Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EP20K200BC356-3

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

3.6 ns

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 277 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

271

220 °C (428 °F)

35 mm

277

EPF10K200EFI672-3

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

16 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

470

220 °C (428 °F)

27 mm

470

EP20K200ERC240-1

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

160

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 168 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

160

220 °C (428 °F)

32 mm

168

EPF10K100EFC672-3

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

16 ns

4992

Yes

2.7 V

CMOS

338

2.5

2.5/3.3,3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

338 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

338

220 °C (428 °F)

27 mm

338

EPF10K30RI208-3

Altera

Loadable PLD

Industrial

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

17.2 ns

Yes

5.25 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.75 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 147 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EPF81188AGC232-2H

Altera

Loadable PLD

Commercial

Pin/Peg

232

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

CMOS

5

Grid Array

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 184 I/O

4

0 °C (32 °F)

Perpendicular

S-CPGA-P232

5.207 mm

No

44.7 mm

184

EPF10K10ATI144-2

Altera

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 102 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

1.6 mm

20 mm

No

e3

20 mm

102

EP20K100FC324-3

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

3.6 ns

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array

BGA324(UNSPEC)

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e0

20 s

246

220 °C (428 °F)

19 mm

252

EP2A70F1508C7N

Altera

Loadable PLD

Other

Ball

1508

BGA

Square

Plastic/Epoxy

2.17 ns

Yes

1.575 V

CMOS

1.5

Grid Array

Macrocell

1.425 V

1 mm

85 °C (185 °F)

1060 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1508

3.5 mm

40 mm

No

e1

40 mm

1060

EP20K600EFC33-1

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

1.57 ns

24320

Yes

1.89 V

CMOS

580

1.8

1.8,1.8/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 588 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

20 s

580

220 °C (428 °F)

33 mm

588

EP20K400EFI672-1

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

16640

Yes

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1 mm

4 Dedicated Inputs, 488 I/O

4

Tin Lead

Bottom

S-PBGA-B672

3

No

e0

480

220 °C (428 °F)

488

EPXA4F672C3

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 426 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

220 °C (428 °F)

27 mm

426

EP20K400ERC208-2

Altera

Loadable PLD

Other

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 100 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

100

EP20K1000CB652C9

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.02 ns

38400

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

480

220 °C (428 °F)

45 mm

488

EPF8282VLI84-3

Altera

Loadable PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

3.3

Chip Carrier

Registered

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 64 I/O

4

-40 °C (-40 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry

29.3116 mm

64

EPF10K50SPI208-1

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

8 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 147 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EP20K200EBC652

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array, Low Profile

Macrocell

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

376

EP20K200RI240-2X

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

3 ns

8320

Yes

2.625 V

CMOS

168

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 174 I/O

4

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

168

220 °C (428 °F)

32 mm

174

EPF81188ARI208-6

Altera

Loadable PLD

Industrial

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

EP20K400EQI208-1

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Fine Pitch

Macrocell

.5 mm

4 Dedicated Inputs, 100 I/O

4

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

100

EP1K30TI144-3

Altera

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

12.5 ns

1728

Yes

2.625 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Registered

2.375 V

.5 mm

85 °C (185 °F)

6 Dedicated Inputs, 102 I/O

6

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

102

220 °C (428 °F)

20 mm

102

EPF10K100BQC208-3

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

14.5 ns

4992

Yes

2.7 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

4992 Logic Elements

e0

140 MHz

147

220 °C (428 °F)

28 mm

147

EP20K400BC652-1XV

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

2.5 ns

16640

Yes

2.625 V

CMOS

496

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

502 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

1.63 mm

45 mm

No

e0

20 s

496

220 °C (428 °F)

45 mm

502

EPF8452GI160-3

Altera

Loadable PLD

Industrial

Pin/Peg

160

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 116 I/O

4

-40 °C (-40 °F)

Perpendicular

S-CPGA-P160

5.34 mm

39.624 mm

No

Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements

39.624 mm

116

EPF8282AVLI84-5

Altera

Loadable PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.6 V

CMOS

3.3

Chip Carrier

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 64 I/O

4

-40 °C (-40 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry

220 °C (428 °F)

