Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EP20K160EQC208	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes				1.8		Flatpack, Fine Pitch			Macrocell		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 141 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3				220 °C (428 °F)	28 mm	141
EP20K1000CF672C9	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.02 ns	38400	Yes	1.89 V	CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0			500	220 °C (428 °F)	27 mm	508
EP20K1000EFC33-2N	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	2.13 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1		40 s		245 °C (473 °F)	33 mm	708
EPF10K30EFC484-1N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		40 s		260 °C (500 °F)	23 mm	220
EP1M120F484C8AN	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V	CMOS		1.8		Grid Array			Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				245 °C (473 °F)	23 mm	303
EP1K30FI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns	1728	Yes	2.625 V	CMOS	171	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 171 I/O	6	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			171	220 °C (428 °F)	17 mm	171
EPF81188RC208-2	Altera	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm
EPF10K100EFI256-3X	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm	191
EPF10K100EBC672-3	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 338 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						338
EPF81500AGC280-3	Altera	Loadable PLD	Commercial	Pin/Peg	280	PGA	Square	Ceramic, Metal-Sealed Cofired	1.8 ns	1296	No	3.6 V	CMOS	208	3.3	3.3/5,5 V	Grid Array	PGA280,19X19	Field Programmable Gate Arrays	Registered	3 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P280	1	5.081 mm	49.78 mm	No	Can also operate at 5 V supply	e0	385 MHz		204	220 °C (428 °F)	49.78 mm	208
EPF8820ABC225-4	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.25 V	CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	Registered	4.75 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	2.3 mm	27 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	357 MHz		148	220 °C (428 °F)	27 mm	152
EP20K400FC672-2X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	3.1 ns	16640	Yes	2.625 V	CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	502 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1			496	220 °C (428 °F)	27 mm	502
EP20K200EQC240-1X	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.58 ns	8320	Yes	1.89 V	CMOS	160	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 168 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		20 s	160	220 °C (428 °F)	32 mm	168
EP20K160EBI356-3	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		6400	Yes	2.625 V	CMOS	263	2.5	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 271 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			263	220 °C (428 °F)	35 mm	271
EPF10K100EFC484-2X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V	CMOS	338	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	338 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			338	220 °C (428 °F)	23 mm	338
EP20K200EBC356-1XN	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.58 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	271
EP20K400EBC652-1N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.57 ns	16640	Yes	1.89 V	CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e1		30 s	480	245 °C (473 °F)	45 mm	488
EPF10K100AFC484-3N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.8 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 369 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	4992 Logic Elements; 624 Labs	e1	80 MHz	40 s		260 °C (500 °F)	23 mm	369
EP1K30QI208-2N	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	37.5 MHz	30 s	147	245 °C (473 °F)	28 mm	147
EP20K100RC240-2X	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		4160	Yes	2.625 V	CMOS	183	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3			183	220 °C (428 °F)	32 mm	189
EP20K60ERI240-1	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy		2560	Yes	2.625 V	CMOS	143	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 151 I/O	4		Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3			143	220 °C (428 °F)	32 mm	151
EPF10K30EFI484-1X	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	8 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	220 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	220
EPF10K100EFI484-1X	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	9 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	338 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	338
EP20K30EFC144-2X	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	2.69 ns	1200	Yes	1.89 V	CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0	160 MHz	20 s	85	235 °C (455 °F)	13 mm	93
EP20K400BI672-1	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs, 502 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						502
EP20K200EBC356-1N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.58 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1					35 mm	271
EP20K600CF1020I-8	Altera	Loadable PLD		Ball	1020	HBGA	Square	Plastic/Epoxy		24320	Yes	1.89 V	CMOS	580	1.8	1.8,1.8/3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 588 I/O	4		Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0			580	220 °C (428 °F)	33 mm	588
EPF10K50VFC484-2N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1		40 s		260 °C (500 °F)	23 mm
EP1K10TC100-1	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	0.4 ns	576	Yes	2.625 V	CMOS	66	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	66 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	90 MHz	20 s	66	235 °C (455 °F)	14 mm	66
EPF8452AQI160-3	Altera	Loadable PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy		336	Yes	5.5 V	CMOS	120	5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	Registered	4.5 V	.65 mm	85 °C (185 °F)	4 Dedicated Inputs, 120 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	336 Logic Elements	e0	385 MHz		116	220 °C (428 °F)	28 mm	120
EP20K200CQI208-7	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V			1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm		136 I/O			Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	136
EPF10K200EFC672-1N	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.4 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No	9984 Logic Elements	e1	140 MHz				27 mm	470
EPF10K70RC240-4	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.7 ns	3744	Yes	5.25 V	CMOS	358	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	3744 Logic Elements	e0	49 MHz	20 s	354	220 °C (428 °F)	32 mm	189
EP20K1500EFC1020-2X	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy		51840	Yes	2.625 V	CMOS	808	2.5	1.8,2.5,3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 808 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0	160 MHz		808	220 °C (428 °F)	33 mm	808
EP20K200EQI208-2X	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	128	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 136 I/O	4		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			128	220 °C (428 °F)	28 mm	136
EP20K1000EFC672-1X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.84 ns	38400	Yes	1.89 V	CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	500	220 °C (428 °F)	27 mm	508
EP20K200EFC784	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell			85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784				No		e1
EP2A40B724I8	Altera	Loadable PLD		Ball	724	HBGA	Square	Plastic/Epoxy	1.7 ns		Yes	1.575 V	CMOS		1.5		Grid Array, Heat Sink/Slug			Macrocell	1.425 V	1.27 mm		536 I/O			Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0				220 °C (428 °F)	35 mm	536
EPF10K30EBI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 220 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						220
EPF10K100BBI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes						Grid Array			Mixed		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm	191
EPF10K50EFC484-3	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.8 ns	2880	Yes	2.7 V	CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	2880 Logic Elements	e0	140 MHz	20 s	254	220 °C (428 °F)	23 mm	254
EP20K200EBI356-3	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	263	2.5	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 271 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			263	220 °C (428 °F)	35 mm	271
EP20K200BC356-3V	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns	8320	Yes	2.625 V	CMOS	271	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 277 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			271	220 °C (428 °F)	35 mm	277
EP20K1000EFC672-3X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.32 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	160 MHz			220 °C (428 °F)	27 mm	508
EP20K160EQC208-2XN	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.93 ns		Yes	1.89 V	CMOS		1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 143 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	160 MHz				28 mm	143
EPF10K50SQI208-2X	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.375 V	.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	147
EPF81500AQC240-3N	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.8 ns	1296	Yes	3.6 V	CMOS	181	3.3	3.3,3.3/5,5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 181 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also operate at 5 V supply	e3		30 s	181	245 °C (473 °F)	32 mm	181
EP20K100EBI356-2X	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V	CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 246 I/O	4		Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			238	220 °C (428 °F)	35 mm	246

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.