 ns	576	Yes	2.625 V	CMOS	120	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	120 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	37.5 MHz	30 s	120	245 °C (473 °F)	28 mm	120
EPF8452AGC160-6	Altera	Loadable PLD	Commercial	Pin/Peg	160	PGA	Square	Ceramic, Metal-Sealed Cofired		336	No	5.25 V	CMOS	120	5	3.3/5,5 V	Grid Array	PGA160M,15X15	Field Programmable Gate Arrays	Registered	4.75 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 116 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P160	1	5.34 mm	39.624 mm	No	452 Flip Flops; 336 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0			116	220 °C (428 °F)	39.624 mm	116
EP20K300EQC240-2N	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.29 ns		Yes	1.89 V	CMOS		1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	160 MHz				32 mm	152
EPF10K200SFC484-3N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.8 ns	9984	Yes	2.625 V	CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		40 s	369	260 °C (500 °F)	23 mm	369
EPF10K50EBI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm	191
EP20K200RC240-2XN	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	3 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	174
EP20K100EFC324-3N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V	CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz	30 s	238	260 °C (500 °F)	19 mm	246
EPF10K100BFC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	11 ns	4992	Yes	2.7 V	CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	4992 Logic Elements	e0	140 MHz		191	220 °C (428 °F)	17 mm	191
EP20K100EQI240-1X	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy		4160	Yes	2.625 V	CMOS	175	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 183 I/O	4		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			175	220 °C (428 °F)	32 mm	183
EP20K100EBC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						246
EPF81500RM240-3	Altera	Loadable PLD	Military	Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.5 V	.5 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	1500 Flip Flops; 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					32 mm
EP20K1000EFI784	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell				4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EPF10K50GC403-4	Altera	Loadable PLD	Commercial	Pin/Peg	403	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.6 ns	2880	No	5.25 V	CMOS	310	5	3.3/5,5 V	Grid Array, Interstitial Pitch	SPGA403M,37X37	Field Programmable Gate Arrays	Registered	4.75 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 310 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P403	1	5.026 mm	49.78 mm	No	2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	62.89 MHz		310	220 °C (428 °F)	49.78 mm	310
EP20K200EFI784-1	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EP20K200EBC652-3N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.33 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1					45 mm	376
EPF8820AQC160-4	Altera	Loadable PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		672	Yes	5.25 V	CMOS	120	5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	Registered	4.75 V	.65 mm	70 °C (158 °F)	4 Dedicated Inputs, 120 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	357 MHz	20 s	116	220 °C (428 °F)	28 mm	120
EP20K100TC144	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Flatpack, Low Profile, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 101 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3				220 °C (428 °F)	20 mm	101
EPF10K200SFI484-2X	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	369 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	369
EPF10K50BI356-5	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns	2880	Yes	5.5 V	CMOS	274	5	3.3/5,5 V	Grid Array, Heat Sink/Slug, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 274 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	57.8 MHz		274	220 °C (428 °F)	35 mm	274
EP20K100ETI144-2X	Altera	Loadable PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		4160	Yes	2.625 V	CMOS	84	2.5	1.8,1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 92 I/O	4		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3			84	220 °C (428 °F)	20 mm	92
EP1M120F484C7N	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V	CMOS		1.8		Grid Array			Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				245 °C (473 °F)	23 mm	303
EPF10K100ABI356-3N	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	0.8 ns	4992	Yes	3.6 V	CMOS	274	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 274 I/O	4	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1		30 s	274	260 °C (500 °F)	35 mm	274
EPF10K30EFC484-1	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V	CMOS	220	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			220	220 °C (428 °F)	23 mm	220
EPF8636ARC208-2	Altera	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		504	Yes	5.25 V	CMOS	136	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208		4.1 mm	28 mm	No	504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		132	220 °C (428 °F)	28 mm	136
EPF10K50QM304-5	Altera	Loadable PLD	Military	Gull Wing	304	QFP	Square	Plastic/Epoxy	27 ns		Yes	5.5 V	CMOS		5		Flatpack			Registered	4.5 V		125 °C (257 °F)	4 Dedicated Inputs, 249 I/O	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G304				No	2880 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	53.76 MHz					249
EPF10K40QI208-3	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	17.2 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	147
EP20K1000EFC672	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1	160 MHz				27 mm	508
EP20K200FC784-3	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EPF10K40BM356-5	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V	CMOS		5		Grid Array, Heat Sink/Slug, Low Profile			Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz				35 mm
EPF10K130EFC672-1	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.3 ns	6656	Yes	2.625 V	CMOS	413	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	413 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0		20 s	413	220 °C (428 °F)	27 mm	413
EPF8820AQC160-A-4	Altera	Loadable PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	1.9 ns		Yes	3.6 V	CMOS		3.3		Flatpack			Registered	3 V	.65 mm	70 °C (158 °F)	4 Dedicated Inputs, 120 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160		4.07 mm	28 mm	No	Can also operate at 5 V supply	e3					28 mm	120
EPF8452LI84-2	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Chip Carrier			Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 64 I/O	4	-40 °C (-40 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements						29.3116 mm	64
EPF10K50SFC484-2N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1		40 s		260 °C (500 °F)	23 mm	254
EPF10K130EBC672-3	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 413 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						413
EP20K100EFC144-1X	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	1.73 ns	4160	Yes	1.89 V	CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0	160 MHz	20 s	85	235 °C (455 °F)	13 mm	93
EPF10K10RI208-3	Altera	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	16.1 ns		Yes	5.25 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 134 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	134
EPF10K30ABC356-1N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns		Yes	3.6 V	CMOS		3.3		Grid Array, Low Profile			Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1728 Logic Elements; 216 Labs	e1	80 MHz				35 mm	246
EPF10K130EFI484-2N	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	85 °C (185 °F)	369 I/O		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1		40 s		260 °C (500 °F)	23 mm	369

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.