Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EP20K200RC208-1X	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	2.5 ns	8320	Yes	2.625 V	CMOS	138	2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	144 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3			138	220 °C (428 °F)	28 mm	144
EP20K200RC208	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 144 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3				220 °C (428 °F)	28 mm	144
EPF10K20RI240-4	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V	CMOS	189	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1152 Logic Elements	e0	67.11 MHz	20 s	189	220 °C (428 °F)	32 mm	189
EP20K60EFC484-2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 204 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz			220 °C (428 °F)	23 mm	204
EP20K1500EFC1020-2	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy		51840	Yes	2.625 V	CMOS	808	2.5	1.8,2.5,3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 808 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0	160 MHz		808	220 °C (428 °F)	33 mm	808
EPF10K50ERC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	13.5 ns	2880	Yes	2.7 V	CMOS	189	2.5	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			189	220 °C (428 °F)	32 mm	189
EP20K160EQC240-3N	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.29 ns	6400	Yes	1.89 V	CMOS	167	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 175 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	160 MHz	30 s	167	245 °C (473 °F)	32 mm	175
EPF10K200SGI599-3	Altera	Loadable PLD	Industrial	Pin/Peg	599	IPGA	Square	Ceramic, Metal-Sealed Cofired	16 ns	9984	No	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array, Interstitial Pitch	SPGA599,47X47	Field Programmable Gate Arrays	Mixed	2.3 V	2.54 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No		e0			470	220 °C (428 °F)	62.484 mm	470
EPF10K50SQC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V	CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		20 s	189	220 °C (428 °F)	32 mm	189
EPF10K50SFC484-2	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V	CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	254	220 °C (428 °F)	23 mm	254
EPF8636AQC208-2N	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm	136
EP20K200QC240-1X	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	168	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			168	220 °C (428 °F)	32 mm	174
EP20K100BC356-3	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	3.6 ns	4160	Yes	2.625 V	CMOS	246	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	246	220 °C (428 °F)	35 mm	252
EPF10K70QM304-4	Altera	Loadable PLD	Military	Gull Wing	304	QFP	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V	CMOS		5		Flatpack			Registered	4.5 V		125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G304				No	3744 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	60.6 MHz
EP20K160ERC240-2X	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		6400	Yes	2.625 V	CMOS	167	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 175 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3	160 MHz		167	220 °C (428 °F)	32 mm	175
EPF10K130EFI672-2X	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	12 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	413 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	413
EPF10K30EFC484-3N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		40 s		260 °C (500 °F)	23 mm	220
EPF8636ARC208-3	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		504	Yes	5.25 V	CMOS	136	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208		4.1 mm	28 mm	No	504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		132	220 °C (428 °F)	28 mm	136
EP20K200RC208-2N	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 144 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	144
EPF10K100GC503-3DX	Altera	Loadable PLD	Commercial	Pin/Peg	503	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.5 ns	4992	No	5.25 V	CMOS	406	5	3.3/5,5 V	Grid Array, Interstitial Pitch	SPGA503,43X43	Field Programmable Gate Arrays	Registered	4.75 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 406 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P503	1	5.077 mm	57.4 mm	No		e0			406	220 °C (428 °F)	57.4 mm	406
EPF10K10TC144-4N	Altera	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.6 ns	576	Yes	5.25 V	CMOS	102	5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 102 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s	102	260 °C (500 °F)	20 mm	102
EPF8452ALC84-A-4	Altera	Loadable PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	1.9 ns		Yes	3.6 V	CMOS		3.3		Chip Carrier			Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 68 I/O	4	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	Can also operate at 5 V supply						29.3116 mm	68
EP20K200EQI208-1	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	128	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 136 I/O	4		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			128	220 °C (428 °F)	28 mm	136
EPF10K100BPC208-3	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	14.5 ns		Yes		CMOS		2.5		Flatpack, Fine Pitch			Mixed		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	147
EP2A15F672I8N	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	1.94 ns		Yes	1.575 V	CMOS		1.5		Grid Array			Macrocell	1.425 V	1 mm		492 I/O			Tin/Silver/Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1		40 s		245 °C (473 °F)	27 mm	492
EPF10K200SBI600-2	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	12 ns	9984	Yes	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Mixed	2.3 V	1.27 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm	470
EPF10K250EFC672-2	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy		12160	Yes	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3			No		e0			470	220 °C (428 °F)		470
EPF8820ARC208-4	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		672	Yes	5.25 V	CMOS	152	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	357 MHz		148	220 °C (428 °F)	28 mm	152
EP20K200CQC208-7X	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V			1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	136 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	136
EP20K300EFC672-2XN	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.29 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	160 MHz			245 °C (473 °F)	27 mm	408
EPF10K200EBC600-3	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.8 ns	9984	Yes	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Mixed	2.3 V	1.27 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No	9984 Logic Elements	e0	140 MHz	20 s	470	220 °C (428 °F)	45 mm	470
EPF81188ARC240-6	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.25 V	CMOS	184	5	3.3/5,5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 180 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240		4.2 mm	32 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0			180	220 °C (428 °F)	32 mm	180
EPF10K100EFC484-1X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V	CMOS	338	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	338 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	338	220 °C (428 °F)	23 mm	338
EPF10K20QI240-5	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	27 ns		Yes	5.5 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	1152 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	53.76 MHz				32 mm
EP20K60EBI356-3	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		2560	Yes	2.625 V	CMOS	188	2.5	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 196 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			188	220 °C (428 °F)	35 mm	196
EPF81188AQC208-5	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 144 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		3.91 mm	28 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm	144
EP1K50QC208-2	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	37.5 MHz	20 s	147	220 °C (428 °F)	28 mm	147
EP20K1000EFC1020-2X	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy		38400	Yes	2.625 V	CMOS	708	2.5	1.8,2.5,3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0	160 MHz		708	220 °C (428 °F)	33 mm	708
EPF10K50SQC208-1N	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			147		28 mm	147
EPF81188GC232-3	Altera	Loadable PLD	Commercial	Pin/Peg	232	PGA	Square	Ceramic, Metal-Sealed Cofired		1008	No	5.25 V	CMOS	184	5	3.3/5,5 V	Grid Array	PGA232,17X17	Field Programmable Gate Arrays	Registered	4.75 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 180 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P232	1	5.207 mm	44.7 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0			180	220 °C (428 °F)	44.7 mm	180
EP20K100EQC240-1N	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.73 ns	4160	Yes	1.89 V	CMOS	175	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 183 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3		30 s	175	245 °C (473 °F)	32 mm	183
EP20K160EQI208-3	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy		6400	Yes	2.625 V	CMOS	135	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 143 I/O	4		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			135	220 °C (428 °F)	28 mm	143
EP20K200BI672-2	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs, 382 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						382
EP20K200CFI484-9	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm		376 I/O			Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	376
EPF6016AQC208-1N	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		1320	Yes	3.6 V	CMOS	171	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Matte Tin/Copper	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can Also Be Used 16000 Logic Gates	e2	172 MHz	40 s	171	245 °C (473 °F)	28 mm	171
EPF81188ARC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.25 V	CMOS	184	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 184 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		180	220 °C (428 °F)	32 mm	184
EP20K1000CF672C8N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.79 ns		Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672		3.5 mm	27 mm	No		e1		40 s		245 °C (473 °F)	27 mm	508
EP20K160EFC484-1N	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.55 ns	6400	Yes	1.89 V	CMOS	308	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 316 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz	30 s	308	260 °C (500 °F)	23 mm	316

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.