Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EP2A15B724C7	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.69 ns	16640	Yes	1.575 V	CMOS	480	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays	Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			480	220 °C (428 °F)	35 mm	492
EP20K160ETC144-2N	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1.93 ns		Yes	1.89 V	CMOS		1.8		Flatpack, Low Profile, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 88 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	160 MHz				20 mm	88
EP20K160ERI240	Altera	Loadable PLD		Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes				1.8		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell		.5 mm		4 Dedicated Inputs, 173 I/O	4		Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	173
EP20K1500CB652I-8	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1				220 °C (428 °F)	45 mm	488
EPF81188ARC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.25 V	CMOS	184	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 184 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		180	220 °C (428 °F)	32 mm	184
EP1K50FI484	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 249 I/O	6	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	249
EP20K1000EPC984-2	Altera	Loadable PLD	Other	Pin/Peg	984	PGA	Square	Ceramic, Metal-Sealed Cofired			No	1.89 V			1.8		Grid Array			Macrocell	1.71 V		85 °C (185 °F)	4 Dedicated Inputs, 716 I/O	4	0 °C (32 °F)		Perpendicular	S-CPGA-P984				No			160 MHz					716
EP20K200CBC652-7	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm	376
EP20K600EBC652-3X	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.92 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	160 MHz			220 °C (428 °F)	45 mm	488
EP20K200BC484-1	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						382
EPF10K100AQI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	17 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Fine Pitch			Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EPF10K30EFC484-2N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		40 s		260 °C (500 °F)	23 mm	220
EPF10K200SFI672-3X	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	470
EPF10K10LM84-4	Altera	Loadable PLD	Military	J Bend	84	QCCJ	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V	CMOS		5		Chip Carrier			Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	576 Logic elements; Built-in JTAG boundry-scan test circuitry		60.6 MHz				29.3116 mm
EP20K100FC324-1V	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.5 ns	4160	Yes	2.625 V	CMOS	246	2.5	2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	100 MHz		246	220 °C (428 °F)	19 mm	252
EP20K30EFC324-2X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.69 ns	1200	Yes	1.89 V	CMOS	120	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1	160 MHz		120	220 °C (428 °F)	19 mm	128
EPF10K100BRI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	14.5 ns	4992	Yes	2.7 V	CMOS	189	2.5	2.5/3.3,3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	85 °C (185 °F)	189 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			189	220 °C (428 °F)	32 mm	189
EPF6024AFI256-3	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V	CMOS	219	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Macrocell	3 V	1 mm		4 Dedicated Inputs, 219 I/O	4		Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	133 MHz		219	220 °C (428 °F)	17 mm	219
EP20K200EFC672-1X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.58 ns	8320	Yes	1.89 V	CMOS	368	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	368	220 °C (428 °F)	27 mm	376
EP20K300EQC208-3	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 120 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	160 MHz			220 °C (428 °F)	28 mm	120
EPF81500RI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	1500 Flip Flops; 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					32 mm
EP20K1000CF33I8	Altera	Loadable PLD	Industrial	Ball	1020	BGA	Square	Plastic/Epoxy	1.79 ns		Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0				220 °C (428 °F)	33 mm	708
EP20K60EFC324-1X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	1.72 ns	2560	Yes	1.89 V	CMOS	188	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0	160 MHz	20 s	188	220 °C (428 °F)	19 mm	196
EPF81188AQI240-4	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.5 V	CMOS	184	5	3.3/5,5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 184 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1008 Logic elements; 126 Labs; Configurable I/O operation with 3.3 V or 5 V	e0			180	220 °C (428 °F)	32 mm	184
EP20K200BC356-2	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	3 ns	8320	Yes	2.625 V	CMOS	271	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 277 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	271	220 °C (428 °F)	35 mm	277
EP20K1500CFC1020-8	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm	85 °C (185 °F)	808 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1					33 mm	808
EPF81188ARC240-3N	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 184 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					32 mm	184
EPF10K70QM304-5	Altera	Loadable PLD	Military	Gull Wing	304	QFP	Square	Plastic/Epoxy	27 ns		Yes	5.5 V	CMOS		5		Flatpack			Registered	4.5 V		125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G304				No	3744 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	53.76 MHz
EP20K300EQC240-3	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	3.06 ns	11520	Yes	1.89 V	CMOS	144	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	160 MHz	20 s	144	220 °C (428 °F)	32 mm	152
EPF10K50SFI672-2X	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	254
EPF10K50SRI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	12.5 ns	2880	Yes	2.7 V	CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	85 °C (185 °F)	189 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			189	220 °C (428 °F)	32 mm	189
EPF10K10QI208-5	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	27 ns		Yes	5.5 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	576 Logic elements Configurable I/O operation with 3.3 V or 5 V	e3	53.76 MHz				28 mm
EP20K100RC240-3V	Altera	Loadable PLD	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.5 ns	4160	Yes	2.625 V	CMOS	183	2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3			183	220 °C (428 °F)	32 mm	189
EPF10K30EBC484-1	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 220 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						220
EP20K200EFI784-3	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EPF8820ATI144-3	Altera	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		672	Yes	5.5 V	CMOS	112	5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 112 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0			108	220 °C (428 °F)	20 mm	112
EPF8820ABI225-2	Altera	Loadable PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.5 V	CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	672 Logic elements; 84 Labs; Configurable I/O operation with 3.3 V or 5 V	e0			148	220 °C (428 °F)	27 mm	152
EP20K200RC240-3N	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	3.6 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	174
EPF10K200EBC672-3	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						470
EPF10K50SBC356-2X	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V	CMOS	220	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Mixed	2.375 V	1.27 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			220	220 °C (428 °F)	35 mm	220
EPF8820ARC208-2	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		672	Yes	5.25 V	CMOS	152	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		148	220 °C (428 °F)	28 mm	152
EPF10K250EFC672-1	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy		12160	Yes	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3			No		e0			470	220 °C (428 °F)		470
EP20K200CBI356-9	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm		271 I/O			Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	271
EPF6024ABC256-3	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V	CMOS	218	3.3	2.5/3.3,3.3 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays	Macrocell	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 218 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.3 mm	27 mm	No	Can Also Be Used 24000 Logic Gates	e0	133 MHz	20 s	218	220 °C (428 °F)	27 mm	218
EPF10K30QC208-4	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	21.1 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1728 Logic elements Configurable I/O operation with 3.3 V or 5 V	e3	60.6 MHz				28 mm	147
EP20K200CBC356-9	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	271 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	271
EPF10K30AQC240-2N	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.7 ns	1728	Yes	3.6 V	CMOS	189	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements; 216 Labs	e3	80 MHz	30 s	189	245 °C (473 °F)	32 mm	189
EP20K400EQI208	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes				1.8		Flatpack, Fine Pitch			Macrocell		.5 mm		4 Dedicated Inputs, 100 I/O	4		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3				220 °C (428 °F)	28 mm	100

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.