Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EPF10K50SFI672-1	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	8 ns	2880	Yes	2.7 V	CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			254	220 °C (428 °F)	27 mm	254
EP20K200EQI240-2	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V	CMOS	160	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm		4 Dedicated Inputs, 168 I/O	4		Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		20 s	160	220 °C (428 °F)	32 mm	168
EP20K200EBC356-3	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.33 ns	8320	Yes	1.89 V	CMOS	263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	263	220 °C (428 °F)	35 mm	271
EPF8452ALI84-A-2	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	1.7 ns		Yes	3.6 V	CMOS		3.3		Chip Carrier			Registered	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 68 I/O	4	-40 °C (-40 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	Can also operate at 5 V supply						29.3116 mm	68
EPF10K100BQC208-1	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	11 ns	4992	Yes	2.7 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	4992 Logic Elements	e0	140 MHz		147	220 °C (428 °F)	28 mm	147
EP20K300EBC652XES	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm	408
EPF8282TI100-2	Altera	Loadable PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Low Profile, Fine Pitch			Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 74 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100		1.27 mm	14 mm	No	282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry	e3					14 mm	74
EPF10K50ERI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	13.5 ns	2880	Yes	2.7 V	CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	85 °C (185 °F)	189 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			189	220 °C (428 °F)	32 mm	189
EPF10K100BC560-5	Altera	Loadable PLD	Commercial	Ball	560	BGA	Square	Plastic/Epoxy	27 ns		Yes	5.25 V	CMOS		5		Grid Array			Registered	4.75 V		70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560				No	4992 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz
EPF10K130EBI672-3	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 413 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						413
EPF10K30BC356-3	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V	CMOS	246	5	3.3/5,5 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No	1728 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	66.67 MHz	20 s	246	220 °C (428 °F)	35 mm	246
EP20K60EFC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 204 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1	160 MHz			220 °C (428 °F)	27 mm	204
EP20K1500EBC652-1X	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.84 ns	51840	Yes	1.89 V	CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	5A	3.5 mm	45 mm	No		e0	160 MHz	20 s	480	220 °C (428 °F)	45 mm	488
EP1K10TI144-2	Altera	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.5 ns	576	Yes	2.625 V	CMOS	92	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	85 °C (185 °F)	92 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	37.5 MHz		92	220 °C (428 °F)	20 mm	92
EP20K100EQI208-1X	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy		4160	Yes	2.625 V	CMOS	143	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 151 I/O	4		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			143	220 °C (428 °F)	28 mm	151
EP20K60ETI144-2	Altera	Loadable PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		2560	Yes	2.625 V	CMOS	84	2.5	1.8,1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 92 I/O	4		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3			84	220 °C (428 °F)	20 mm	92
EPF6016BI256-2	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1320	Yes	5.5 V	CMOS	204	5	3.3/5,5 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays	Macrocell	4.5 V	1.27 mm		4 Dedicated Inputs, 218 I/O	4		Tin Lead	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	Also Configurable with 5 V VCC	e0	153 MHz		204	220 °C (428 °F)	27 mm	218
EPF81500RM304-2	Altera	Loadable PLD	Military	Gull Wing	304	FQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.5 V	.5 mm	125 °C (257 °F)	4 Dedicated Inputs, 204 I/O	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No	1500 Flip Flops; 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					40 mm	204
EP20K200BC356-3N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	3.6 ns		Yes	2.625 V	CMOS		2.5		Grid Array, Low Profile			Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 277 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	277
EPF6016ATI144-2	Altera	Loadable PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		1320	Yes	3.6 V	CMOS	117	3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm		4 Dedicated Inputs, 117 I/O	4		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Configurable with 5 V VCC	e0	153 MHz		117	220 °C (428 °F)	20 mm	117
EPF6016AFC100-2N	Altera	Loadable PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy			Yes	3.6 V			3.3		Grid Array, Low Profile			Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 81 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No		e1	153 MHz				11 mm	81
EPF10K40BI356-4	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V	CMOS		5		Grid Array, Heat Sink/Slug, Low Profile			Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm
