Loadable PLD Programmable Logic Devices (PLD) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EPF8636AGI192-A-4	Altera	Loadable PLD	Industrial	Pin/Peg	192	PGA	Square	Ceramic, Metal-Sealed Cofired	1.9 ns		No	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	-40 °C (-40 °F)		Perpendicular	S-CPGA-P192		5.43 mm	45.15 mm	No	Can also operate at 5 V supply						45.15 mm	136
EP2A40B724C7	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.55 ns	38400	Yes	1.575 V	CMOS	524	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays	Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm	536
EPF10K30ABI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	1.3 ns		Yes	3.6 V			3.3		Grid Array			Mixed	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm	191
EPF10K50VRC240-1N	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.4 ns	2880	Yes	3.6 V	CMOS	189	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3		30 s	189	245 °C (473 °F)	32 mm	189
EP1K50FC484-2	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V	CMOS	249	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	249 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0	37.5 MHz	20 s	249	220 °C (428 °F)	23 mm	249
EPF8282VLM84-4	Altera	Loadable PLD	Military	J Bend	84	QCCJ	Square	Plastic/Epoxy			Yes		CMOS		3.3		Chip Carrier			Registered		1.27 mm	125 °C (257 °F)	4 Dedicated Inputs, 64 I/O	4	-55 °C (-67 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry						29.3116 mm	64
EP20K160EQC240-1XN	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.55 ns		Yes	1.89 V	CMOS		1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 175 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	160 MHz				32 mm	175
EP20K160EQC208-3	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2.29 ns	6400	Yes	1.89 V	CMOS	135	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 143 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	160 MHz	20 s	135	220 °C (428 °F)	28 mm	143
EP1M120F484C7AES	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V	CMOS		1.8		Grid Array			Mixed	1.71 V	1 mm	85 °C (185 °F)	303 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e0					23 mm	303
EPF8452ALC84-3N	Altera	Loadable PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Chip Carrier			Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 68 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	336 Logic Elements	e3					29.3116 mm	68
EP20K200CF484C9	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2 ns	8320	Yes	1.89 V	CMOS	368	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0			368	220 °C (428 °F)	23 mm	376
EPF10K20BC356-4	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.25 V	CMOS		5		Grid Array, Heat Sink/Slug, Low Profile			Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm
EP20K160EFC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 324 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1	160 MHz			220 °C (428 °F)	27 mm	324
EP20K400FI672-2VN	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	3.1 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Macrocell	2.375 V	1 mm		502 I/O			Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1					27 mm	502
EP20K300EBC652-2X	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.29 ns	11520	Yes	1.89 V	CMOS	400	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0	160 MHz		400	220 °C (428 °F)	45 mm	408
EP20K600EFI672-2X	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	2.25 ns	24320	Yes	1.89 V	CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 508 I/O	4		Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0		20 s	500	220 °C (428 °F)	27 mm	508
EPF10K130EBC600-2	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V	CMOS	424	2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Mixed	2.375 V	1.27 mm	70 °C (158 °F)	424 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No		e0			424	220 °C (428 °F)	45 mm	424
EPF10K30EBI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 220 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						220
EPF8820ATC144-4N	Altera	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		672	Yes	5.25 V	CMOS	112	5	3.3,3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 112 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3		30 s	112	260 °C (500 °F)	20 mm	112
EP20K600EFC1020-3	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy	0.5 ns	24320	Yes	2.625 V	CMOS	588	2.5	1.8,2.5,3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0	160 MHz		588	220 °C (428 °F)	33 mm	588
EPF6010ATI100-3	Altera	Loadable PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy		880	Yes	3.6 V	CMOS	71	3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm		4 Dedicated Inputs, 71 I/O	4		Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	Also Configurable with 5 V VCC	e0	133 MHz		71	220 °C (428 °F)	14 mm	71
EP20K1500EFC1020-3X	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	2.625 V	CMOS		2.5		Grid Array, Heat Sink/Slug			Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 808 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1	160 MHz				33 mm	808
EP20K200RI240-3X	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 174 I/O	4		Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	174
EPF8282ALC84-2N	Altera	Loadable PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Chip Carrier			Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 68 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	208 Logic Elements	e3					29.3116 mm	68
