Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF81188AGC232-A-3

Altera

Loadable PLD

Commercial

Pin/Peg

232

PGA

Square

Ceramic, Metal-Sealed Cofired

1.8 ns

No

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 184 I/O

4

0 °C (32 °F)

Perpendicular

S-CPGA-P232

5.207 mm

44.7 mm

No

Can also operate at 5 V supply

44.7 mm

184

EP20K1000EFC672-2N

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.13 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B672

3.5 mm

27 mm

No

e1

160 MHz

40 s

245 °C (473 °F)

27 mm

508

EPF8820ARC208-3

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

672

Yes

5.25 V

CMOS

152

5

3.3/5,5 V

Flatpack, Fine Pitch

HQFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 152 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

385 MHz

148

220 °C (428 °F)

28 mm

152

EPF10K30ARI240-2

Altera

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

13 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EP20K100BC672-1

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

252

EP20K200CF672C-7

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.6 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

220 °C (428 °F)

27 mm

376

EP20K100EQC208-2X

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2.02 ns

4160

Yes

1.89 V

CMOS

143

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 151 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

20 s

143

220 °C (428 °F)

28 mm

151

EP20K400ERI208

Altera

Loadable PLD

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

4 Dedicated Inputs, 100 I/O

4

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

100

EPF8636ARM208-3

Altera

Loadable PLD

Military

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs, 132 I/O

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

132

EP20K160EBI356-1

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

6400

Yes

2.625 V

CMOS

263

2.5

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 271 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

263

220 °C (428 °F)

35 mm

271

EPF8282LI84-2

Altera

Loadable PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Chip Carrier

Registered

4.5 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 64 I/O

4

-40 °C (-40 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry

29.3116 mm

64

EP20K100RC240-3X

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

220 °C (428 °F)

32 mm

189

EP20K600EFC1020-3X

Altera

Loadable PLD

Other

Ball

1020

HBGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Heat Sink/Slug

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 588 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

160 MHz

33 mm

588

EP1K10TI100-1

Altera

Loadable PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

576

Yes

2.625 V

CMOS

66

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

Registered

2.375 V

.5 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

e0

90 MHz

66

220 °C (428 °F)

14 mm

EP20K400FC672-2XV

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

3.1 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

502 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

220 °C (428 °F)

27 mm

502

EPF10K100BPI208-1

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

11 ns

Yes

CMOS

2.5

Flatpack, Fine Pitch

Mixed

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 147 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EPF10K70BI560-4

Altera

Loadable PLD

Industrial

Ball

560

BGA

Square

Plastic/Epoxy

23.8 ns

Yes

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B560

No

3744 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

60.6 MHz

EP20K1500CFC1020-8X

Altera

Loadable PLD

Other

Ball

1020

HBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Heat Sink/Slug

Macrocell

1.71 V

1 mm

85 °C (185 °F)

808 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

33 mm

808

EP1M120F484C5N

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array

Mixed

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 303 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

245 °C (473 °F)

23 mm

303

EPF10K130EPI240-1

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

9 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 186 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

186

EP20K200RI240-2V

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

3 ns

8320

Yes

2.625 V

CMOS

168

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 174 I/O

4

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

168

220 °C (428 °F)

32 mm

174

EP20K100EQI240-1

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

4160

Yes

2.625 V

CMOS

175

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 183 I/O

4

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

175

220 °C (428 °F)

32 mm

183

EPF10K100EBC356-3

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EP20K100EBC356-2XN

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.02 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

246

EPF8050MGC560-3

Altera

Loadable PLD

Commercial

Pin/Peg

560

IPGA

Square

Ceramic, Metal-Sealed Cofired

4032

No

5.25 V

CMOS

360

5

5 V

Grid Array, Interstitial Pitch

PGA560,43X43,50

Field Programmable Gate Arrays

Registered

4.75 V

2.54 mm

70 °C (158 °F)

0 Dedicated Inputs, 360 I/O

0

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P560

1

15.75 mm

60.07 mm

No

4 EPF81188 devices with Field programmable Interconnect; 4656 Flip Flops; 4032 Logic elements

e0

360

220 °C (428 °F)

60.07 mm

360

EPF8820RI208-2

Altera

Loadable PLD

Industrial

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 148 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

