Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K200SRI240-1

Altera

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

9 ns

9984

Yes

2.7 V

CMOS

182

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

85 °C (185 °F)

182 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e0

182

220 °C (428 °F)

32 mm

182

EPF10K70GI504-5

Altera

Loadable PLD

Industrial

Pin/Peg

504

PGA

Square

Ceramic, Metal-Sealed Cofired

27 ns

No

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

85 °C (185 °F)

4 Dedicated Inputs, 358 I/O

4

-40 °C (-40 °F)

Perpendicular

S-CPGA-P504

No

3744 Logic elements Configurable I/O operation with 3.3 V or 5 V

53.76 MHz

358

EP20K160EBI356-2X

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

6400

Yes

2.625 V

CMOS

263

2.5

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 271 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

263

220 °C (428 °F)

35 mm

271

EPF10K100EQC240-2X

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

189

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

189 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

4992 Logic Elements

e0

140 MHz

189

220 °C (428 °F)

32 mm

189

EPF10K200SBI600-1

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

9 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF8282ATI100-3

Altera

Loadable PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

208

Yes

5.5 V

CMOS

78

5

5 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 78 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

208 Logic Elements

e0

385 MHz

20 s

74

235 °C (455 °F)

14 mm

78

EP20K60EFC144

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 108 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

1.7 mm

13 mm

No

e1

160 MHz

13 mm

108

EPF8452AGI160-A-4

Altera

Loadable PLD

Industrial

Pin/Peg

160

PGA

Square

Ceramic, Metal-Sealed Cofired

1.9 ns

No

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 120 I/O

4

-40 °C (-40 °F)

Perpendicular

S-CPGA-P160

5.34 mm

39.624 mm

No

Can also operate at 5 V supply

39.624 mm

120

EP20K100TC144-3N

Altera

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

3.6 ns

4160

Yes

2.625 V

CMOS

95

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 101 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

30 s

95

260 °C (500 °F)

20 mm

101

EP20K60EBI356-1X

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

2560

Yes

2.625 V

CMOS

188

2.5

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 196 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

188

220 °C (428 °F)

35 mm

196

EPF8452AQM160-4

Altera

Loadable PLD

Military

Gull Wing

160

QFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack

Registered

4.5 V

.65 mm

125 °C (257 °F)

4 Dedicated Inputs, 116 I/O

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G160

4.07 mm

28 mm

No

452 Flip Flops; 336 Logic Elements

e3

28 mm

116

EPF10K30EQI208-2X

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.4 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.375 V

.5 mm

85 °C (185 °F)

147 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EPF10K30EFI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

8 ns

1728

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

220 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

220

220 °C (428 °F)

23 mm

220

EP20K600EFC33-2N

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

2.25 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 588 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

40 s

245 °C (473 °F)

33 mm

588

EPF8282TC100-2

Altera

Loadable PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

208

Yes

5.25 V

CMOS

78

5

3.3/5,5 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 74 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry

e0

74

220 °C (428 °F)

14 mm

74

EP20K100EFC144-2N

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

2.02 ns

4160

Yes

1.89 V

CMOS

85

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA144,12X12,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

1.7 mm

13 mm

No

e1

160 MHz

30 s

85

260 °C (500 °F)

13 mm

93

EPF6024AFC256-1N

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 219 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

172 MHz

17 mm

219

EPF10K100EFC484-2XN

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

338 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

40 s

260 °C (500 °F)

23 mm

338

EP20K60ETC144-2

Altera

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2.41 ns

2560

Yes

1.89 V

CMOS

84

1.8

1.8,1.8/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 92 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

160 MHz

20 s

84

220 °C (428 °F)

20 mm

92

EPF10K50ERC240-1

Altera

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

8.5 ns

2880

Yes

2.7 V

CMOS

189

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

70 °C (158 °F)

189 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e0

189

220 °C (428 °F)

32 mm

189

EP20K100EBC356XES

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

246

EP20K200ERI240-1

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

160

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 168 I/O

4

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

160

220 °C (428 °F)

