Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EP20K160EQC208-3X

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2.29 ns

Yes

1.89 V

CMOS

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 143 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

160 MHz

220 °C (428 °F)

28 mm

143

EP20K400ERI208-2

Altera

Loadable PLD

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

4 Dedicated Inputs, 100 I/O

4

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

100

EP20K100QC208-3X

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

3.6 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 159 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

159

EP2A70B724C9

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

2.87 ns

67200

Yes

1.575 V

CMOS

524

1.5

1.5,1.5/3.3 V

Grid Array

BGA724,27X27,50

Field Programmable Gate Arrays

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

536 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e0

524

220 °C (428 °F)

35 mm

536

EPF81188AGI232-5

Altera

Loadable PLD

Industrial

Pin/Peg

232

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 180 I/O

4

-40 °C (-40 °F)

Perpendicular

S-CPGA-P232

5.207 mm

44.7 mm

No

1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

44.7 mm

180

EPF10K20BM356-5

Altera

Loadable PLD

Military

Ball

356

HLBGA

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Grid Array, Heat Sink/Slug, Low Profile

Registered

4.5 V

1.27 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

1152 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

53.76 MHz

35 mm

EP20K400BC652

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array, Low Profile

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 502 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

220 °C (428 °F)

45 mm

502

EP20K100ETI144-1

Altera

Loadable PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4160

Yes

2.625 V

CMOS

84

2.5

1.8,1.8/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 92 I/O

4

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

84

220 °C (428 °F)

20 mm

92

EPF10K20LC84-5

Altera

Loadable PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

27 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Registered

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

1152 Logic elements; Built-in JTAG boundry-scan test circuitry

53.76 MHz

29.3116 mm

EPF81188ARM240-2

Altera

Loadable PLD

Military

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs, 180 I/O

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

32 mm

180

EPF10K100AFI484-2

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 369 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

369

EP20K400ERI208-1

Altera

Loadable PLD

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

4 Dedicated Inputs, 100 I/O

4

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

100

EPF10K200SQI240-3X

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.3 V

.5 mm

85 °C (185 °F)

182 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

182

EPF10K50VBC356-1

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

3.6 V

CMOS

310

3.3

3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

310

220 °C (428 °F)

35 mm

274

EP20K200ERI240-2X

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

160

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 168 I/O

4

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

160

220 °C (428 °F)

32 mm

168

EP20K400EBI652-2

Altera

Loadable PLD

Ball

652

BGA

Square

Plastic/Epoxy

1.83 ns

16640

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

4 Dedicated Inputs, 488 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

480

220 °C (428 °F)

45 mm

488

EP20K100RC208-3

Altera

Loadable PLD

Other

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

4160

Yes

2.625 V

CMOS

153

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 159 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e0

153

220 °C (428 °F)

28 mm

159

EPF10K100EQC208-3N

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.7 ns

4992

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

4992 Logic Elements

e3

140 MHz

147

28 mm

147

EP20K60EQC240-1N

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1.72 ns

Yes

1.89 V

CMOS

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 151 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

160 MHz

32 mm

151

EPF81188AGM232-5

Altera

Loadable PLD

Military

Pin/Peg

232

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

2.54 mm

125 °C (257 °F)

4 Dedicated Inputs, 180 I/O

4

-55 °C (-67 °F)

Perpendicular

S-CPGA-P232

5.207 mm

44.7 mm

No

1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

44.7 mm

180

EP20K30EQC208-3X

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

3.98 ns

Yes

1.89 V

CMOS

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 125 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

160 MHz

220 °C (428 °F)

28 mm

125

EP20K1000CF33C8

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

1.79 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 708 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

20 s

220 °C (428 °F)

33 mm

708

EP20K200EQI208-2

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

128

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 136 I/O

4

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

128

220 °C (428 °F)

28 mm

136

EP20K100EFC324-1X

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

1.73 ns

4160

Yes

1.89 V

CMOS

238

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e0

160 MHz

20 s

238

220 °C (428 °F)