29.3116 mm

64

EPF10K200EBI600-2

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

9984 Logic Elements

e0

140 MHz

20 s

470

220 °C (428 °F)

45 mm

470

EPF8636AQC208-2

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

504

Yes

5.25 V

CMOS

136

5

3.3/5,5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 136 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

417 MHz

20 s

132

220 °C (428 °F)

28 mm

136

EP20K600EFC33-3

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

2.92 ns

24320

Yes

1.89 V

CMOS

580

1.8

1.8,1.8/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 588 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

20 s

580

220 °C (428 °F)

33 mm

588

EPF8820AGC192-3

Altera

Loadable PLD

Commercial

Pin/Peg

192

PGA

Square

Ceramic, Metal-Sealed Cofired

672

No

5.25 V

CMOS

152

5

3.3/5,5 V

Grid Array

PGA192M,17X17

Field Programmable Gate Arrays

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 152 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P192

1

5.43 mm

45.15 mm

No

672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

385 MHz

148

220 °C (428 °F)

45.15 mm

152

EPF10K30BM356-4

Altera

Loadable PLD

Military

Ball

356

HLBGA

Square

Plastic/Epoxy

23.8 ns

Yes

5.5 V

CMOS

5

Grid Array, Heat Sink/Slug, Low Profile

Registered

4.5 V

1.27 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

1728 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

60.6 MHz

35 mm

EP20K200EBI356-1

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

263

2.5

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 271 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

263

220 °C (428 °F)

35 mm

271

EPF10K200SPI240-2

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

12 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

EPF8636ALM84-3

Altera

Loadable PLD

Military

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Chip Carrier

Registered

4.5 V

1.27 mm

125 °C (257 °F)

4 Dedicated Inputs, 64 I/O

4

-55 °C (-67 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

29.3116 mm

64

EP20K160EQC208-3V

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 143 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

143

EPF10K50SFC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.3 ns

2880

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EPF10K30RI240-4

Altera

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

0.6 ns

1728

Yes

5.25 V

CMOS

189

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

1728 Logic Elements

e0

62.89 MHz

20 s

189

220 °C (428 °F)

32 mm

189

EPF10K100ERI240-1

Altera

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

9 ns

4992

Yes

2.7 V

CMOS

189

2.5

2.5/3.3,3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

85 °C (185 °F)

189 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e0

189

220 °C (428 °F)

32 mm

189

EPF10K100EFI484-2X

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

85 °C (185 °F)

338 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

338

EP20K60EFC324-2

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

2.41 ns

2560

Yes

1.89 V

CMOS

188

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 196 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e0

160 MHz

20 s

188

220 °C (428 °F)

19 mm

196

EPF10K10ATI100-2

Altera

Loadable PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 66 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

1.27 mm

14 mm

No

e3

14 mm

66

EP20K160ETC144-1N

Altera

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1.55 ns

Yes

1.89 V

CMOS

1.8

Flatpack, Low Profile, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 88 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

160 MHz

20 mm

88

EP20K160ETI144

Altera

Loadable PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Low Profile, Fine Pitch

Macrocell

.5 mm

4 Dedicated Inputs, 84 I/O

4

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

220 °C (428 °F)

20 mm

84

EPF6016QI240-2

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1320

Yes

5.5 V

CMOS

199

5

3.3/5,5 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

4.5 V

.5 mm

4 Dedicated Inputs, 199 I/O

4

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

Also Configurable with 5 V VCC

e0

153 MHz

199

220 °C (428 °F)

32 mm

199

EPF10K30EFI672-3X

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

12.5 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

220 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

220

EPF10K30EFC672-2X

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

9.5 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

70 °C (158 °F)

220 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

220

EP20K160EQC240-1N

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1.55 ns

6400

Yes

1.89 V

CMOS

167

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 175 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

160 MHz

30 s

167

245 °C (473 °F)

32 mm

175

EPF6024AFC256-2

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

219

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 219 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

153 MHz

20 s

219

220 °C (428 °F)

17 mm

219

EPF10K130EBI356-3X

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.