Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EP20K200CQ208C8

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1.78 ns

8320

Yes

1.89 V

CMOS

128

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 136 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

128

220 °C (428 °F)

28 mm

136

EPF10K30EQC208-2N

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

147

28 mm

147

EPF10K200EGI599-1

Altera

Loadable PLD

Industrial

Pin/Peg

599

IPGA

Square

Ceramic, Metal-Sealed Cofired

10 ns

9984

No

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array, Interstitial Pitch

SPGA599,47X47

Field Programmable Gate Arrays

Mixed

2.3 V

2.54 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P599

1

5.08 mm

62.484 mm

No

e0

470

220 °C (428 °F)

62.484 mm

470

EP20K60EQC208-1XN

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1.72 ns

Yes

1.89 V

CMOS

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 148 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

160 MHz

245 °C (473 °F)

28 mm

148

EPF10K20RC240-3N

Altera

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

0.5 ns

1152

Yes

5.25 V

CMOS

189

5

3.3/5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

1152 Logic Elements

e3

71.43 MHz

30 s

189

245 °C (473 °F)

32 mm

189

EP20K400CB652I-8

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

4 Dedicated Inputs, 488 I/O

4

Tin Lead

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e0

220 °C (428 °F)

45 mm

488

EP20K400FC672-1XN

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

502 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

27 mm

502

EPF10K30EFI484-3

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

12.5 ns

1728

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

220 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

220

220 °C (428 °F)

23 mm

220

EP2A70B724C7

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

2.17 ns

67200

Yes

1.575 V

CMOS

524

1.5

1.5,1.5/3.3 V

Grid Array

BGA724,27X27,50

Field Programmable Gate Arrays

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

536 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e0

524

220 °C (428 °F)

35 mm

536

EP20K200CB356C7N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.48 ns

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.7 mm

35 mm

No

e1

35 mm

271

EPF8636AQC208-3N

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

5.25 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 136 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

136

EP20K200QC240-1V

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

0.3 ns

8320

Yes

2.625 V

CMOS

168

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 174 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

100 MHz

168

220 °C (428 °F)

32 mm

174

EP20K100EFI784-2

Altera

Loadable PLD

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs

4

Tin Lead

Bottom

S-PBGA-B784

3

No

e0

220 °C (428 °F)

EP20K400CF672C9N

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B672

3.5 mm

27 mm

No

e1

40 s

245 °C (473 °F)

27 mm

488

EP20K100EQI208-2X

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

4160

Yes

2.625 V

CMOS

143

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 151 I/O

4

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

143

220 °C (428 °F)

28 mm

151

EPF10K50EFI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

8.5 ns

2880

Yes

2.7 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

254 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

254

220 °C (428 °F)

23 mm

254

EPF10K30EQI208-3X

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

12.5 ns

Yes

2.7 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.3 V

.5 mm

85 °C (185 °F)

147 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EPF81500ARC304-2

Altera

Loadable PLD

Commercial

Gull Wing

304

FQFP

Square

Plastic/Epoxy

1.7 ns

1296

Yes

3.6 V

CMOS

208

3.3

3.3/5,5 V

Flatpack, Fine Pitch

HQFP304,1.7SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 208 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G304

3

4.5 mm

40 mm

No

Can also operate at 5 V supply

e0

417 MHz

204

220 °C (428 °F)

40 mm

208

EPF8282VLI84-4

Altera

Loadable PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

208

Yes

3.6 V

CMOS

68

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 64 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry

e0

64

220 °C (428 °F)

29.3116 mm

64

EPF10K130VGI599-2

Altera

Loadable PLD

Industrial

Pin/Peg

599

IPGA

Square

Ceramic, Metal-Sealed Cofired

15 ns

No

3.6 V

CMOS

3.3

Grid Array, Interstitial Pitch

Registered

3 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Perpendicular

S-CPGA-P599

5.08 mm

62.484 mm

No

62.484 mm

470

EP20K100BC196-3

Altera

Loadable PLD

Other

Ball

196

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs, 149 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

No

e1

149

EP20K100RC208-2X

Altera

Loadable PLD

Other

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

4160

Yes

2.625 V

CMOS

153

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 159 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

153

220 °C (428 °F)

28 mm

159

EPF8452AQI160-6

Altera

Loadable PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack

Registered

4.5 V

.65 mm

85 °C (185 °F)