19 mm

246

EPF10K100EFC672-1

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

9 ns

4992

Yes

2.7 V

CMOS

338

2.5

2.5/3.3,3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

338 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

338

220 °C (428 °F)

27 mm

338

EP20K100EFI400-3

Altera

Loadable PLD

Ball

400

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs

4

Tin Lead

Bottom

S-PBGA-B400

3

No

e0

220 °C (428 °F)

EP1M350FI780-7A

Altera

Loadable PLD

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array, Heat Sink/Slug

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 486 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B780

3.5 mm

29 mm

No

e1

29 mm

486

EPF10K130EBC672-2

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

70 °C (158 °F)

4 Dedicated Inputs, 413 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

413

EPF10K100EBC356-1XN

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.4 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EP20K60ETC144-2X

Altera

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2.41 ns

2560

Yes

1.89 V

CMOS

84

1.8

1.8,1.8/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 92 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

160 MHz

20 s

84

220 °C (428 °F)

20 mm

92

EPF10K10ATC100-3N

Altera

Loadable PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

0.8 ns

576

Yes

3.6 V

CMOS

66

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 66 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

576 Logic Elements; 72 Labs

e3

80 MHz

30 s

66

260 °C (500 °F)

14 mm

66

EP20K60EBC356

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 204 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

160 MHz

35 mm

204

EPF10K50EFC672-1

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

8.5 ns

2880

Yes

2.7 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

254 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

254

220 °C (428 °F)

27 mm

254

EP20K200CQ240I-8

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

8320

Yes

1.89 V

CMOS

160

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

4 Dedicated Inputs, 168 I/O

4

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

160

220 °C (428 °F)

32 mm

168

EP20K100EQC208-1

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1.73 ns

4160

Yes

1.89 V

CMOS

143

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 151 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

20 s

143

220 °C (428 °F)

28 mm

151

EP20K400EBC652-3X

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.07 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

220 °C (428 °F)

45 mm

488

EP20K100FC324-3N

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

3.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B324

3.5 mm

19 mm

No

e1

40 s

260 °C (500 °F)

19 mm

252

EPF10K130EFC672-3

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.6 ns

6656

Yes

2.625 V

CMOS

413

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

413 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

413

220 °C (428 °F)

27 mm

413

EP1K30TI144-1

Altera

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

8 ns

1728

Yes

2.625 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Registered

2.375 V

.5 mm

85 °C (185 °F)

6 Dedicated Inputs, 102 I/O

6

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

90 MHz

102

220 °C (428 °F)

20 mm

102

EP20K100FI324-2

Altera

Loadable PLD

Ball

324

BGA

Square

Plastic/Epoxy

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array

BGA324(UNSPEC)

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 246 I/O

4

Tin Lead

Bottom

S-PBGA-B324

3

2.1 mm

19 mm

No

e0

246

220 °C (428 °F)

19 mm

246

EP20K30ERI208-1X

Altera

Loadable PLD

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

1200

Yes

2.625 V

CMOS

117

2.5

1.8,1.8/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 125 I/O

4

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

117

220 °C (428 °F)

28 mm

125

EPF10K130EFI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

9 ns

6656

Yes

2.7 V

CMOS

369

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

369 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

369

220 °C (428 °F)

23 mm

369

EPF10K30EFI256-2N

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

85 °C (185 °F)

176 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

17 mm

176

EPF10K200SBC600-2X

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

9984

Yes

2.625 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EP20K600CB652C8

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

1.78 ns

24320

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

1.63 mm

45 mm

No

e0

480

220 °C (428 °F)

45 mm

488

EP1K10TC144-2

Altera

Loadable PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.5 ns

576

Yes

2.625 V

CMOS

92

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

92 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

37.5 MHz

20 s

92

220 °C (428 °F)

20 mm

92

EPF8636AQI208-3

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

504

Yes

5.5 V

CMOS

136

5

3.3/5,5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 136 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

385 MHz

132

220 °C (428 °F)

28 mm

136

EP20K100TI144-2

Altera

Loadable PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4160

Yes

2.625 V

CMOS

95

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 101 I/O

4

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

95

220 °C (428 °F)

20 mm

101

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.