Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EPF8636AGI192-A-3	Altera	Loadable PLD	Industrial	Pin/Peg	192	PGA	Square	Ceramic, Metal-Sealed Cofired	1.8 ns		No	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	-40 °C (-40 °F)		Perpendicular	S-CPGA-P192		5.43 mm	45.15 mm	No	Can also operate at 5 V supply						45.15 mm	136
EP20K100EFC672-2	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1	160 MHz			220 °C (428 °F)	27 mm	246
EP20K400BC652-2X	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	3.1 ns	16640	Yes	2.625 V	CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0		20 s	496	220 °C (428 °F)	45 mm	502
EPF10K100EPC208-1	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	9 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.375 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	147
EPF6024ATC144-3	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		1960	Yes	3.6 V	CMOS	117	3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 117 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Can Also Be Used 24000 Logic Gates	e0	133 MHz	20 s	117	220 °C (428 °F)	20 mm	117
EP20K100EFC144-1	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	1.73 ns	4160	Yes	1.89 V	CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0	160 MHz	20 s	85	235 °C (455 °F)	13 mm	93
EPF8282LI84-3	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		208	Yes	5.5 V	CMOS	68	5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 64 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry	e0			64	220 °C (428 °F)	29.3116 mm	64
EPF10K10AFI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm	150
EPF10K30ARI208-2	Altera	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	13 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	147
EPF10K50EFC672-2	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	10 ns	2880	Yes	2.7 V	CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			254	220 °C (428 °F)	27 mm	254
EP20K1500EPC984-3	Altera	Loadable PLD	Other	Pin/Peg	984	PGA	Square	Ceramic, Metal-Sealed Cofired			No	1.89 V			1.8		Grid Array			Macrocell	1.71 V		85 °C (185 °F)	4 Dedicated Inputs, 858 I/O	4	0 °C (32 °F)		Perpendicular	S-CPGA-P984				No			160 MHz					858
EP20K60EBC356-1XN	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.72 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1	160 MHz				35 mm	196
EP20K400ERC208-1	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes				1.8		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 100 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3				220 °C (428 °F)	28 mm	100
EPF10K50EFI256-2N	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No	2880 Logic Elements	e1	140 MHz				17 mm	191
EP20K100EQI208-2	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy		4160	Yes	2.625 V	CMOS	143	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 151 I/O	4		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			143	220 °C (428 °F)	28 mm	151
EPF10K100EBI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm	191
EP20K200BI672-3	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs, 382 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						382
EPF8282AVTI100-A-4	Altera	Loadable PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	2 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Low Profile, Fine Pitch			Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 78 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100		1.27 mm	14 mm	No	Can also operate at 5 V supply	e3					14 mm	78
EP1K10TI100-2	Altera	Loadable PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	0.5 ns	576	Yes	2.625 V	CMOS	66	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	85 °C (185 °F)	66 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	37.5 MHz	20 s	66	235 °C (455 °F)	14 mm	66
EPF10K70QC304-4	Altera	Loadable PLD	Commercial	Gull Wing	304	FQFP	Square	Plastic/Epoxy	23.8 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No	3744 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	60.6 MHz				40 mm
EPF10K50VQI240-2N	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.4 ns	2880	Yes	3.6 V	CMOS	189	3.3	3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3		30 s	189	245 °C (473 °F)	32 mm	189
EPF10K50VFI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 291 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	291
EPF10K130EFI672-2	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	12 ns	6656	Yes	2.7 V	CMOS	413	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	413 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			413	220 °C (428 °F)	27 mm	413
EP20K160ERC240-3X	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 175 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3	160 MHz			220 °C (428 °F)	32 mm	175
EP20K600CF33C8	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0				220 °C (428 °F)	33 mm	588
EP20K200CFC672-9	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	376
EP20K200EBI652-1	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy		8320	Yes		CMOS	368	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell		1.27 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1			368	220 °C (428 °F)	45 mm	376
EP20K400FI672-1	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy		16640	Yes	2.625 V	CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 502 I/O	4		Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			496	220 °C (428 °F)	27 mm	502
EPF6010ATI100-1	Altera	Loadable PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy		880	Yes	3.6 V	CMOS	71	3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm		4 Dedicated Inputs, 71 I/O	4		Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	Also Configurable with 5 V VCC	e0	172 MHz		71	220 °C (428 °F)	14 mm	71
EPF10K30ABC356-2N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.7 ns		Yes	3.6 V	CMOS		3.3		Grid Array, Low Profile			Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1728 Logic Elements; 216 Labs	e1	80 MHz				35 mm	246
EP20K100QC208-3V	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3.6 ns	4160	Yes	2.625 V	CMOS	153	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 159 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			153	220 °C (428 °F)	28 mm	159
EP20K200QI208-3X	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 144 I/O	4		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3				220 °C (428 °F)	28 mm	144
EPF10K200SBI600-1X	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	9 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1.27 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm	470
EPF8820ABC225-A-4	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	1.9 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	Can also operate at 5 V supply	e1					27 mm	152
EP20K1500EBC652-2	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.13 ns	51840	Yes	1.89 V	CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	5A	3.5 mm	45 mm	No		e0	160 MHz	20 s	480	220 °C (428 °F)	45 mm	488
EP20K100EFC400-1	Altera	Loadable PLD	Other	Ball	400	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3			No		e0				220 °C (428 °F)
EP20K200BC356-1XV	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.5 ns		Yes	2.625 V	CMOS		2.5		Grid Array, Low Profile			Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	277 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1				220 °C (428 °F)	35 mm	277
EP20K1000CF33C9N	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	2.02 ns		Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1		40 s		245 °C (473 °F)	33 mm	708
EPF10K200EGI599-3	Altera	Loadable PLD	Industrial	Pin/Peg	599	IPGA	Square	Ceramic, Metal-Sealed Cofired	16 ns	9984	No	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array, Interstitial Pitch	SPGA599,47X47	Field Programmable Gate Arrays	Mixed	2.3 V	2.54 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No		e0			470	220 °C (428 °F)	62.484 mm	470
EPF10K130EFC672-3X	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	70 °C (158 °F)	413 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	413
EPF10K50BQI240	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes				2.5		Flatpack, Fine Pitch			Mixed		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EPF10K50QC240-5	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	27 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	2880 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	53.76 MHz				32 mm	189
EP20K100EFI484-1	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell				4 Dedicated Inputs, 246 I/O	4		Tin Lead	Bottom	S-PBGA-B484	3			No		e0				220 °C (428 °F)		246
EP20K400FI672-3	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy		16640	Yes	2.625 V	CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 502 I/O	4		Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			496	220 °C (428 °F)	27 mm	502
EPF10K50STC144-3N	Altera	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Low Profile, Fine Pitch			Mixed	2.375 V	.5 mm	70 °C (158 °F)	102 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3					20 mm	102
EPF10K50SBC356-1	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V	CMOS	220	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Mixed	2.375 V	1.27 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	220	220 °C (428 °F)	35 mm	220
EPF10K30EFI672-2	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	9.5 ns	1728	Yes	2.7 V	CMOS	220	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	220 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			220	220 °C (428 °F)	27 mm	220
EPF10K50EQC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.6 ns	2880	Yes	2.7 V	CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	2880 Logic Elements	e0	140 MHz	20 s	189	220 °C (428 °F)	32 mm	189

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.