Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K50SQI240-3X

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

12.5 ns

Yes

2.7 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.3 V

.5 mm

85 °C (185 °F)

189 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EPF10K50VBI356-4N

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

2880

Yes

3.6 V

CMOS

274

3.3

3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 274 I/O

4

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e1

30 s

274

260 °C (500 °F)

35 mm

274

EP20K60ERI240-1X

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

2560

Yes

2.625 V

CMOS

143

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 151 I/O

4

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

143

220 °C (428 °F)

32 mm

151

EPF10K130ERI240-3

Altera

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

16 ns

6656

Yes

2.7 V

CMOS

186

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

85 °C (185 °F)

186 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e0

186

220 °C (428 °F)

32 mm

186

EPF10K50QI240-5

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

2880 Logic elements; Built-in JTAG boundry-scan test circuitry

e3

53.76 MHz

32 mm

189

EPF10K10QI240-5

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

576 Logic elements; Built-in JTAG boundry-scan test circuitry

e3

53.76 MHz

32 mm

EPF10K30ETC144-3N

Altera

Loadable PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Low Profile, Fine Pitch

Mixed

2.375 V

.5 mm

70 °C (158 °F)

102 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

20 mm

102

EP20K100EBC356-1N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.73 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

246

EPF10K50VRI240-2

Altera

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

14 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EPF8820BC225-3

Altera

Loadable PLD

Commercial

Ball

225

BGA

Square

Plastic/Epoxy

672

Yes

5.25 V

CMOS

152

5

3.3/5,5 V

Grid Array

BGA225,15X15

Field Programmable Gate Arrays

Registered

4.75 V

1.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 148 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B225

2.3 mm

27 mm

No

820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

148

220 °C (428 °F)

27 mm

148

EP20K300EQC208

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Fine Pitch

Macrocell

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 118 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

118

EPF8452ALC84-A-3

Altera

Loadable PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

1.8 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 68 I/O

4

0 °C (32 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

Can also operate at 5 V supply

29.3116 mm

68

EPF8820ARC208-4N

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

5.25 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 152 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

152

EP20K30ERI208-3

Altera

Loadable PLD

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

1200

Yes

2.625 V

CMOS

117

2.5

1.8,1.8/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 125 I/O

4

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

117

220 °C (428 °F)

28 mm

125

EP20K1000EFC672-3

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.32 ns

38400

Yes

1.89 V

CMOS

500

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

500

220 °C (428 °F)

27 mm

508

EP20K60EQC208-2

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2.41 ns

2560

Yes

1.89 V

CMOS

140

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 148 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

160 MHz

20 s

140

220 °C (428 °F)

28 mm

148

EP20K600CF1020I-7

Altera

Loadable PLD

Ball

1020

HBGA

Square

Plastic/Epoxy

1.6 ns

24320

Yes

1.89 V

CMOS

580

1.8

1.8,1.8/3.3 V

Grid Array, Heat Sink/Slug

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 588 I/O

4

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

580

220 °C (428 °F)

33 mm

588

EPF10K200SBI356-1X

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

9 ns

Yes

2.7 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EP20K160ERI240-2

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

6400

Yes

2.625 V

CMOS

167

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 175 I/O

4

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

167

220 °C (428 °F)

32 mm

175

EPF10K100EFC256-2XN

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPF81188ARI208-2

Altera

Loadable PLD

Industrial

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

EP2A70F1508C9

Altera

Loadable PLD

Other

Ball

1508

BGA

Square

Plastic/Epoxy

2.87 ns

67200

Yes

1.575 V

CMOS

1048

1.5

1.5,1.5/3.3 V

Grid Array

BGA1508,39X39,40

Field Programmable Gate Arrays

Macrocell

1.425 V

1 mm

85 °C (185 °F)

1060 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1508

3

3.5 mm

40 mm

No

e0

1048

220 °C (428 °F)

40 mm

1060

EPXA1F672C1

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 246 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

220 °C (428 °F)

27 mm

246

EP20K200CBI356-7X

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

1.6 ns

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

271 I/O

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

271

EPF10K100ABC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.8 ns

4992

Yes

3.6 V

CMOS

369

3.3

2.5/3.3,3.3 V

Grid Array

BGA484,22X22,50

Field Programmable Gate Arrays

Mixed

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 369 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

No

e0

369

220 °C (428 °F)

