Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EP20K30EFC144-2N	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	2.69 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144		1.7 mm	13 mm	No		e1	160 MHz				13 mm	93
EPF10K100EQC240-2N	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V	CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	4992 Logic Elements	e3	140 MHz		189		32 mm	189
EP20K400EFC784	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell			85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784				No		e1
EPF10K40QI240-4	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	21.1 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	2304 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	60.6 MHz				32 mm	189
EPF10K250EFI672-3	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy		12160	Yes	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 470 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3			No		e0			470	220 °C (428 °F)		470
EP1K50QI208	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Flatpack, Fine Pitch			Registered	2.375 V	.5 mm	85 °C (185 °F)	6 Dedicated Inputs, 147 I/O	6	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	147
EP20K300EQI240-2X	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.29 ns	11520	Yes	1.89 V	CMOS	144	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm		4 Dedicated Inputs, 152 I/O	4		Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		20 s	144	220 °C (428 °F)	32 mm	152
EPF81188ARI208-4	Altera	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm
EP20K200EFI484-1	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy		8320	Yes		CMOS	368	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Macrocell		1 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1			368	220 °C (428 °F)		376
EP20K160ERC208-1X	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		6400	Yes	2.625 V	CMOS	135	2.5	1.8,1.8/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 143 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3	160 MHz		135	220 °C (428 °F)	28 mm	143
EP20K1000EFC672-3N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.32 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672		3.5 mm	27 mm	No		e1	160 MHz	40 s		245 °C (473 °F)	27 mm	508
EP20K60EFC144-3X	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	3.56 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e1	160 MHz			220 °C (428 °F)	13 mm	93
EP20K160EBC356-2N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.93 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1	160 MHz				35 mm	271
EPF81500AGC280-4	Altera	Loadable PLD	Commercial	Pin/Peg	280	PGA	Square	Ceramic, Metal-Sealed Cofired	1.9 ns	1296	No	3.6 V	CMOS	208	3.3	3.3/5,5 V	Grid Array	PGA280,19X19	Field Programmable Gate Arrays	Registered	3 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P280	1	5.081 mm	49.78 mm	No	Can also operate at 5 V supply	e0	357 MHz		204	220 °C (428 °F)	49.78 mm	208
EPF8282ATC100-A-3	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	1.8 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Low Profile, Fine Pitch			Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 78 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100		1.27 mm	14 mm	No	Can also operate at 5 V supply	e3					14 mm	78
EPF10K100BRC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	12 ns	4992	Yes	2.7 V	CMOS	189	2.5	2.5/3.3,3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			189	220 °C (428 °F)	32 mm	189
EP20K100EFC196	Altera	Loadable PLD	Other	Ball	196	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell		1 mm	85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	2.1 mm	15 mm	No		e1				220 °C (428 °F)	15 mm
EP20K100FI484-1	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 252 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				220 °C (428 °F)	23 mm	252
EPF10K250AGI599-3	Altera	Loadable PLD	Industrial	Pin/Peg	599	IPGA	Square	Ceramic, Metal-Sealed Cofired	20 ns		No	3.6 V	CMOS		3.3		Grid Array, Interstitial Pitch			Registered	3 V	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 470 I/O	4	-40 °C (-40 °F)		Perpendicular	S-CPGA-P599		5.08 mm	62.484 mm	No							62.484 mm	470
EP20K160EQI240-1X	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy		6400	Yes	2.625 V	CMOS	167	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 175 I/O	4		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			167	220 °C (428 °F)	32 mm	175
EP20K600CF672C9	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2 ns	24320	Yes	1.89 V	CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3.5 mm	27 mm	No		e0		20 s	500	220 °C (428 °F)	27 mm	508
EPF10K100EFC484-3X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	70 °C (158 °F)	338 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	338
EPF10K50SFI484-3X	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12.5 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	254
EP2A40F1020C7N	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.55 ns		Yes	1.575 V	CMOS		1.5		Grid Array			Macrocell	1.425 V	1 mm	85 °C (185 °F)	735 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1		40 s		245 °C (473 °F)	33 mm	735