32 mm

168

EPF8282ALC84-A-3

Altera

Loadable PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

1.8 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 68 I/O

4

0 °C (32 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

Can also operate at 5 V supply

29.3116 mm

68

EPF10K10AFC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.8 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 150 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

1.86 mm

23 mm

No

e1

23 mm

150

EPF10K10BC356-4

Altera

Loadable PLD

Commercial

Ball

356

HLBGA

Square

Plastic/Epoxy

23.8 ns

Yes

5.25 V

CMOS

5

Grid Array, Heat Sink/Slug, Low Profile

Registered

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

576 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

60.6 MHz

35 mm

EP20K1000CF1020C-8

Altera

Loadable PLD

Other

Ball

1020

HBGA

Square

Plastic/Epoxy

38400

Yes

1.89 V

CMOS

700

1.8

1.8,1.8/3.3 V

Grid Array, Heat Sink/Slug

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 708 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

700

220 °C (428 °F)

33 mm

708

EPF10K100BPI208-2

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

12 ns

Yes

CMOS

2.5

Flatpack, Fine Pitch

Mixed

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 147 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EPF10K50EBC256-3

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EP20K100FC672-1

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

220 °C (428 °F)

27 mm

252

EP20K600CF672C7N

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.48 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B672

3.5 mm

27 mm

No

e1

40 s

245 °C (473 °F)

27 mm

508

EPF10K100EBC672-1

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

70 °C (158 °F)

4 Dedicated Inputs, 338 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

338

EPF10K250EGI599-3

Altera

Loadable PLD

Industrial

Pin/Peg

599

HIPGA

Square

Ceramic, Metal-Sealed Cofired

12160

No

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array, Heat Sink/Slug, Interstitial Pitch

SPGA599,47X47

Field Programmable Gate Arrays

Mixed

2.3 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P599

1

5.08 mm

62.484 mm

No

e0

470

220 °C (428 °F)

62.484 mm

470

EPF10K50VBI356-3N

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

2880

Yes

3.6 V

CMOS

274

3.3

3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 274 I/O

4

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e1

30 s

274

260 °C (500 °F)

35 mm

274

EP20K1500CBI652-8

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

488 I/O

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

488

EP20K1500EBC652-3N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.32 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

160 MHz

45 mm

488

EP20K200RC208-3X

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

3.6 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 144 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

144

EP20K200ERC208-2X

Altera

Loadable PLD

Other

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

128

2.5

1.8,1.8/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 136 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

128

220 °C (428 °F)

28 mm

136

EP20K30EFC144

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 108 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

1.7 mm

13 mm

No

e1

160 MHz

13 mm

108

EPF10K100ABC356-2N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

3.6 V

CMOS

274

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e1

30 s

274

260 °C (500 °F)

35 mm

274

EP20K300ERI240-1X

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

11520

Yes

2.625 V

CMOS

144

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 152 I/O

4

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

144

220 °C (428 °F)

32 mm

152

EPF81188AQC208-6

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

5.25 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 144 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3.91 mm

28 mm

No

1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

144

EPF81500RI304-2

Altera

Loadable PLD

Industrial

Gull Wing

304

FQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 204 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G304

4.5 mm

40 mm

No

1500 Flip Flops; 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

40 mm

204

EP20K200CQI240-9

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

168 I/O

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

168

EP20K60EQI208-1

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2560

Yes

2.625 V

CMOS

140

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 148 I/O

4

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

140

220 °C (428 °F)

28 mm

148

EP1M120FI484-6

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 303 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

303

EPF6016AQC208-1

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

171

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 171 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Can Also Be Used 16000 Logic Gates

e0

172 MHz

20 s

171

220 °C (428 °F)

28 mm

171

EP20K100QC208-1X

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2.5 ns

4160

Yes

2.625 V

CMOS

153

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 159 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

153

220 °C (428 °F)

28 mm

159

EPF10K30EFC256-3N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

1728

Yes

2.625 V

CMOS

176

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

176 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

176

17 mm

176

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.