EPF10K50EQC208-3N	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.8 ns	2880	Yes	2.7 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	2880 Logic Elements	e3	140 MHz		147		28 mm	147
EP20K30ERI208-2	Altera	Loadable PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		1200	Yes	2.625 V	CMOS	117	2.5	1.8,1.8/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 125 I/O	4		Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3			117	220 °C (428 °F)	28 mm	125
EP20K200EFI672	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell		1 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	376
EPF81500AQI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.8 ns	1296	Yes	3.6 V	CMOS	181	3.3	3.3/5,5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 181 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also operate at 5 V supply	e0			177	220 °C (428 °F)	32 mm	181
EPF10K130EBC600-1X	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.3 ns	6656	Yes	2.625 V	CMOS	424	2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Mixed	2.375 V	1.27 mm	70 °C (158 °F)	424 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No		e0			424	220 °C (428 °F)	45 mm	424
EPF8636AGC192-2	Altera	Loadable PLD	Commercial	Pin/Peg	192	PGA	Square	Ceramic, Metal-Sealed Cofired		504	No	5.25 V	CMOS	136	5	3.3/5,5 V	Grid Array	PGA192M,17X17	Field Programmable Gate Arrays	Registered	4.75 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P192	1	5.43 mm	45.15 mm	No	504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		132	220 °C (428 °F)	45.15 mm	136
EPF10K10TI144-4	Altera	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.6 ns	576	Yes	5.25 V	CMOS	102	5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	294 MHz	20 s	102	220 °C (428 °F)	20 mm	102
EP20K200CBC356-7	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	271 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	271
EPF10K30EFI484-3X	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12.5 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	220 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	220
EPF10K50STC144-1N	Altera	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.3 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Low Profile, Fine Pitch			Mixed	2.375 V	.5 mm	70 °C (158 °F)	102 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3					20 mm	102
EPF8452ATC100-A-4	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	1.9 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Low Profile, Fine Pitch			Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 68 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100		1.27 mm	14 mm	No	Can also operate at 5 V supply	e3					14 mm	68
EP20K400EFC784-1	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B784	3			No		e0				220 °C (428 °F)
EPF10K130EQC240-2X	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V	CMOS	186	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			186	220 °C (428 °F)	32 mm	186
EP20K200ERC208	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes				1.8		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 134 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3				220 °C (428 °F)	28 mm	134
EPF10K250EBC600-2	Altera	Loadable PLD	Commercial	Ball	600	HBGA	Square	Plastic/Epoxy		12160	Yes	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA600,35X35,50	Field Programmable Gate Arrays	Mixed	2.3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm	470
EPF8636ALI84-A-3	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	1.8 ns		Yes	3.6 V	CMOS		3.3		Chip Carrier			Registered	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 68 I/O	4	-40 °C (-40 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	Can also operate at 5 V supply						29.3116 mm	68
EPF10K50SRI240-1	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	8 ns	2880	Yes	2.7 V	CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	85 °C (185 °F)	189 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			189	220 °C (428 °F)	32 mm	189
EPF10K70QC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	19.1 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EP2A25F672C8	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.94 ns	24320	Yes	1.575 V	CMOS	480	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.425 V	1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0		20 s	480	220 °C (428 °F)	27 mm	492
EP20K100QC208-3	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3.6 ns	4160	Yes	2.625 V	CMOS	153	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 159 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		20 s	153	220 °C (428 °F)	28 mm	159
EP1K50QC208	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Flatpack, Fine Pitch			Registered	2.375 V	.5 mm	70 °C (158 °F)	6 Dedicated Inputs, 147 I/O	6	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	147
EP20K600EBC652-1XN	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.57 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	160 MHz				45 mm	488
EPF10K100EBI672-1	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 338 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						338
EPF10K30AQC208-1	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	3.6 V	CMOS	246	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1728 Logic Elements; 216 Labs	e0	80 MHz	20 s	246	220 °C (428 °F)	28 mm	147

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.