Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EP20K300EQC240-2

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

2.29 ns

11520

Yes

1.89 V

CMOS

144

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 152 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

160 MHz

20 s

144

220 °C (428 °F)

32 mm

152

EPF10K200SRI240-2

Altera

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

12 ns

9984

Yes

2.7 V

CMOS

182

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

85 °C (185 °F)

182 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e0

182

220 °C (428 °F)

32 mm

182

EP20K60EFC144-2X

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

2.41 ns

2560

Yes

1.89 V

CMOS

85

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA144,12X12,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.7 mm

13 mm

No

e0

160 MHz

20 s

85

235 °C (455 °F)

13 mm

93

EP20K400CB652C8ES

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

488

EPF10K130EBC600-2N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

424

EPF8452AGI160-4

Altera

Loadable PLD

Industrial

Pin/Peg

160

PGA

Square

Ceramic, Metal-Sealed Cofired

336

No

5.5 V

CMOS

120

5

3.3/5,5 V

Grid Array

PGA160M,15X15

Field Programmable Gate Arrays

Registered

4.5 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 116 I/O

4

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P160

1

5.34 mm

39.624 mm

No

452 Flip Flops; 336 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

116

220 °C (428 °F)

39.624 mm

116

EP20K60EBI356-2X

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

2560

Yes

2.625 V

CMOS

188

2.5

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 196 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

188

220 °C (428 °F)

35 mm

196

EP20K200EFC672-2X

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

368

220 °C (428 °F)

27 mm

376

EPF10K50EQC240-2N

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

0.6 ns

2880

Yes

2.7 V

CMOS

189

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

70 °C (158 °F)

189 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

2880 Logic Elements

e3

140 MHz

189

245 °C (473 °F)

32 mm

189

EPF10K100BPC208-1

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

11 ns

Yes

CMOS

2.5

Flatpack, Fine Pitch

Mixed

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 147 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EP20K200CF672I-7

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

1.6 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 376 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

220 °C (428 °F)

27 mm

376

EP20K100RC208-2V

Altera

Loadable PLD

Other

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

0.4 ns

4160

Yes

2.625 V

CMOS

153

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 159 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

34 MHz

153

220 °C (428 °F)

28 mm

159

EPF8636ARM208-5

Altera

Loadable PLD

Military

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs, 132 I/O

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

132

EPF10K130EFC672-2N

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

413 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

413

EPF10K100BPI240-1

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

11 ns

Yes

CMOS

2.5

Flatpack, Fine Pitch

Mixed

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EPF10K130EBI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

85 °C (185 °F)

4 Dedicated Inputs, 369 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

369

EP20K1000EBC652-2N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.13 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

160 MHz

40 s

245 °C (473 °F)

45 mm

488

EP20K100EBC672-2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

246

EPF10K130EFI672-3X

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

413 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

413

EP20K200EBC356-2N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

263

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e1

30 s

263

260 °C (500 °F)

35 mm

271

EPF10K70GC503-2

Altera

Loadable PLD

Commercial

Pin/Peg

503

IPGA

Square

Ceramic, Metal-Sealed Cofired

17.2 ns

No

5.25 V

CMOS

5

Grid Array, Interstitial Pitch

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 358 I/O

4

0 °C (32 °F)

Perpendicular

S-CPGA-P503

5.077 mm

57.4 mm

No

57.4 mm

358

EPF10K200SRI240-2X

Altera

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

12 ns

Yes

2.7 V

CMOS

2.5

Flatpack, Heat Sink/Slug, Fine Pitch

Mixed

2.3 V

.5 mm

85 °C (185 °F)

182 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

182

EP20K200EFC484-2

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

160 MHz

20 s

368

220 °C (428 °F)

23 mm

376

EP20K600CF672C8

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.78 ns

24320

Yes

1.89 V

CMOS

500

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

500

220 °C (428 °F)

27 mm

508

EP20K60EQI208-3

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2560

Yes

2.625 V

CMOS

140

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 148 I/O

4

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

140

220 °C (428 °F)

28 mm

148

EP20K200QC208-2X

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

138

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 144 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

138

220 °C (428 °F)

28 mm

144

EPF8282ATI100-A-4

Altera

Loadable PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

1.9 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 78 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

