Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EP20K300EQC240-2XN	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.29 ns	11520	Yes	1.89 V	CMOS	144	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	160 MHz	30 s	144	245 °C (473 °F)	32 mm	152
EP20K60ERI240-3X	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 151 I/O	4		Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	151
EP20K60ETC144-1	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1.72 ns	2560	Yes	1.89 V	CMOS	84	1.8	1.8,1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 92 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	160 MHz	20 s	84	220 °C (428 °F)	20 mm	92
EPF8820ATC144-3N	Altera	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Flatpack, Low Profile, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 112 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					20 mm	112
EPF10K100ARC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.7 ns	4992	Yes	3.6 V	CMOS	189	3.3	2.5/3.3,3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		20 s	189	220 °C (428 °F)	32 mm	189
EPF6016ATI144-1	Altera	Loadable PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		1320	Yes	3.6 V	CMOS	117	3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm		4 Dedicated Inputs, 117 I/O	4		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Configurable with 5 V VCC	e0	172 MHz		117	220 °C (428 °F)	20 mm	117
EP20K600EFI784	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell				4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EP20K100EQC208-1XN	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.73 ns		Yes	1.89 V	CMOS		1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 151 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm	151
EP1K30FC256	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Registered	2.375 V	1 mm	70 °C (158 °F)	6 Dedicated Inputs, 171 I/O	6	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm	171
EPF81188ARC208-4	Altera	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm
EP20K100EFI484-3	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell				4 Dedicated Inputs, 246 I/O	4		Tin Lead	Bottom	S-PBGA-B484	3			No		e0				220 °C (428 °F)		246
EPF10K130EBC356-2N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V	CMOS		2.5		Grid Array, Low Profile			Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	274
EP20K200EQI208-3	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	128	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 136 I/O	4		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			128	220 °C (428 °F)	28 mm	136
EPF10K200SQC240-1	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	9 ns	9984	Yes	2.7 V	CMOS	182	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	70 °C (158 °F)	182 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			182	220 °C (428 °F)	32 mm	182
EP20K1500EBC652-1	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.84 ns	51840	Yes	1.89 V	CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	5A	3.5 mm	45 mm	No		e0	160 MHz	20 s	480	220 °C (428 °F)	45 mm	488
EPF10K200SFC672-2	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns	9984	Yes	2.625 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			470	220 °C (428 °F)	27 mm	470
EPF10K200SFC484-1	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.3 ns	9984	Yes	2.625 V	CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	369	220 °C (428 °F)	23 mm	369
EP20K200BC356-3X	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	3.6 ns		Yes	2.625 V	CMOS		2.5		Grid Array, Low Profile			Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 277 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1				220 °C (428 °F)	35 mm	277
EP1K30FI256-2N	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V	CMOS	171	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	85 °C (185 °F)	171 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	37.5 MHz	30 s	171	260 °C (500 °F)	17 mm	171
EP2A40F672C7N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.55 ns		Yes	1.575 V	CMOS		1.5		Grid Array			Macrocell	1.425 V	1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1		40 s		245 °C (473 °F)	27 mm	492
EP20K60ETI144-2X	Altera	Loadable PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		2560	Yes	2.625 V	CMOS	84	2.5	1.8,1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 92 I/O	4		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3			84	220 °C (428 °F)	20 mm	92
EP20K60ERI208-2X	Altera	Loadable PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		2560	Yes	2.625 V	CMOS	140	2.5	1.8,1.8/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 148 I/O	4		Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3			140	220 °C (428 °F)	28 mm	148
EP20K160EQC240-2XN	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.93 ns		Yes	1.89 V	CMOS		1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 175 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	160 MHz				32 mm	175
EPF8820AQC208-4N	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm	152
EPF10K30EFC256-3X	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	70 °C (158 °F)	176 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm	176
EPF10K50SFC256-2X	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V	CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0		20 s	191	220 °C (428 °F)	17 mm	191
EP20K200CFC484-9	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	376
EP1M350F780C7N	Altera	Loadable PLD	Other	Ball	780	BGA	Square	Plastic/Epoxy			Yes	1.89 V	CMOS		1.8		Grid Array			Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e1		40 s		245 °C (473 °F)	29 mm	486
EPF10K200EBI600-1	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	10 ns	9984	Yes	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Mixed	2.3 V	1.27 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm	470
EPF10K30AFC484-1N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No	1728 Logic Elements; 216 Labs	e1	80 MHz	40 s		260 °C (500 °F)	23 mm	246
EP20K600CF33C7ES	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V		85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020				No		e1						708
EP20K400ERI240-1	Altera	Loadable PLD		Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes				1.8		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell		.5 mm		4 Dedicated Inputs, 132 I/O	4		Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	132
EP20K100BC356-1V	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.5 ns	4160	Yes	2.625 V	CMOS	246	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1	100 MHz		246	220 °C (428 °F)	35 mm	252
EP1K10TI100-2N	Altera	Loadable PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	0.5 ns	576	Yes	2.625 V	CMOS	66	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	85 °C (185 °F)	66 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	37.5 MHz	30 s	66	260 °C (500 °F)	14 mm	66
EPF6016TC100-2	Altera	Loadable PLD		Gull Wing	100	QFP	Square	Plastic/Epoxy			Yes		CMOS	81	5	5 V	Flatpack	QFP100,.63SQ,20	Field Programmable Gate Arrays			.5 mm					Tin Lead	Quad	S-PQFP-G100	3			No		e0			81	220 °C (428 °F)
EP2A25F672C7N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.69 ns		Yes	1.575 V	CMOS		1.5		Grid Array			Macrocell	1.425 V	1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1		40 s		245 °C (473 °F)	27 mm	492
EPF10K130EBC356-3	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns	6656	Yes	2.625 V	CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm	274
EPF10K70QM240-4	Altera	Loadable PLD	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.5 V	.5 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	3744 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	60.6 MHz				32 mm
EPF8820ARC208-3N	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm	152
EP20K1000CB652C7	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.49 ns	38400	Yes	1.89 V	CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0			480	220 °C (428 °F)	45 mm	488
EPF10K100EFI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V	CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0		20 s	191	220 °C (428 °F)	17 mm	191
EPF10K50SRI240-1X	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	8 ns		Yes	2.7 V	CMOS		2.5		Flatpack, Heat Sink/Slug, Fine Pitch			Mixed	2.3 V	.5 mm	85 °C (185 °F)	189 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EPF8452AGC160-A-2	Altera	Loadable PLD	Commercial	Pin/Peg	160	PGA	Square	Ceramic, Metal-Sealed Cofired	1.7 ns		No	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 120 I/O	4	0 °C (32 °F)		Perpendicular	S-CPGA-P160		5.34 mm	39.624 mm	No	Can also operate at 5 V supply						39.624 mm	120
EP20K160ERC240-3	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		6400	Yes	2.625 V	CMOS	167	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 175 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3	160 MHz		167	220 °C (428 °F)	32 mm	175
EPF10K50SBC356-3N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V	CMOS		2.5		Grid Array, Low Profile			Mixed	2.375 V	1.27 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	220
EP20K100FI400-3	Altera	Loadable PLD		Ball	400	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B400	3			No		e1				220 °C (428 °F)
EPF81188ARM208-6	Altera	Loadable PLD	Military	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.5 V	.5 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm
EP20K100ERI208	Altera	Loadable PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes				1.8		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell		.5 mm		4 Dedicated Inputs, 149 I/O	4		Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3				220 °C (428 °F)	28 mm	149

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.