Loadable PLD Programmable Logic Devices (PLD) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EP20K300EQC240XES	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	152
EPF10K130EFC484-1X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.3 ns	6656	Yes	2.625 V	CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			369	220 °C (428 °F)	23 mm	369
EP20K200CFC672-7	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	376
EP20K300EFC672-1XN	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.68 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	160 MHz			245 °C (473 °F)	27 mm	408
EPF10K20QI208-4	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e3	60.6 MHz				28 mm	147
EP20K100EFI144-2XN	Altera	Loadable PLD		Ball	144	LBGA	Square	Plastic/Epoxy	2.02 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 93 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B144		1.7 mm	13 mm	No		e1					13 mm	93
EP20K100ERC240-3	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		4160	Yes	2.625 V	CMOS	175	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 183 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3			175	220 °C (428 °F)	32 mm	183
EPF10K130EQI240-1	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	9 ns	6656	Yes	2.7 V	CMOS	186	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			186	220 °C (428 °F)	32 mm	186
EPF10K100EBI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 338 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						338
EP20K400BC652-2N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	3.1 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1					45 mm	502
EPF8282ALI84-4	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		208	Yes	5.5 V	CMOS	68	5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 64 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry	e0			64	220 °C (428 °F)	29.3116 mm	64
EP20K200CBI356-8	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm		271 I/O			Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	271
EP20K600EFC672-3X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.92 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	160 MHz			220 °C (428 °F)	27 mm	508
EPF10K10QC208-3	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.5 ns	576	Yes	5.25 V	CMOS	134	5	3.3/5,5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 134 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	576 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	71.43 MHz	20 s	134	220 °C (428 °F)	28 mm	134
EPF10K10AQI208-2	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Fine Pitch			Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 134 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	134
EP20K300EBC652-1XN	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.68 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	160 MHz				45 mm	408
EPF8636ALI84-4N	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Chip Carrier			Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 64 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					29.3116 mm	64
EP20K100QC208-2V	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	4160	Yes	2.625 V	CMOS	153	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 159 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	34 MHz		153	220 °C (428 °F)	28 mm	159
EP20K60EBC356-3	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	3.56 ns	2560	Yes	1.89 V	CMOS	188	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0	160 MHz	20 s	188	220 °C (428 °F)	35 mm	196
EPF10K40BM356-4	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V	CMOS		5		Grid Array, Heat Sink/Slug, Low Profile			Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm
EP20K600CF672I8	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	1.78 ns	24320	Yes	1.89 V	CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3.5 mm	27 mm	No		e0		20 s	500	220 °C (428 °F)	27 mm	508
EPF10K100BBC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes						Grid Array			Mixed		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 191 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm	191
EP20K160ERC208-3	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		6400	Yes	2.625 V	CMOS	135	2.5	1.8,1.8/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 143 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3	160 MHz		135	220 °C (428 °F)	28 mm	143
EPF10K50ETC144-1N	Altera	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.5 ns		Yes	2.7 V	CMOS		2.5		Flatpack, Low Profile, Fine Pitch			Mixed	2.3 V	.5 mm	70 °C (158 °F)	102 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	2880 Logic Elements	e3	140 MHz				20 mm	102
EP20K200CQC240-9	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	168 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	168
EP20K400EQC208	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes				1.8		Flatpack, Fine Pitch			Macrocell		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 100 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3				220 °C (428 °F)	28 mm	100
EPF10K200SBC600-1	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.3 ns	9984	Yes	2.625 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Mixed	2.375 V	1.27 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No		e0		20 s	470	220 °C (428 °F)	45 mm	470
EP20K600CF672C8N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	4	3.5 mm	27 mm	No		e1					27 mm	508
EP20K200QI240-2	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	168	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 174 I/O	4		Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			168	220 °C (428 °F)	32 mm	174
EP20K100EFI324-2	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy		4160	Yes		CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	Macrocell		1 mm		4 Dedicated Inputs, 246 I/O	4		Tin Lead	Bottom	S-PBGA-B324	3			No		e0			238	220 °C (428 °F)		246
EPF8636ARI208-5	Altera	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 132 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm	132
EP20K400EBC652-2XN	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.83 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1					45 mm	488
EPF8820ABC225-2	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.25 V	CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	Registered	4.75 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		148	220 °C (428 °F)	27 mm	152
EP20K200RC240-2	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	3 ns	8320	Yes	2.625 V	CMOS	168	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			168	220 °C (428 °F)	32 mm	174
EPF10K30ETC144-3	Altera	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	2.625 V	CMOS	102	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	102 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0		20 s	102	220 °C (428 °F)	20 mm	102
EPF10K40QC240-4	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	21.1 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	2304 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	60.6 MHz				32 mm	189
EP20K100FC484-2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				220 °C (428 °F)	23 mm	252
EP20K100BI196-2	Altera	Loadable PLD		Ball	196	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs, 149 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B196				No		e1						149
EPF10K30QC208-5	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	27 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1728 Logic elements Configurable I/O operation with 3.3 V or 5 V	e3	53.76 MHz				28 mm
EP20K200ERI240-2	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	160	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 168 I/O	4		Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3			160	220 °C (428 °F)	32 mm	168
EP20K100FI196-2	Altera	Loadable PLD		Ball	196	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V	1 mm		4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B196	3	2.1 mm	15 mm	No		e1				220 °C (428 °F)	15 mm
EP20K100QC240	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	189
EP20K600EBC652-2N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.25 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	160 MHz				45 mm	488
EP20K400EBI652-3	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy		16640	Yes		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell		1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1			480	220 °C (428 °F)	45 mm	488
EP20K200ERC208-1X	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	128	2.5	1.8,1.8/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3			128	220 °C (428 °F)	28 mm	136
EPF10K100EQC208-3X	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.7 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.375 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	4992 Logic Elements	e3	140 MHz				28 mm	147
EP20K200CFI672-8X	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm		376 I/O			Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	376
EP20K160EQI208-2	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy		6400	Yes	2.625 V	CMOS	135	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 143 I/O	4		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			135	220 °C (428 °F)	28 mm	143

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.