Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K100EFC256-1N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EP2A15B724C8

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

1.94 ns

16640

Yes

1.575 V

CMOS

480

1.5

1.5,1.5/3.3 V

Grid Array

BGA724,27X27,50

Field Programmable Gate Arrays

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

492 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e0

480

220 °C (428 °F)

35 mm

492

EPF10K50VQI240-1

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

11.2 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EP20K30ERC208

Altera

Loadable PLD

Other

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 128 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

160 MHz

28 mm

128

EPF10K10QI240-4

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

23.8 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

576 Logic elements; Built-in JTAG boundry-scan test circuitry

e3

60.6 MHz

32 mm

EPF8636ARM208-4

Altera

Loadable PLD

Military

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs, 132 I/O

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

132

EPF8452ALC84-5

Altera

Loadable PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

336

Yes

5.25 V

CMOS

68

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

Registered

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 64 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

452 Flip Flops; 336 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

64

220 °C (428 °F)

29.3116 mm

64

EP20K100FI400-1

Altera

Loadable PLD

Ball

400

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs

4

Tin Silver Copper

Bottom

S-PBGA-B400

3

No

e1

220 °C (428 °F)

EPF10K30AQI208-2

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

13 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 147 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EP20K600CB652C9N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

2 mm

45 mm

No

e1

45 mm

488

EPF81188ARI240-4

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1008

Yes

5.5 V

CMOS

184

5

3.3/5,5 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 180 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.2 mm

32 mm

No

1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

357 MHz

180

220 °C (428 °F)

32 mm

180

EP20K100EBC672-1

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

246

EPF81188AGM232-6

Altera

Loadable PLD

Military

Pin/Peg

232

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

2.54 mm

125 °C (257 °F)

4 Dedicated Inputs, 180 I/O

4

-55 °C (-67 °F)

Perpendicular

S-CPGA-P232

5.207 mm

44.7 mm

No

1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

44.7 mm

180

EPF10K30AQC240-3

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

0.9 ns

1728

Yes

3.6 V

CMOS

246

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

1728 Logic Elements; 216 Labs

e0

80 MHz

20 s

246

220 °C (428 °F)

32 mm

189

EPF6016AFI100-1

Altera

Loadable PLD

Ball

100

LBGA

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

81

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

4 Dedicated Inputs, 81 I/O

4

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

172 MHz

81

220 °C (428 °F)

11 mm

81

EPF8282TM100-3

Altera

Loadable PLD

Military

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Low Profile, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs, 74 I/O

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G100

1.27 mm

14 mm

No

282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry

e3

14 mm

74

EP20K1500EFC33-2

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

2.13 ns

51840

Yes

1.89 V

CMOS

800

1.8

1.8,1.8/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 808 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

5A

3.5 mm

33 mm

No

e0

20 s

800

220 °C (428 °F)

33 mm

808

EPF10K40RI240-4

Altera

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

21.1 ns

2304

Yes

5.25 V

CMOS

189

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G240

4.1 mm

32 mm

No

2304 Logic Elements

e0

62.89 MHz

185

220 °C (428 °F)

32 mm

189

EP20K200QI240-3X

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 174 I/O

4

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

220 °C (428 °F)

32 mm

174

EPF8636AGI192-4

Altera

Loadable PLD

Industrial

Pin/Peg

192

PGA

Square

Ceramic, Metal-Sealed Cofired

504

No

5.5 V

CMOS

136

5

3.3/5,5 V

Grid Array

PGA192M,17X17

Field Programmable Gate Arrays

Registered

4.5 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 130 I/O

4

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P192

1

5.43 mm

45.15 mm

No

636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

132

220 °C (428 °F)

45.15 mm

130

EPF10K30EQC208-1

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

20 s

147

220 °C (428 °F)

28 mm

147

EPF8282AVLI84-4

Altera

Loadable PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

208

Yes

3.6 V

CMOS

68

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 68 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

208 Logic Elements

e0

357 MHz

64

220 °C (428 °F)