148

EP20K200EQC208-2N

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1.97 ns

Yes

1.89 V

CMOS

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 136 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

28 mm

136

EPF8452ATI100-2

Altera

Loadable PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

336

Yes

5.5 V

CMOS

68

5

3.3/5,5 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 68 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

336 Logic elements; 42 Labs; Configurable I/O operation with 3.3 V or 5 V

e0

64

220 °C (428 °F)

14 mm

68

EPF10K50EBC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EP20K30EQI208-3

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1200

Yes

2.625 V

CMOS

117

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 125 I/O

4

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

117

220 °C (428 °F)

28 mm

125

EP20K1500CF1020I-9

Altera

Loadable PLD

Ball

1020

HBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Heat Sink/Slug

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 808 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e1

220 °C (428 °F)

33 mm

808

EP20K100EFI324-2N

Altera

Loadable PLD

Ball

324

BGA

Square

Plastic/Epoxy

2.02 ns

4160

Yes

1.89 V

CMOS

238

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 246 I/O

4

Tin/Silver/Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

e1

30 s

238

260 °C (500 °F)

19 mm

246

EP20K200CFC484-8

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

376 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

376

EPF10K30BI356-5

Altera

Loadable PLD

Industrial

Ball

356

HLBGA

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Grid Array, Heat Sink/Slug, Low Profile

Registered

4.5 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

1728 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

53.76 MHz

35 mm

EPF81188AQC240-A-2

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1.7 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Fine Pitch

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 184 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

Can also operate at 5 V supply

e3

32 mm

184

EP2A25F672C8N

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.94 ns

Yes

1.575 V

CMOS

1.5

Grid Array

Macrocell

1.425 V

1 mm

85 °C (185 °F)

492 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

40 s

245 °C (473 °F)

27 mm

492

EPF8452ALC84-4N

Altera

Loadable PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

336

Yes

5.25 V

CMOS

68

5

3.3,3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

Registered

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 68 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

336 Logic Elements

e3

30 s

68

245 °C (473 °F)

29.3116 mm

68

EP1K100FI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

16 ns

4992

Yes

2.625 V

CMOS

333

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 186 I/O

6

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

333

220 °C (428 °F)

17 mm

186

EP20K200QC208-2

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

138

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 144 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

138

220 °C (428 °F)

28 mm

144

EPF10K100EBC356-1N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.4 ns

4992

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e1

274

35 mm

274

EP2A15B724C9

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

2.23 ns

16640

Yes

1.575 V

CMOS

480

1.5

1.5,1.5/3.3 V

Grid Array

BGA724,27X27,50

Field Programmable Gate Arrays

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

492 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e0

480

220 °C (428 °F)

35 mm

492

EPF10K30EFI256-3X

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12.5 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

176 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

176

EPF10K40QM208-4

Altera

Loadable PLD

Military

Gull Wing

208

FQFP

Square

Plastic/Epoxy

23.8 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

2304 Logic elements Configurable I/O operation with 3.3 V or 5 V

e3

60.6 MHz

28 mm

EP20K100QC240-3V

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

3.6 ns

4160

Yes

2.625 V

CMOS

183

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

183

220 °C (428 °F)

32 mm

189

EP20K60ERI208-1X

Altera

Loadable PLD

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

2560

Yes

2.625 V

CMOS

140

2.5

1.8,1.8/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 148 I/O

4

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

140

220 °C (428 °F)

28 mm

148

EP20K60EFC324-2XN

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

2.41 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 196 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e1

160 MHz

245 °C (473 °F)

19 mm

196

EPF10K30ABI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.9 ns

1728

Yes

3.6 V

CMOS

246

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

1728 Logic Elements; 216 Labs

e0

80 MHz

246

220 °C (428 °F)

35 mm

246

EPF10K70GC503-4

Altera

Loadable PLD

Commercial

Pin/Peg

503

IPGA

Square

Ceramic, Metal-Sealed Cofired

0.7 ns

3744

No

5.25 V

CMOS

358

5

3.3/5,5 V

Grid Array, Interstitial Pitch

SPGA503,43X43

Field Programmable Gate Arrays

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 358 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P503

1

5.077 mm

57.4 mm

No

3744 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

49 MHz

358

220 °C (428 °F)

57.4 mm

358

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.