Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EP1K100FC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

2.625 V

CMOS

333

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

333 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

20 s

333

220 °C (428 °F)

23 mm

333

EP20K200CFC672-8X

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

376 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

376

EPF10K10AQC208-1N

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Fine Pitch

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 134 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

576 Logic Elements; 72 Labs

e3

80 MHz

28 mm

134

EPF10K70QI304-4

Altera

Loadable PLD

Industrial

Gull Wing

304

FQFP

Square

Plastic/Epoxy

23.8 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G304

4.5 mm

40 mm

No

3744 Logic elements; Built-in JTAG boundry-scan test circuitry

e3

60.6 MHz

40 mm

EPF10K70BC560-5

Altera

Loadable PLD

Commercial

Ball

560

BGA

Square

Plastic/Epoxy

27 ns

Yes

5.25 V

CMOS

5

Grid Array

Registered

4.75 V

70 °C (158 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B560

No

3744 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

53.76 MHz

EP20K200EBC356

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array, Low Profile

Macrocell

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 273 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

273

EPF81500ARC240-2

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1.7 ns

1296

Yes

5.25 V

CMOS

181

5

3.3/5,5 V

Flatpack, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 181 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

417 MHz

177

220 °C (428 °F)

32 mm

181

EP20K30EQI208-1X

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1200

Yes

2.625 V

CMOS

117

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 125 I/O

4

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

117

220 °C (428 °F)

28 mm

125

EP1K100FC256

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Registered

2.375 V

1 mm

70 °C (158 °F)

6 Dedicated Inputs, 186 I/O

6

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

186

EP20K300EQC240-2X

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

2.29 ns

11520

Yes

1.89 V

CMOS

144

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 152 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

160 MHz

20 s

144

220 °C (428 °F)

32 mm

152

EP20K60ERI240-3

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

2560

Yes

2.625 V

CMOS

143

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 151 I/O

4

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

143

220 °C (428 °F)

32 mm

151

EPF10K130EBI356-1

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

9 ns

6656

Yes

2.7 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e0

274

220 °C (428 °F)

35 mm

274

EP20K200BC356

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array, Low Profile

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 279 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

220 °C (428 °F)

35 mm

279

EP20K400EQC240

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Fine Pitch

Macrocell

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 132 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

220 °C (428 °F)

32 mm

132

EPF8636AQI208-A-3

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1.8 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 136 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

Can also operate at 5 V supply

e3

28 mm

136

EPF10K50SFC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

2880

Yes

2.625 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

254 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

20 s

254

220 °C (428 °F)

23 mm

254

EPF10K100BPC240-2

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

12 ns

Yes

CMOS

2.5

Flatpack, Fine Pitch

Mixed

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EPF81188AGI232-3

Altera

Loadable PLD

Industrial

Pin/Peg

232

PGA

Square

Ceramic, Metal-Sealed Cofired

1008

No

5.5 V

CMOS

184

5

3.3/5,5 V

Grid Array

PGA232M,17X17

Field Programmable Gate Arrays

Registered

4.5 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 184 I/O

4

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P232

1

5.207 mm

44.7 mm

No

1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

385 MHz

180

220 °C (428 °F)

44.7 mm

184

EP1K10FC256-3N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

576

Yes

2.625 V

CMOS

136

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

136 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

30 s

136

260 °C (500 °F)

17 mm

136

EPF8636AGC192-4

Altera

Loadable PLD

Commercial

Pin/Peg

192

PGA

Square

Ceramic, Metal-Sealed Cofired

504

No

5.25 V

CMOS

136

5

3.3/5,5 V

Grid Array

PGA192M,17X17

Field Programmable Gate Arrays

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 136 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P192

1

5.43 mm

45.15 mm

No

504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

357 MHz

132

220 °C (428 °F)

45.15 mm

136

EP1M120FC484-5

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 303 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

303

EP20K100QC208-2N

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

3 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 159 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

28 mm

159

5962-9463401MXX

Altera

Loadable PLD

Military

Pin/Peg

192

PGA

Square

Ceramic, Metal-Sealed Cofired

0.9 ns

No

5.5 V

CMOS

MIL-STD-883

5

Grid Array

Registered

4.5 V

2.54 mm

125 °C (257 °F)

4 Dedicated Inputs, 148 I/O

4

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P192

5.43 mm

45.15 mm

No

820 Flip Flops; 672 Logic Elements; Configurable I/O Operation

e4

45.15 mm

148

EP20K400EFC672-2N

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.83 ns

16640

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

160 MHz

30 s

480

245 °C (473 °F)