EPF10K50SRC240-1X	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	8 ns		Yes	2.7 V	CMOS		2.5		Flatpack, Heat Sink/Slug, Fine Pitch			Mixed	2.3 V	.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EP20K30ETC144-2X	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2.69 ns	1200	Yes	1.89 V	CMOS	84	1.8	1.8,1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 92 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	160 MHz	20 s	84	220 °C (428 °F)	20 mm	92
EP20K200CFC484-7X	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	376
EP20K100EFC324-1XN	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	1.73 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz			245 °C (473 °F)	19 mm	246
EPF10K200SBI600-3X	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1.27 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm	470
EPF81188RI208-3	Altera	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm
EP20K400CB652C7N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.48 ns		Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		2 mm	45 mm	No		e1					45 mm	488
EPF10K50SQC240-2X	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V	CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			189	220 °C (428 °F)	32 mm	189
EPF81500GC288-2	Altera	Loadable PLD	Commercial									5.25 V	CMOS		5					Registered	4.75 V		70 °C (158 °F)	4 Dedicated Inputs, 204 I/O	4	0 °C (32 °F)							No	Labs With Fasttrack Interconnect; 1500 Flipflops; 1296 Logic Elements							204
EPF10K30EFC484-2X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V	CMOS	220	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			220	220 °C (428 °F)	23 mm	220
EP20K300ERI240	Altera	Loadable PLD		Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes				1.8		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell		.5 mm		4 Dedicated Inputs, 150 I/O	4		Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	150
EP20K300EQI208	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes				1.8		Flatpack, Fine Pitch			Macrocell		.5 mm		4 Dedicated Inputs, 118 I/O	4		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3				220 °C (428 °F)	28 mm	118
EPF10K30AQI240-1	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	11 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Fine Pitch			Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EPF81188AGC232-A-4	Altera	Loadable PLD	Commercial	Pin/Peg	232	PGA	Square	Ceramic, Metal-Sealed Cofired	1.9 ns		No	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 184 I/O	4	0 °C (32 °F)		Perpendicular	S-CPGA-P232		5.207 mm	44.7 mm	No	Can also operate at 5 V supply						44.7 mm	184
EPF8452AGI160-A-2	Altera	Loadable PLD	Industrial	Pin/Peg	160	PGA	Square	Ceramic, Metal-Sealed Cofired	1.7 ns		No	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 120 I/O	4	-40 °C (-40 °F)		Perpendicular	S-CPGA-P160		5.34 mm	39.624 mm	No	Can also operate at 5 V supply						39.624 mm	120
EPF10K50ETC144-2	Altera	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.6 ns	2880	Yes	2.7 V	CMOS	102	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	70 °C (158 °F)	102 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	2880 Logic Elements	e0	140 MHz	20 s	102	220 °C (428 °F)	20 mm	102
EP1K10TI100-3	Altera	Loadable PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	12.5 ns	576	Yes	2.625 V	CMOS	66	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	Registered	2.375 V	.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0			66	220 °C (428 °F)	14 mm
EP1K10FI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns	576	Yes	2.625 V	CMOS	136	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 130 I/O	6	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			136	220 °C (428 °F)	17 mm	130
EPF8820ATC144-A-2	Altera	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1.7 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Low Profile, Fine Pitch			Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 112 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No	Can also operate at 5 V supply	e3					20 mm	112
EPF10K130ERI240-2X	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	12 ns		Yes	2.7 V	CMOS		2.5		Flatpack, Heat Sink/Slug, Fine Pitch			Mixed	2.3 V	.5 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	186
EPF10K30EBC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 176 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm	176
EPF10K50EFI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	13.5 ns	2880	Yes	2.7 V	CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			191	220 °C (428 °F)	17 mm	191
EP2A40B724C8N	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.575 V	CMOS		1.5		Grid Array			Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e1		40 s		245 °C (473 °F)	35 mm	536
EP20K200BC784-2	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784				No		e1
EP20K300ERC208-2	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 120 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3	160 MHz			220 °C (428 °F)	28 mm	120
EP20K30EFC324-3X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.98 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1	160 MHz			220 °C (428 °F)	19 mm	128

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.