1.27 mm

14 mm

No

Can also operate at 5 V supply

e3

14 mm

78

EPF8452AGM160-6

Altera

Loadable PLD

Military

Pin/Peg

160

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

2.54 mm

125 °C (257 °F)

4 Dedicated Inputs, 116 I/O

4

-55 °C (-67 °F)

Perpendicular

S-CPGA-P160

5.34 mm

39.624 mm

No

452 Flip Flops; 336 Logic Elements

39.624 mm

116

EPF8282VTI100-3

Altera

Loadable PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

Yes

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Registered

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 74 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

1.27 mm

14 mm

No

282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry

e3

14 mm

74

EPF8452AQC160-A-2

Altera

Loadable PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

1.7 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Registered

3 V

.65 mm

70 °C (158 °F)

4 Dedicated Inputs, 120 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G160

4.07 mm

28 mm

No

Can also operate at 5 V supply

e3

28 mm

120

EPF8452AQC160-2

Altera

Loadable PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

336

Yes

5.25 V

CMOS

120

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Field Programmable Gate Arrays

Registered

4.75 V

.65 mm

70 °C (158 °F)

4 Dedicated Inputs, 120 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G160

3

4.07 mm

28 mm

No

336 Logic Elements

e0

417 MHz

20 s

116

220 °C (428 °F)

28 mm

120

EP20K200EQC208-3N

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2.33 ns

8320

Yes

1.89 V

CMOS

128

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 136 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

30 s

128

245 °C (473 °F)

28 mm

136

EP20K200CQ240I-9

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

8320

Yes

1.89 V

CMOS

160

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

4 Dedicated Inputs, 168 I/O

4

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

160

220 °C (428 °F)

32 mm

168

EPF10K200SRC240-1X

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

0.3 ns

9984

Yes

2.625 V

CMOS

182

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

182 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

182

220 °C (428 °F)

32 mm

182

EPF10K50VBC356-3

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

2880

Yes

3.6 V

CMOS

274

3.3

3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EP20K200RI208-1X

Altera

Loadable PLD

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

138

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 144 I/O

4

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

138

220 °C (428 °F)

28 mm

144

EPF10K30EFC672-3X

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

12.5 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

70 °C (158 °F)

220 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

220

EP2A40B724C9

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

2.05 ns

38400

Yes

1.575 V

CMOS

524

1.5

1.5,1.5/3.3 V

Grid Array

BGA724,27X27,50

Field Programmable Gate Arrays

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

536 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e0

524

220 °C (428 °F)

35 mm

536

EP2A25F672I8N

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

1.94 ns

Yes

1.575 V

CMOS

1.5

Grid Array

Macrocell

1.425 V

1 mm

492 I/O

Tin/Silver/Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

40 s

245 °C (473 °F)

27 mm

492

EP20K100EQC208-2N

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2.02 ns

Yes

1.89 V

CMOS

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 151 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

28 mm

151

EPF10K200SFI672-2X

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

470

EPF81188AQC240-4

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1008

Yes

5.25 V

CMOS

184

5

3.3/5,5 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 184 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

1008 Logic elements; 126 Labs; Configurable I/O operation with 3.3 V or 5 V

e0

357 MHz

20 s

180

220 °C (428 °F)

32 mm

184

EPF10K30QI208-5

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

1728 Logic elements Configurable I/O operation with 3.3 V or 5 V

e3

53.76 MHz

28 mm

EP20K1500EBC652-3

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.32 ns

51840

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

5A

3.5 mm

45 mm

No

e0

160 MHz

20 s

480

220 °C (428 °F)

45 mm

488

EPF10K100BFI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

11 ns

4992

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

191

220 °C (428 °F)

17 mm

191

EP20K400EFI784-1

Altera

Loadable PLD

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs

4

Tin Lead

Bottom

S-PBGA-B784

3

No

e0

220 °C (428 °F)

EPF10K130EBC600-3

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

6656

Yes

2.625 V

CMOS

424

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

424

220 °C (428 °F)

45 mm

424

EPF6024AQC208-1

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

171

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 171 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Can Also Be Used 24000 Logic Gates

e0

172 MHz

20 s

171

220 °C (428 °F)

28 mm

171

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.