Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP1K100FC256-3	Intel	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	2.625 V		CMOS	186	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0		186		17 mm		186
EP1K100QC208-1N	Intel	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V		CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	90 MHz	147		28 mm		147
EP1K30TC144-1	Intel	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS	102	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	70 °C (158 °F)	102 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	90 MHz	102		20 mm		102
EPF10K20RC240-3	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.5 ns	1152	Yes	5.25 V		CMOS	189	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1152 Logic Elements	e0	71.43 MHz	189		32 mm		189
EPF10K250ABC600-1	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.5 ns	12160	Yes	3.6 V		CMOS	470	3.3	2.5/3.3,3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No	12160 Logic Elements; 1520 Labs	e0	80 MHz	470	220 °C (428 °F)	45 mm		470
EPF10K30AQI208-3N	Intel	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.9 ns	1728	Yes	3.6 V		CMOS	147	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1728 Logic Elements; 216 Labs	e3	80 MHz	147		28 mm		147
EPF10K30RC240-3	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS	189	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements	e0	66.67 MHz	189		32 mm		189
CY39200V388-125MGC	Cypress Semiconductor	Loadable PLD	Commercial	Ball	388	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.7 V	3072	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA388,26X26,50	Programmable Logic Devices	Yes	Macrocell	2.3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 294 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B388		2.46 mm	35 mm	No	Also operates at 3.3 V nominal supply	e0				35 mm	Yes	294
EP1K100FC484-3N	Intel	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	2.625 V		CMOS	333	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	333 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		333		23 mm		333
EP1K100FI484-2N	Intel	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS	333	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	85 °C (185 °F)	333 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	37.5 MHz	333		23 mm		333
EP1K10FC256-3	Intel	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns	576	Yes	2.625 V		CMOS	136	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	136 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0		136		17 mm		136
EP1K10QC208-3N	Intel	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.7 ns	576	Yes	2.625 V		CMOS	120	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	70 °C (158 °F)	120 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		120		28 mm		120
EP20K100EBC356-2X	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		238		35 mm		246
EP20K100EBC356-3	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V		CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		238		35 mm		246
EP20K100EBC356-3N	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V		CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1		238		35 mm		246
EP20K100EQC240-2X	Intel	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	175	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 183 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		175		32 mm		183
EP20K200EQI240-2X	Intel	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V		CMOS	160	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm		4 Dedicated Inputs, 168 I/O	4		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3		160	220 °C (428 °F)	32 mm		168
EPF10K100EQC240-1N	Intel	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V		CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3		189		32 mm		189
EPF10K100EQI208-2	Intel	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		147		28 mm		147
EPF10K10ATI144-3	Intel	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.8 ns	576	Yes	3.6 V		CMOS	102	3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	576 Logic Elements; 72 Labs	e0	80 MHz	102		20 mm		102
EPF10K20RC208-4N	Intel	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS	147	5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	67.11 MHz	147		28 mm		147
EPF10K40RC208-3	Intel	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	2304	Yes	5.25 V		CMOS	147	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	2304 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	66.67 MHz	147		28 mm		147
EPF10K50RC240-3	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	2880	Yes	5.25 V		CMOS	189	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	2880 Logic Elements	e0	66.67 MHz	189		32 mm		189
EPF8452ALC84-3	Intel	Loadable PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		336	Yes	5.25 V		CMOS	68	5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 68 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	336 Logic Elements	e0	385 MHz	64		29.3116 mm		68
EPF8636AQC160-3N	Intel	Loadable PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		504	Yes	5.25 V		CMOS	118	5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		Registered	4.75 V	.65 mm	70 °C (158 °F)	4 Dedicated Inputs, 118 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	385 MHz	118		28 mm		118
CY39100V256B-83BBC	Cypress Semiconductor	Loadable PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	15 ns		Yes	2.7 V	1536	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 180 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.6 mm	17 mm	No	Also operates at 3.3 V nominal supply	e0				17 mm	Yes	180
EP1K100QC208-1	Intel	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V		CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	90 MHz	147		28 mm		147
EP1K30TC144-3	Intel	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	2.625 V		CMOS	102	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	70 °C (158 °F)	102 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0		102		20 mm		102
EP1K50FC256-1N	Intel	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V		CMOS	186	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	90 MHz	186		17 mm		186
EP1K50FI256-2	Intel	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V		CMOS	186	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	37.5 MHz	186		17 mm		186
EP1K50FI256-2N	Intel	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V		CMOS	186	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	37.5 MHz	186		17 mm		186
EP20K100EQC208-1X	Intel	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.73 ns	4160	Yes	1.89 V		CMOS	143	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 151 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		143		28 mm		151
EP20K100FC324-1	Intel	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.5 ns	4160	Yes	2.625 V		CMOS	246	2.5	2.5,2.5/3.3 V	Grid Array	BGA324(UNSPEC)	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0		246		19 mm		252
EP20K1500EFC33-1X	Intel	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.84 ns	51840	Yes	1.89 V		CMOS	800	1.8	1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 808 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	5A	3.5 mm	33 mm	No		e0		800		33 mm		808
EP20K160EQC208-2X	Intel	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.93 ns	6400	Yes	1.89 V		CMOS	135	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 143 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	160 MHz	135		28 mm		143
EP20K30EFI144-2X	Intel	Loadable PLD		Ball	144	LBGA	Square	Plastic/Epoxy	2.69 ns	1200	Yes	1.89 V		CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 93 I/O	4		Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0		85		13 mm		93
EP20K400BC652-1	Intel	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.5 ns	16640	Yes	2.625 V		CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0		496		45 mm		502
EP20K600EBI652-2X	Intel	Loadable PLD		Ball	652	BGA	Square	Plastic/Epoxy	2.25 ns	24320	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0		480		45 mm		488
EPF10K100ABC356-3	Intel	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.8 ns	4992	Yes	3.6 V		CMOS	274	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		274		35 mm		274
EPF10K100ARC240-1N	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	4992	Yes	3.6 V		CMOS	189	3.3	2.5/3.3,3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3		189		32 mm		189
EPF10K100EQC240-1	Intel	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V		CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		189		32 mm		189
EPF10K100GC503-4	Altera	Loadable PLD	Commercial	Pin/Peg	503	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.7 ns	4992	No	5.25 V		CMOS	406	5	3.3/5,5 V	Grid Array, Interstitial Pitch	SPGA503,43X43	Field Programmable Gate Arrays		Registered	4.75 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 406 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P503	1	5.077 mm	57.4 mm	No	4992 Logic elements Configurable I/O operation with 3.3 V or 5 V	e0	49 MHz	406	220 °C (428 °F)	57.4 mm		406
EPF10K10AQI208-3	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.8 ns	576	Yes	3.6 V		CMOS	150	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 134 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	576 Logic Elements; 72 Labs	e0	80 MHz	150	220 °C (428 °F)	28 mm		134
EPF10K10TC144-3	Intel	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.5 ns	576	Yes	5.25 V		CMOS	102	5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 102 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	333 MHz	102		20 mm		102
EPF10K10TC144-4	Intel	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.6 ns	576	Yes	5.25 V		CMOS	102	5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 102 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	294 MHz	102		20 mm		102
EPF10K130EFC484-1	Intel	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.3 ns	6656	Yes	2.625 V		CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		369		23 mm		369
EPF10K130EQI240-2	Intel	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V		CMOS	186	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		186		32 mm		186
EPF10K130EQI240-2N	Intel	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V		CMOS	186	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3		186		32 mm		186

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.