369

EPF10K30AFC256-3N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

1728 Logic Elements; 216 Labs

e1

80 MHz

17 mm

191

EPF10K50QM240-4

Altera

Loadable PLD

Military

Gull Wing

240

FQFP

Square

Plastic/Epoxy

23.8 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs, 189 I/O

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

2880 Logic elements; Built-in JTAG boundry-scan test circuitry

e3

60.6 MHz

32 mm

189

EP20K100QI208-2V

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

3 ns

4160

Yes

2.625 V

CMOS

153

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 159 I/O

4

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

153

220 °C (428 °F)

28 mm

159

EP1K10FC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

576

Yes

2.625 V

CMOS

136

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

136 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

90 MHz

20 s

136

220 °C (428 °F)

17 mm

136

EPF8636AGI192-3

Altera

Loadable PLD

Industrial

Pin/Peg

192

PGA

Square

Ceramic, Metal-Sealed Cofired

504

No

5.5 V

CMOS

136

5

3.3/5,5 V

Grid Array

PGA192M,17X17

Field Programmable Gate Arrays

Registered

4.5 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 136 I/O

4

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P192

1

5.43 mm

45.15 mm

No

504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

385 MHz

132

220 °C (428 °F)

45.15 mm

136

EP20K100ERC208

Altera

Loadable PLD

Other

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 149 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

149

EP20K400EBC652-2N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.83 ns

16640

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e1

30 s

480

245 °C (473 °F)

45 mm

488

EP20K30EFC484-3

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 128 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

160 MHz

23 mm

128

EPF8452LC84-3

Altera

Loadable PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

336

Yes

5.25 V

CMOS

68

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

Registered

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 64 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

452 Flip Flops; 336 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

64

220 °C (428 °F)

29.3116 mm

64

EP20K160EFC484-1X

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

1.55 ns

6400

Yes

1.89 V

CMOS

308

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 316 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

160 MHz

20 s

308

220 °C (428 °F)

23 mm

316

EPF10K100GC504-4

Altera

Loadable PLD

Commercial

Pin/Peg

504

PGA

Square

Ceramic, Metal-Sealed Cofired

23.8 ns

No

5.25 V

CMOS

5

Grid Array

Registered

4.75 V

70 °C (158 °F)

4 Dedicated Inputs, 406 I/O

4

0 °C (32 °F)

Perpendicular

S-CPGA-P504

No

4992 Logic elements Configurable I/O operation with 3.3 V or 5 V

60.6 MHz

406

EPF10K30BC356-4N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

Yes

5.25 V

CMOS

5

Grid Array, Low Profile

Registered

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

1728 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e1

62.89 MHz

35 mm

246

EP20K100FI784-1

Altera

Loadable PLD

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs

4

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EPF10K130VBC600-3

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.7 ns

6656

Yes

3.6 V

CMOS

470

3.3

3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF8820ATC144-2N

Altera

Loadable PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

5.25 V

CMOS

5

Flatpack, Low Profile, Fine Pitch

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 112 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

20 mm

112

EPF10K130VGC599-4

Altera

Loadable PLD

Commercial

Pin/Peg

599

IPGA

Square

Ceramic, Metal-Sealed Cofired

0.9 ns

832

No

3.6 V

CMOS

470

3.3

3.3 V

Grid Array, Interstitial Pitch

SPGA599,47X47

Field Programmable Gate Arrays

Registered

3 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P599

1

5.08 mm

62.484 mm

No

e0

466

220 °C (428 °F)

62.484 mm

470

EPF10K50EBI356-1

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

8.5 ns

2880

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 220 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e0

220

220 °C (428 °F)

35 mm

220

EP20K160ETC144-2

Altera

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1.93 ns

6400

Yes

1.89 V

CMOS

80

1.8

1.8,1.8/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 88 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

160 MHz

20 s

80

220 °C (428 °F)

20 mm

88

EPF81188AGM232-2

Altera

Loadable PLD

Military

Pin/Peg

232

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

2.54 mm

125 °C (257 °F)

4 Dedicated Inputs, 180 I/O

4

-55 °C (-67 °F)

Perpendicular

S-CPGA-P232

5.207 mm

44.7 mm

No

1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

44.7 mm

180

EPF6010ATC144-1

Altera

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

880

Yes

3.6 V

CMOS

102

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.63SQ,20

Field Programmable Gate Arrays

Macrocell

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 102 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Can Also Be Used 10000 Logic Gates

e0

172 MHz

20 s

102

220 °C (428 °F)

20 mm

102

EPF10K50VRI240-1

Altera

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

11.2 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EPF10K10ARI208-1

Altera

Loadable PLD

Industrial

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 134 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

134

EPF6024AQC240-1

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

199

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 199 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

Can Also Be Used 24000 Logic Gates

e0

172 MHz

20 s

199

220 °C (428 °F)

32 mm

199

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.