Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EPF10K30ABC256-3	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	2 ns	1728	Yes	3.6 V	CMOS	246	3.3	3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 191 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1			246	220 °C (428 °F)	27 mm	191
EPF10K130EBC356-1N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.3 ns		Yes	2.625 V	CMOS		2.5		Grid Array, Low Profile			Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	274
EPF10K30EQC208-3	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	2.625 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		20 s	147	220 °C (428 °F)	28 mm	147
EP20K400BC652-1X	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.5 ns	16640	Yes	2.625 V	CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1			496	220 °C (428 °F)	45 mm	502
EP20K200CQC240-8	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	168 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	168
EPF10K30RC208-3N	Altera	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V	CMOS	147	5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1728 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	66.67 MHz	30 s	147	245 °C (473 °F)	28 mm	147
EP20K100EQC240-1XN	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.73 ns		Yes	1.89 V	CMOS		1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 183 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3					32 mm	183
EP20K100EFC784-3	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B784	3			No		e0				220 °C (428 °F)
EP20K400EBC652-1XN	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.57 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1					45 mm	488
EPF81188AQI208-4N	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 144 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm	144
EPF8820AGC192-A-3	Altera	Loadable PLD	Commercial	Pin/Peg	192	PGA	Square	Ceramic, Metal-Sealed Cofired	1.8 ns		No	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)		Perpendicular	S-CPGA-P192		5.43 mm	45.15 mm	No	Can also operate at 5 V supply						45.15 mm	152
EPF10K100EQI240-2	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V	CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	85 °C (185 °F)	189 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			189	220 °C (428 °F)	32 mm	189
EP20K1000EFC33-3N	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	2.32 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1		40 s		245 °C (473 °F)	33 mm	708
EPF10K30AFI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	13 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	246
EP20K100EFI400-1	Altera	Loadable PLD		Ball	400	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Lead	Bottom	S-PBGA-B400	3			No		e0				220 °C (428 °F)
EP20K100EFC484-1	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz			220 °C (428 °F)	23 mm	246
EPF10K130EQC240-3X	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.6 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.375 V	.5 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	186
EP1K10TC100-2	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	0.5 ns	576	Yes	2.625 V	CMOS	66	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	66 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	37.5 MHz	20 s	66	235 °C (455 °F)	14 mm	66
EP20K200CBI356-8X	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm		271 I/O			Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	271
EP20K200FI484-2	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	376	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 382 I/O	4		Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			376	220 °C (428 °F)	23 mm	382
EPF10K50VFI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	17.2 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 291 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	291
EPF10K100BFC256-3	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	14.5 ns	4992	Yes	2.7 V	CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	4992 Logic Elements	e0	140 MHz		191	220 °C (428 °F)	17 mm	191
EPF10K50SFI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	8 ns	2880	Yes	2.7 V	CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			191	220 °C (428 °F)	17 mm	191
EP20K1000CF1020C-7	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy	1.4 ns	38400	Yes	1.89 V	CMOS	700	1.8	1.8,1.8/3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0			700	220 °C (428 °F)	33 mm	708
EPF10K200EFC672-2N	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No	9984 Logic Elements	e1	140 MHz				27 mm	470
EP20K600CF672C7	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.48 ns	24320	Yes	1.89 V	CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3.5 mm	27 mm	No		e0		20 s	500	220 °C (428 °F)	27 mm	508
EPF10K50SPI208-3	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12.5 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	147
EPF8452AGC160-3	Altera	Loadable PLD	Commercial	Pin/Peg	160	PGA	Square	Ceramic, Metal-Sealed Cofired		336	No	5.25 V	CMOS	120	5	3.3/5,5 V	Grid Array	PGA160M,15X15	Field Programmable Gate Arrays	Registered	4.75 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 120 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P160	1	5.34 mm	39.624 mm	No	336 Logic Elements	e0	385 MHz		116	220 °C (428 °F)	39.624 mm	120
EP20K160ETI144-2X	Altera	Loadable PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		6400	Yes	2.625 V	CMOS	80	2.5	1.8,1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 88 I/O	4		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3			80	220 °C (428 °F)	20 mm	88
EPF8820RM160-3	Altera	Loadable PLD	Military	Gull Wing	160	HQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug			Registered	4.5 V	.65 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G160		3.91 mm	28 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm
EPF8282VLC84-3	Altera	Loadable PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		208	Yes	3.6 V	CMOS	68	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 64 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry	e0			64	220 °C (428 °F)	29.3116 mm	64
EP20K60ERC240	Altera	Loadable PLD	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 183 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3	160 MHz				32 mm	183
EP20K100FC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm	252
EP2A25B724C9	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.23 ns	24320	Yes	1.575 V	CMOS	524	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays	Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm	536
EPF10K70QI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	19.1 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EP2A25B724C8	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.94 ns	24320	Yes	1.575 V	CMOS	524	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays	Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm	536
EP20K200BC356-1XN	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.5 ns		Yes	2.625 V	CMOS		2.5		Grid Array, Low Profile			Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 277 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	277
EP20K100RC240-1	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		4160	Yes	2.625 V	CMOS	183	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			183	220 °C (428 °F)	32 mm	189
EPF10K100EBI356-2X	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	12 ns		Yes	2.7 V	CMOS		2.5		Grid Array, Low Profile			Mixed	2.3 V	1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	274
EPF10K100AFI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12.5 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 369 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	369
EP20K100FC672-2	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm	252
EPF10K30RC240-4N	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V	CMOS	189	5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements	e3	62.89 MHz	30 s	189	245 °C (473 °F)	32 mm	189
EP20K100FC400-3	Altera	Loadable PLD	Other	Ball	400	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3			No		e1				220 °C (428 °F)
EPF10K130EBI600-1X	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	9 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1.27 mm	85 °C (185 °F)	424 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm	424
EPF8636ARM160-5	Altera	Loadable PLD	Military	Gull Wing	160	HQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug			Registered	4.5 V	.65 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G160		3.91 mm	28 mm	No	636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm
EPF8636ARI160-5	Altera	Loadable PLD	Industrial	Gull Wing	160	HQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug			Registered	4.5 V	.65 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G160		3.91 mm	28 mm	No	636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm
EP20K1000EPC984-3	Altera	Loadable PLD	Other	Pin/Peg	984	PGA	Square	Ceramic, Metal-Sealed Cofired			No	1.89 V			1.8		Grid Array			Macrocell	1.71 V		85 °C (185 °F)	4 Dedicated Inputs, 716 I/O	4	0 °C (32 °F)		Perpendicular	S-CPGA-P984				No			160 MHz					716
EP20K100RI240-3X	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 189 I/O	4		Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	189

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.