29.3116 mm

68

EP20K60ERI240-2X

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

2560

Yes

2.625 V

CMOS

143

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 151 I/O

4

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

143

220 °C (428 °F)

32 mm

151

EP2A15B724C8N

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

1.94 ns

Yes

1.575 V

CMOS

1.5

Grid Array

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

492 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e1

40 s

245 °C (473 °F)

35 mm

492

EPF10K200EBI672-2

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

470

EPF8820AQC160-2

Altera

Loadable PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

672

Yes

5.25 V

CMOS

120

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Field Programmable Gate Arrays

Registered

4.75 V

.65 mm

70 °C (158 °F)

4 Dedicated Inputs, 120 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G160

3

4.07 mm

28 mm

No

672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

417 MHz

20 s

116

220 °C (428 °F)

28 mm

120

EPF10K50GC403-5

Altera

Loadable PLD

Commercial

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

27 ns

2880

No

5.25 V

CMOS

310

5

3.3/5,5 V

Grid Array, Interstitial Pitch

SPGA403M,37X37

Field Programmable Gate Arrays

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 310 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P403

1

3.916 mm

49.78 mm

No

2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

57.8 MHz

310

220 °C (428 °F)

49.78 mm

310

EP1K50FI256

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 186 I/O

6

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

186

EP20K60EQC208-3X

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

3.56 ns

Yes

1.89 V

CMOS

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 148 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

160 MHz

220 °C (428 °F)

28 mm

148

EP20K200EBC356-3N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.33 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

271

EP20K60EBC356-3X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

3.56 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 196 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

160 MHz

220 °C (428 °F)

35 mm

196

EPF10K130EBI484-2

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

85 °C (185 °F)

4 Dedicated Inputs, 369 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

369

EP20K100EFC324-3

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

2.2 ns

4160

Yes

1.89 V

CMOS

238

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e0

160 MHz

20 s

238

220 °C (428 °F)

19 mm

246

EP20K300EQC240-1X

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1.68 ns

11520

Yes

1.89 V

CMOS

144

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 152 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

160 MHz

20 s

144

220 °C (428 °F)

32 mm

152

EPF8452QI160-3

Altera

Loadable PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack

Registered

4.5 V

.65 mm

85 °C (185 °F)

4 Dedicated Inputs, 116 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G160

4.07 mm

28 mm

No

Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements

e3

28 mm

116

EP1K50TC144-3

Altera

Loadable PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.5 ns

2880

Yes

2.625 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

102 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

20 s

102

220 °C (428 °F)

20 mm

102

EP20K1500CBI652-7

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

1.4 ns

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

488 I/O

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

488

EP20K300EFC672

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 408 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

220 °C (428 °F)

27 mm

408

EPF10K100ABI600-3

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

17 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 406 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

406

EPF10K100ARI240-2

Altera

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EP1K100FI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

9 ns

4992

Yes

2.625 V

CMOS

333

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 186 I/O

6

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

90 MHz

333

220 °C (428 °F)

17 mm

186

EP20K400ERC208-3

Altera

Loadable PLD

Other

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 100 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

100

EP20K200EQI240-1

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

160

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 168 I/O

4

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

160

220 °C (428 °F)

32 mm

168

EPF8820RC208-3

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

672

Yes

5.25 V

CMOS

152

5

3.3/5,5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 148 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

4.07 mm

28 mm

No

820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

148

220 °C (428 °F)

28 mm

148

EP20K400BC672-2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs, 502 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

502

EPF8820RC160-3

Altera

Loadable PLD

Commercial

Gull Wing

160

HQFP

Square

Plastic/Epoxy

Yes

5.25 V

CMOS

5

Flatpack, Heat Sink/Slug

Registered

4.75 V

.65 mm

70 °C (158 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G160

3.91 mm

28 mm

No

820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

EP20K600EFC672-2XN

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.25 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

160 MHz

40 s

245 °C (473 °F)

27 mm

508

EP20K160ERC240-1X

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

6400

Yes

2.625 V

CMOS

167

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 175 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

160 MHz

167

220 °C (428 °F)

32 mm

175

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.