EPF10K50EPI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	13.5 ns		Yes	2.7 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EPF81188AGM232-4	Altera	Loadable PLD	Military	Pin/Peg	232	PGA	Square	Ceramic, Metal-Sealed Cofired			No	5.5 V	CMOS		5		Grid Array			Registered	4.5 V	2.54 mm	125 °C (257 °F)	4 Dedicated Inputs, 180 I/O	4	-55 °C (-67 °F)		Perpendicular	S-CPGA-P232		5.207 mm	44.7 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V						44.7 mm	180
EPF10K30ABC356-3N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.9 ns		Yes	3.6 V	CMOS		3.3		Grid Array, Low Profile			Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1728 Logic Elements; 216 Labs	e1	80 MHz				35 mm	246
EPF81188RI208-2	Altera	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm
EP20K100EBI356-3X	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy			Yes	2.625 V	CMOS		2.5		Grid Array, Low Profile			Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 246 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1				220 °C (428 °F)	35 mm	246
EPF10K130EFC484-2X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V	CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			369	220 °C (428 °F)	23 mm	369
EP20K100BI196-3	Altera	Loadable PLD		Ball	196	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs, 149 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B196				No		e1						149
EPF10K100EFI672-1	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	9 ns	4992	Yes	2.7 V	CMOS	338	2.5	2.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	338 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			338	220 °C (428 °F)	27 mm	338
EP20K400ERC240-3	Altera	Loadable PLD	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes				1.8		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 132 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	132
EP20K200RC240-2N	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	3 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	174
EP20K100EFI144-2X	Altera	Loadable PLD		Ball	144	LBGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V	CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 93 I/O	4		Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0		20 s	85	235 °C (455 °F)	13 mm	93
EP20K300EBC652-2	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.29 ns	11520	Yes	1.89 V	CMOS	400	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0	160 MHz		400	220 °C (428 °F)	45 mm	408
EPF10K30ETC144-3X	Altera	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.6 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Low Profile, Fine Pitch			Mixed	2.375 V	.5 mm	70 °C (158 °F)	102 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3					20 mm	102
EPF10K50SPC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	9.5 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.375 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EP20K100ERC240-1X	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		4160	Yes	2.625 V	CMOS	175	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 183 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3			175	220 °C (428 °F)	32 mm	183
EP20K600CF1020I-9	Altera	Loadable PLD		Ball	1020	HBGA	Square	Plastic/Epoxy		24320	Yes	1.89 V	CMOS	580	1.8	1.8,1.8/3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 588 I/O	4		Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0			580	220 °C (428 °F)	33 mm	588
EP1M120F484C7A	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy		4800	Yes	1.89 V	CMOS	303	1.8	1.5/3.3,1.8 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			303	220 °C (428 °F)	23 mm	303
EPF10K20QI240-4	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	1152 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	60.6 MHz				32 mm	189
EP1K30FI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 171 I/O	6	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1	37.5 MHz				23 mm	171
EPF6016AQI208-2	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy		1320	Yes	3.6 V	CMOS	171	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm		4 Dedicated Inputs, 171 I/O	4		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also Configurable with 5 V VCC	e0	153 MHz		171	220 °C (428 °F)	28 mm	171
EP20K1500EPC984-1	Altera	Loadable PLD	Other	Pin/Peg	984	PGA	Square	Ceramic, Metal-Sealed Cofired			No	1.89 V			1.8		Grid Array			Macrocell	1.71 V		85 °C (185 °F)	4 Dedicated Inputs, 858 I/O	4	0 °C (32 °F)		Perpendicular	S-CPGA-P984				No			160 MHz					858
EPF81188AGM232-3	Altera	Loadable PLD	Military	Pin/Peg	232	PGA	Square	Ceramic, Metal-Sealed Cofired			No	5.5 V	CMOS		5		Grid Array			Registered	4.5 V	2.54 mm	125 °C (257 °F)	4 Dedicated Inputs, 180 I/O	4	-55 °C (-67 °F)		Perpendicular	S-CPGA-P232		5.207 mm	44.7 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V						44.7 mm	180
EP20K400CF672C7N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.48 ns		Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672		3.5 mm	27 mm	No		e1		40 s		245 °C (473 °F)	27 mm	488
EP20K400BI672-3	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs, 502 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						502

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.