27 mm

488

EPF10K50SQC240-3

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

0.5 ns

2880

Yes

2.625 V

CMOS

189

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

189 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

20 s

189

220 °C (428 °F)

32 mm

189

EPF8820AGC192-A-4

Altera

Loadable PLD

Commercial

Pin/Peg

192

PGA

Square

Ceramic, Metal-Sealed Cofired

1.9 ns

No

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 152 I/O

4

0 °C (32 °F)

Perpendicular

S-CPGA-P192

5.43 mm

45.15 mm

No

Can also operate at 5 V supply

45.15 mm

152

EPF10K30BM356-5

Altera

Loadable PLD

Military

Ball

356

HLBGA

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Grid Array, Heat Sink/Slug, Low Profile

Registered

4.5 V

1.27 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

1728 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

53.76 MHz

35 mm

EPF81500ARC240-4N

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1.9 ns

Yes

5.25 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 181 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

32 mm

181

EPF10K200SQI240-1X

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

9 ns

Yes

2.7 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.3 V

.5 mm

85 °C (185 °F)

182 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

182

EPF10K50ERI240-1

Altera

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

8.5 ns

2880

Yes

2.7 V

CMOS

189

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

85 °C (185 °F)

189 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e0

189

220 °C (428 °F)

32 mm

189

EPF10K50EBI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

13.5 ns

2880

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 220 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e0

220

220 °C (428 °F)

35 mm

220

EPF10K40BC356-4

Altera

Loadable PLD

Commercial

Ball

356

HLBGA

Square

Plastic/Epoxy

23.8 ns

Yes

5.25 V

CMOS

5

Grid Array, Heat Sink/Slug, Low Profile

Registered

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

2304 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

60.6 MHz

35 mm

EP1K10FI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

576

Yes

2.625 V

CMOS

136

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

85 °C (185 °F)

136 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

37.5 MHz

20 s

136

220 °C (428 °F)

17 mm

136

EPF8820AQM160-4

Altera

Loadable PLD

Military

Gull Wing

160

QFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack

Registered

4.5 V

.65 mm

125 °C (257 °F)

4 Dedicated Inputs, 116 I/O

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G160

4.07 mm

28 mm

No

820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

116

EPF10K250EGI599-2

Altera

Loadable PLD

Industrial

Pin/Peg

599

HIPGA

Square

Ceramic, Metal-Sealed Cofired

12160

No

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array, Heat Sink/Slug, Interstitial Pitch

SPGA599,47X47

Field Programmable Gate Arrays

Mixed

2.3 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P599

1

5.08 mm

62.484 mm

No

e0

470

220 °C (428 °F)

62.484 mm

470

EP20K300EBC652-2XN

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.29 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 408 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

160 MHz

45 mm

408

EPF10K50SQC208-1

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.3 ns

2880

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

147

220 °C (428 °F)

28 mm

147

EPF10K50STI144-2X

Altera

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

9.5 ns

Yes

2.7 V

CMOS

2.5

Flatpack, Low Profile, Fine Pitch

Mixed

2.3 V

.5 mm

85 °C (185 °F)

102 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

1.6 mm

20 mm

No

e3

20 mm

102

EPF10K100BRC240-3

Altera

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

14.5 ns

4992

Yes

2.7 V

CMOS

189

2.5

2.5/3.3,3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

70 °C (158 °F)

189 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e0

189

220 °C (428 °F)

32 mm

189

EP20K100EQI240-3X

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 183 I/O

4

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

220 °C (428 °F)

32 mm

183

EP20K160EFC484

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 324 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

220 °C (428 °F)

23 mm

324

EPF10K100EQI240-1

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

9 ns

4992

Yes

2.7 V

CMOS

189

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

85 °C (185 °F)

189 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

189

220 °C (428 °F)

32 mm

189

EPF8282ALI84-A-3

Altera

Loadable PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

1.8 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 68 I/O

4

-40 °C (-40 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

Can also operate at 5 V supply

29.3116 mm

68

EPF10K100BRC240

Altera

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

Yes

2.5

Flatpack, Heat Sink/Slug, Fine Pitch

Mixed

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EPF10K100EFC672-1X

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

9 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

70 °C (158 °F)

338 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

338

EPF10K200SFC484-3X

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.8 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

369 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

369

EPF10K130EBI484-3

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

85 °C (185 °F)

4 Dedicated Inputs, 369 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

369

EP20K160ERI240-3

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

6400

Yes

2.625 V

CMOS

167

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 175 I/O

4

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

167

220 °C (428 °F)

32 mm

175

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.