4 Dedicated Inputs, 116 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G160

4.07 mm

28 mm

No

452 Flip Flops; 336 Logic Elements

e3

28 mm

116

EPF6016ATC144-2N

Altera

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

117

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.63SQ,20

Field Programmable Gate Arrays

Macrocell

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 117 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Can Also Be Used 16000 Logic Gates

e3

153 MHz

117

20 mm

117

EPF10K50GC403-3

Altera

Loadable PLD

Commercial

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

0.6 ns

2880

No

5.25 V

CMOS

310

5

3.3/5,5 V

Grid Array, Interstitial Pitch

SPGA403M,37X37

Field Programmable Gate Arrays

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 310 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P403

1

5.026 mm

49.78 mm

No

2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

66.67 MHz

310

220 °C (428 °F)

49.78 mm

310

EP20K300EQI240-3X

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 152 I/O

4

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

220 °C (428 °F)

32 mm

152

EPF10K130EBC356-3X

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EPF10K200SGC599-3

Altera

Loadable PLD

Commercial

Pin/Peg

599

IPGA

Square

Ceramic, Metal-Sealed Cofired

16 ns

9984

No

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array, Interstitial Pitch

SPGA599,47X47

Field Programmable Gate Arrays

Mixed

2.3 V

2.54 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P599

1

5.08 mm

62.484 mm

No

e0

470

220 °C (428 °F)

62.484 mm

470

EP1K30QI208-3

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

12.5 ns

1728

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

2.375 V

.5 mm

85 °C (185 °F)

6 Dedicated Inputs, 147 I/O

6

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

147

220 °C (428 °F)

28 mm

147

EP20K60ERI240-2

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

2560

Yes

2.625 V

CMOS

143

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 151 I/O

4

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

143

220 °C (428 °F)

32 mm

151

EPF8452GC160-2

Altera

Loadable PLD

Commercial

Pin/Peg

160

PGA

Square

Ceramic, Metal-Sealed Cofired

336

No

5.25 V

CMOS

120

5

3.3/5,5 V

Grid Array

QFP160,1.2SQ

Field Programmable Gate Arrays

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 116 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P160

1

5.34 mm

39.624 mm

No

452 Flip Flops; 336 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

116

220 °C (428 °F)

39.624 mm

116

EP20K200EFI484-2X

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 376 I/O

4

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

20 s

368

220 °C (428 °F)

23 mm

376

EPF8820ARC208-2N

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

5.25 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 152 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

152

EP20K100BI484-2

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs, 252 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

252

EP20K160EQI240-2

Altera

Loadable PLD

Gull Wing

240

FQFP

Square

Plastic/Epoxy

6400

Yes

2.625 V

CMOS

167

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 175 I/O

4

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

167

220 °C (428 °F)

32 mm

175

EP20K200EFC672-3

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.33 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

368

220 °C (428 °F)

27 mm

376

EP20K100QC240-2N

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

3 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

32 mm

189

EP20K100FI324-3

Altera

Loadable PLD

Ball

324

BGA

Square

Plastic/Epoxy

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array

BGA324(UNSPEC)

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 246 I/O

4

Tin Lead

Bottom

S-PBGA-B324

3

2.1 mm

19 mm

No

e0

246

220 °C (428 °F)

19 mm

246

EP2A15F672C7N

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.69 ns

16640

Yes

1.575 V

CMOS

480

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.425 V

1 mm

85 °C (185 °F)

492 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

480

27 mm

492

EP20K100QC240-3

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

3.6 ns

4160

Yes

2.625 V

CMOS

183

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

20 s

183

220 °C (428 °F)

32 mm

189

EPF10K50SFC256-3X

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EP20K200EQC208-1N

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1.58 ns

Yes

1.89 V

CMOS

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 136 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

28 mm

136

EPF10K10QM240-5

Altera

Loadable PLD

Military

Gull Wing

240

FQFP

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

576 Logic elements; Built-in JTAG boundry-scan test circuitry

e3

53.76 MHz

32 mm

EP1K100FI484-2

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

333

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

85 °C (185 °F)

333 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

37.5 MHz

20 s

333

220 °C (428 °F)

23 mm

333

EP20K200EBC652-2X

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

368

220 °C (428 °F)

45 mm

376

EP20K200EFC672-1

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.58 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

368

220 °C (428 °F)

27 mm

376

EPF10K40RI208-4

Altera

Loadable PLD

Industrial

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

21.1 ns

2304

Yes

5.25 V

CMOS

147

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 147 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

4.1 mm

28 mm

No

2304 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

62.89 MHz

147

220 °C (428 °F)

28 mm

147

EPF10K30ABI256

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

189

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.