Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EPF81500ARC304-2A	Altera	Loadable PLD	Commercial	Gull Wing	304	FQFP	Square	Plastic/Epoxy			Yes	3.6 V	CMOS		3.3		Flatpack, Fine Pitch			Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)		Quad	S-PQFP-G304		4.5 mm	40 mm	No						220 °C (428 °F)	40 mm	208
EP20K200EQI208-3X	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 136 I/O	4		Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	136
EP20K200EFC672-3X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.33 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	160 MHz			220 °C (428 °F)	27 mm	376
EPF10K200SGC599-1	Altera	Loadable PLD	Commercial	Pin/Peg	599	IPGA	Square	Ceramic, Metal-Sealed Cofired	9 ns	9984	No	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array, Interstitial Pitch	SPGA599,47X47	Field Programmable Gate Arrays	Mixed	2.3 V	2.54 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No		e0			470	220 °C (428 °F)	62.484 mm	470
EPF6024AQI208-3	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy		1960	Yes	3.6 V	CMOS	171	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm		4 Dedicated Inputs, 171 I/O	4		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Typical gates = 12000 to 240000	e0			171	220 °C (428 °F)	28 mm	171
EPF10K30AFC484-1	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns	1728	Yes	3.6 V	CMOS	246	3.3	2.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	1728 Logic Elements; 216 Labs	e0	80 MHz	20 s	246	220 °C (428 °F)	23 mm	246
EPF10K30AFI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	11 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	246
EPF10K130VGI599-4	Altera	Loadable PLD	Industrial	Pin/Peg	599	IPGA	Square	Ceramic, Metal-Sealed Cofired	24.2 ns		No	3.6 V	CMOS		3.3		Grid Array, Interstitial Pitch			Registered	3 V	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 470 I/O	4	-40 °C (-40 °F)		Perpendicular	S-CPGA-P599		5.08 mm	62.484 mm	No							62.484 mm	470
EP20K200QC240-3X	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	174
EP20K200CQC208-9	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	136 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	136
EP20K600EFC672-1	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.57 ns	24320	Yes	1.89 V	CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	500	220 °C (428 °F)	27 mm	508
EP20K200FC484-2V	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	8320	Yes	2.625 V	CMOS	376	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	34 MHz		376	220 °C (428 °F)	23 mm	382
EPF10K100EFC256-2N	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm	191
EPF8282ATI100-A-2	Altera	Loadable PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	1.7 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Low Profile, Fine Pitch			Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 78 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100		1.27 mm	14 mm	No	Can also operate at 5 V supply	e3					14 mm	78
EPF10K50EFI672-1	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	8.5 ns	2880	Yes	2.7 V	CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			254	220 °C (428 °F)	27 mm	254
EP20K160EQC208-3N	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2.29 ns	6400	Yes	1.89 V	CMOS	135	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 143 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	160 MHz	30 s	135	245 °C (473 °F)	28 mm	143
EPF10K130EBC356-2	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V	CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm	274
EP20K400CF672I8N	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 488 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1					27 mm	488
EP20K300EQC240	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes				1.8		Flatpack, Fine Pitch			Macrocell		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	150
EP20K100FC324-2	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3 ns	4160	Yes	2.625 V	CMOS	246	2.5	2.5,2.5/3.3 V	Grid Array	BGA324(UNSPEC)	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0		20 s	246	220 °C (428 °F)	19 mm	252
EP20K100BI672-1	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs, 252 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						252
EPF10K70GC503-3	Altera	Loadable PLD	Commercial	Pin/Peg	503	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.5 ns	3744	No	5.25 V	CMOS	358	5	3.3/5,5 V	Grid Array, Interstitial Pitch	SPGA503,43X43	Field Programmable Gate Arrays	Registered	4.75 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 358 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P503	1	5.077 mm	57.4 mm	No	3744 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	54.1 MHz		358	220 °C (428 °F)	57.4 mm	358
EP1K10TC100-3	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	0.7 ns	576	Yes	2.625 V	CMOS	66	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	66 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0		20 s	66	235 °C (455 °F)	14 mm	66
EP20K200RC240-1X	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.5 ns	8320	Yes	2.625 V	CMOS	168	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			168	220 °C (428 °F)	32 mm	174
EPF10K40RC240-4	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	2304	Yes	5.25 V	CMOS	189	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	2304 Logic Elements	e0	62.89 MHz	20 s	185	220 °C (428 °F)	32 mm	189
EPF10K100BI560-4	Altera	Loadable PLD	Industrial	Ball	560	BGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V	CMOS		5		Grid Array			Registered	4.5 V		85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B560				No	4992 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz
EPF10K10LI84-3	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	16.1 ns		Yes	5.25 V	CMOS		5		Chip Carrier			Registered	4.75 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 59 I/O	4	-40 °C (-40 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm	59
EP20K200QC208V	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 144 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	144
EP20K160EFC484-2XN	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.93 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 316 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz	40 s		260 °C (500 °F)	23 mm	316
EPF8820BM225-2	Altera	Loadable PLD	Military	Ball	225	BGA	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Grid Array			Registered	4.5 V	1.5 mm	125 °C (257 °F)	4 Dedicated Inputs, 148 I/O	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e1					27 mm	148
EPF8820ARC208-2A	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)		Quad	S-PQFP-G208		4.1 mm	28 mm	No						220 °C (428 °F)	28 mm	152
EP20K100QC208-1V	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.3 ns	4160	Yes	2.625 V	CMOS	153	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 159 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	100 MHz		153	220 °C (428 °F)	28 mm	159
EP20K60EQI208-2X	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy	2.41 ns	2560	Yes	1.89 V	CMOS	140	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm		4 Dedicated Inputs, 148 I/O	4		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			140	220 °C (428 °F)	28 mm	148
EP1K30QC208-2N	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	37.5 MHz	30 s	147	245 °C (473 °F)	28 mm	147
EP1K10TC100-2N	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	0.5 ns	576	Yes	2.625 V	CMOS	66	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	66 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	37.5 MHz	30 s	66	260 °C (500 °F)	14 mm	66
EP20K200RC208-2V	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.4 ns	8320	Yes	2.625 V	CMOS	138	2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 144 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3	34 MHz		138	220 °C (428 °F)	28 mm	144
EP20K200EFI484-3	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy		8320	Yes		CMOS	368	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Macrocell		1 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1			368	220 °C (428 °F)		376
EP20K100QI208-2N	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy	3 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 159 I/O	4		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm	159
EP20K60ETC144-1X-1	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Flatpack, Low Profile, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 92 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3					20 mm	92
EPF10K100EBI356-3	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	16 ns	4992	Yes	2.7 V	CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Mixed	2.3 V	1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			274	220 °C (428 °F)	35 mm	274
EPF10K100EBI672-2	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 338 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						338
EPF10K50SPC208-3	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12.5 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.375 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	147
EP20K100RC240-1V	Altera	Loadable PLD	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.3 ns	4160	Yes	2.625 V	CMOS	183	2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3	100 MHz		183	220 °C (428 °F)	32 mm	189
EP20K60EFC324-3X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.56 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz			220 °C (428 °F)	19 mm	196
EP20K400EFC672-2XN	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.83 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	160 MHz	40 s		245 °C (473 °F)	27 mm	488
EPF10K30QI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	17.2 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EP2A70B724C7N	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.17 ns		Yes	1.575 V	CMOS		1.5		Grid Array			Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e1					35 mm	536
EP20K200CQ208C7	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.48 ns	8320	Yes	1.89 V	CMOS	128	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			128	220 °C (428 °F)	28 mm	136

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.